Wafer fabrication and post fabrication process engineer for semiconductor manufacturing. Integra manufacturers RF power devices.Main processes include DC auto-probe testing for bipolar and LDMOS wafers, dicing thinned wafers, and sorting singled die to waffle packs. Knowledgeable on semiconductor processing such as basic material sciences, ion implantation, thin film diffusion, chemical and physical vapor deposition, photolithography, dry and wet etching, and wafer thinning.Familiar with processing of capacitors and testing for capacitance and leakage.Work closely with wafer fab manager for failure analyses and experiments.Design of experiments using the Taguchi method, and familiar with statistical process control.Experienced using metrology equipment such as FIB-SEM, and surface and optical profilometers.Work with production assembly to identify processing issues such as die voiding on packages and wire bond peeling issues.Familiar in procurement of capital equipment for upgrading throughput and minimizing process defects.Work with Ph. D colleagues on research and development of high power GaN devices. Familiar with DC testing these products using curve tracers.

Wet process engineer for a circuit board manufacturer.Worked with the senior process engineer for process developments, root cause analyses, and experiments.Processes included plasma etching, electroless plating, electrolytic plating, wet etching, and deburring /planarization.

Plumbing engineer responsible for creating water, gas, and waste plans. Draft preliminary electrical plans that include lighting and power layout. Coordinate with other engineers, architects, and clients to provide a detailed and accurate design.Supervise and train junior engineers.

In charge of receiving shipment and sorting product that will be placed onto the sales floor.

Main sales associate in the showroom floor that can assist with any question regarding sales, or mechanical problems.

A warehouse job in which I packaged, labeled, and shipped items.