Lead a dynamic group of Quality and Process Engineers in Dicing, Wirebond, Mold , Trim and Form, Saw Singulation ,Test & Finish for the following packages, namely: SC/SOT, SSON/SQFN, MEMS & WLCSP.Handles New Product Introduction (NPI) team

- Ultrasonic Wirebond Process Sustaining Engineer for Automotive Packages - Auto Optical Inspection (AOI) support in 3rd Optical Process for all Automotive and Power packages - DPAK/D2PAK/TOLL/PQFN56AUTO/PQFN88- Line sustaining for hold lots verification and disposition in a timely manner for Automotive and Power Packages - DPAK/D2PAK/PQFN56AUTO/PQFN88/TOLL/SOT223/FULL PACK- Support New Production Introduction for Ultrasonic wirebonding process on Automotive and Power Packages.- ATO Onsemi Cebu representative for the Wedge Task Force across all Onsemi Site.- 3rd Optical Inspection and Ultrasonic Wirebond Process PFMEA owner.- Swim Lane Owner (SLO) for Wirebond process on the package transfer of MLP33 from Cebu to Tarlac.- Main auditee for TS1649 and customer audits for Ultrasonic Wirebond process.

 Line support for the following processes and packages: - Ultrasonic Wirebond: Automotive [DPAK/D2PAK] PQFN56Punch/PQFN33Standard - Auto Vision 3rd Optical Inspection – IVI (Innovative Visual Inspection): PQFN66DRMOS/Multi-Phase/PQFN56DCL/SPS55 Activities/responsibilities: - Disposition of hold lots. - Utilization Improvement for Auto Vision Inspection. - Yield and quality improvement. - Creation of vision recipe in IVI machine for new devices in Clip packages. - Recipe Management System Owner for Ultrasonic Wirebond Process [OE7200/OE7100 machineS], Thermosonic Wirebonding Process [KnS machine] and Auto Vision System [IVI Machines]. - Other projects/activities as assigned by supervisor/superior.

Functions and Responsibilities:  Project (EON) coordinator in supporting new device qualification on the following packages; PQFN56 Punch/Clip/Dual Cool, PQFN33 Clip/Dual Cool, PQFN66DRMOS & WLCSP. Provides technical support for the qualification of all Engineering Order Notice (EON) requests from other Fairchild Semiconductor sites and ensures the most efficient processing at manufacturing with the aim of attaining first pass qualification of EON builds where applicable. Establishes action plans with other Fairchild sites and to other internal engineering department for successful qualification of EON builds right at the first submission to Reliability Testing. Conducts a review of manufacturing requirements for a new product or EON builds with the requesting entity through meetings or teleconference. Conducts a review of relevant specifications, such as design rules and proposes changes, as appropriate.  Establishes and publishes metrics designed to measure the effectiveness and efficiency of the EON/qualification programs. Publishes weekly, periodic and quarterly status of EON builds, cycle time performance, revenue generation of new released devices which undergoes EON process, qualification hit rate as well as perfect lunch performance. Review results of EON builds and participates in the formulation of containment and corrective action plans, where necessary. Conducts a review of and documents learning from each EON builds before closure and updates EON process flow procedure where necessary.

Tel.nos:6332-3400534.Functions and Responsibilities:Consultant on all SPC matters; guides and provides advice on appropriate use of statistical tools and process control methods for effective implementation.Follows up on the progress and status of SPC task forces; requires periodic report from Team Leader and Process Engineer with updates on process/machine capability status (Cpk) process changes/improvements, corrective action performance and plans.Generates periodic and quarter reports on Cpk performance and corrective action performance, quarterly customer report consisting of a list of primary parameters under SPC monitor.Conduct SPC audit performed to ensure out-of-control situations are reacted and given appropriate corrective action, that monitoring and plotting time is real time and monitoring schemes/procedures are properly followed.Maintains SPC-Pro database for the plant.Develops solutions to problems which have been clearly defined and have similar precedents available. Problem analysis often involves selecting the best alternative method of process from among several existing alternatives. Commonly participates as a member of a team to solve problems that falls within a limited range of specialty. New Product Introduction (NPI) Engineer

 Project (EON) coordinator in supporting new device qualification on the following packages; TO252 Discrete/Automotive, TO263 Discrete/Automotive, TO220 Discrete/Automotive, TSSOP8. Provides technical support for the qualification of all Engineering Order Notice (EON) requests from other Fairchild Semiconductor sites and ensures the most efficient processing at manufacturing with the aim of attaining first pass qualification of EON builds where applicable. Establishes action plans with other Fairchild sites and to other internal engineering department for successful qualification of EON builds right at the first submission to Reliability Testing. Conducts a review of manufacturing requirements for a new product or EON builds with the requesting entity through meetings or teleconference. Conducts a review of relevant specifications, such as design rules and proposes changes, as appropriate.  Establishes and publishes metrics designed to measure the effectiveness and efficiency of the EON/qualification programs. Publishes weekly, periodic and quarterly status of EON builds, cycle time performance, revenue generation of new released devices which undergoes EON process, qualification hit rate as well as perfect lunch performance. Review results of EON builds and participates in the formulation of containment and corrective action plans, where necessary. Conducts a review of and documents learning from each EON builds before closure and updates EON process flow procedure where necessary.

Functions and Responsibilities: Provides Technical support for set-up of new production line for new Wire-harness design in Automotive programs. Conducts time study for line balancing and support lean manufacturing concepts. Generates Test program for wire harness testing. Conducts review of manufacturing requirements for new programs on Automotive wire harness. Conducts review of relevant specifications and blueprints for new programs and proposes changes when necessary. Responsible in identifying action items and line improvement projects to increase line output and maximize line capacity. Spearheads six sigma projects.

 Acts as QS900 system administrator in preparation for the QS900 Audit. Establishes Document Control system for the plant which is to Centralize all pertinent documents and records. Conducts training on Statistical Process Control e.g. Control Charts, Gauge Repeatability & Reproducibility and Measurement System Analysis.

 Assigned/trained in all back-end processes, e.g. DieBank, Die Fab, Die Attach, Wirebond, Mold, DDD/Singulation, Marking, QA, Final Test, Packaging, Product Development. Performs projects that will increase productivity and quality for the following process/areas, namely; Die Fab (Wafer Cleaning), Die Attach, Aluminum Wirebond, Mold, Trim and Form, Final Test, QA and Product Development.

 Prepares materials and equipments to be used for class experiments and projects. Performs audit on material inventory in the laboratory. Fixes laboratory equipments such as power supply Maintains cleanliness and orderliness of the laboratory. Assist instructors in the day-to-day activities in the laboratory.