Seasoned research scientist/engineer with extensive experience in electrodeposition of metals and alloys, interfacial and polymer technology.• Semiconductora) Copper plating technologies for 22 & 14 nm IC nodes.b) Cobalt plating technology for below 10 nm IC nodes as a proposed novel interconnect metallization.c) Cleaning technologies for post copper Chemical Mechanical Polishing (CMP)• General Metal Finishinga) Electrodeposition of NiCoP alloys and CoP-SiC composite coatings as replacements for hard chrome.• Nano/Micro Fabricationa) Micromechanical chemical & biological sensors• Textile-Fabric Technologya) Textile coating to enhance durability and inhibit “body odor” on fabric.• Skills and Personal Traitsa) Extensive “hand-on” experience in electrochemistry, electrodeposition, chemical analysis, surface analysis, material properties testing, photolithography, dry & wet chemical etching.b) Six sigma trained with extensive experience in Design of Experiments (DOE) and Combinatorial techniques for rapid developmentc) Experience in implementing developments into manufacturing and developing SPC methods.d) Highly motivated, detailed oriented and hard working. Excellent team player who can also work effectively on individual projects.