Jon Won Email & Phone Number

More than 10 years of experience as a wafer fab process engineer Hardware : Applied Materials MXP+ Oxide EtcherDrytek 384T Oxide Etcher, Lam TCP 9600 Metal Etcher, OXFORD Plasmalab 800 Plus Etcher, PlasmaQuest ECR Etcher, PlasmaTherm VLR Etcher, STS Multiplex CCP Si/Oxide Etcher, Tegal 980 Etcher, ULVAC NLD-6000 ICP Oxide EtcherCMOS Process : Good knowledge on Lithography, PECVD, CVD, PVD, CMP ProcessData Analysis : Very familiar with SPC, DOE, JMP SoftwareMetrology Tools : SEM (JEOL), CD-SEM (OPAL, KLA-Tencor), Cross-Sectional SEM (Hitachi), KLA-Tencor Defect Analysis Tool, Tencor Profilometer, Opti-probe, Nanospec, KLA-Tencor Ellipsometry, Four-Point ProbeSurface Analysis : AFM, AES, XPS (ESCA), EDX, XRD, TOF-SIMSPlasma Physics : Sheath Theory, Plasma Transport, Wave PropagationPlasma Diagnostics : Langmuir Probe Technique, Emission SpectroscopyVacuum System : MFC, Vacuum Gauge, Vacuum Pumps, Mass SpectrometryCOO (Cost-of-Ownership) ModelComputer Skill : PC, MacIntosh, VAX, UNS/W : MS WORD, EXCEL, POWERPOINT, OUTLOOK, PROJECT, JMPSpecialties: - deep understaning of plasma etch process for semiconductor, planar lightwave components, and data storage devices- etch process development and sustaining daily production- good knowledge on related process technology such as lithography, PECVD, PVD, CVD, CMP, etc.- good understaning of theoretical aspect of process plasma as well as hardware