Director Of R&D And Advanced Packaging
Costa Mesa, Ca, Us
Responsible for the design, development and manufacture of advanced electronic packaging and the conception of advanced memory products. Founding designer of ultra-high density memory modules by pioneering techniques, materials, and processes in semiconductor packaging development. Invented products with memory densities up to 150 GB/cubic inch. Designer and developer of the SATACube, RAMStack, DFC, BGAStack, Raptor, and CuCore technologies. Conduct life expectancy modeling and testing, validation, and verification of all new technologies and processes. Balance development costs, production costs and reliability trade offs to achieve maximum marketability, longest product life cycle, and maximum ROI. Manage the purchase of capital equipment needed for production of new designs, often designing equipment for process needs that had not previously existed. Build and manage resource and capitol budgets for each program with values in excess of $7.5M over 9 years. Manager of cross-functional program teams working to the AS9100 phase release structure. Maintain a close relationship with marketing and sales for identifying and developing next generation products and IP with very high success ratios, and in producing programs based on concepts that are often thought to be very difficult, highly risky, or impossible.· Designed and developed several semiconductor and PCB level technologies and products resulting in over $150M in revenue at 30-85% margin.· Developed many solutions to challenges on existing products, increasing yield, function, and revenue by 30%· 10-15 patents pending or granted.