System Engineering Cross-Functional Lead in charge of multidisciplinary team covering EE, PD, RF, Optics, Antenna, etc.• Shipped products: Nest Cam (Indoor, wired), Hub 2nd Gen, platforms: Qualcomm, AMLogic.• Lead in charge of architecture, vendor selection, cost and overall cross-functional systemintegration in collaboration with PM, EPM and FW. Lead role to help make data drivenarchitecture decisions, resolve system issues, leadership approvals, CM coordination,responsible of overall product development health in all the stages: o Concept: Deep collaboration with PM and multidisciplinary team to meet the specifications/ use case definition, cost/features balance to create the architecture that satisfies ID, PD, Thermals, Reliability, Optics, Electrical performance, thermals, RF and Antenna design. o NPI: Collaboration with EPM on design releases, reviews and schedule of every gate. Ensure every engineering area’s outcomes are as expected at every stage/validation status, coordinate cross-functional efforts in case of issues, FA to improve quality for MP readiness, etc.

• Development of platform and proto stages for Hero 7 White/Silver using Qualcomm • Design, Implementation and Execution from vendor/component selection, architecture definition, schematic, placement and layout.• Work closely with vendors, suppliers, ODM partners, Mechanical and SW teams.• Execute bring-up and verification of the designs at the factory.

• Work on multiple electrical concepts using Ambarella and Intel platforms.• Design reference hardware with ARM and x86 platforms.• Work with vendors, suppliers and ODM partner for part selection, architecture definition, schematic\layout implementation and manufacturing.• Execute the bring-up and verification of the designs at the factory in China.• Work closely with Mechanical and SW teams through all the development process.• Interfaces used: USB, I2C, PCIe, MIPI, I2S, SPI, SDIO, Ethernet, etc.

• Part of the Hardware Concept Team• Design reference hardware for the product teams.• Support in the bring-up and verification, work closely with Mechanical and SW teams.• System integration, component selection, architecture definition,low power design, etc.• Interfaces used: MHL, HDMI, LVDS, USB, I2C, etc.

Google Android OS based HW development.Shipped Products: Droid X and Droid X2 for Verizon Wireless and Droid 4 (Early stages)• Responsible for hardware specifications, circuit design, schematics implementation,layout, board bring up, design verification test of electrical designs.• Factory Support and yield improvement in all the stages of the project.• Specify tests and limits of the phone peripherals for failure prevention in the factory.• Deep collaboration with Software, Mechanical and Factory Teams.• Work with vendors in order to specify design needs.

R&D for Japan Products• Evaluation of new devices and technologies.• Test and verification of the feasibility of new applications into platform.• Design and propose new solutions for future products and cost improvement.

Electrical Design and Development of GSM/UMTS phones for Japan marketShipped Products: M702iG for NTT DoCoMo• Design and development of circuitry related to the Baseband Processor and Graphics Processor Unit.• Test and verification of the designs through all the phases of the product development• Create specifications, unit test plans of the designs and components qualification requirements.• Support of prototype-sample building at the factory both development phase and mass production level.• Implementation of tests for the PCB and FPCB vendors for failure detection. • Coordination and support between the teams based in Japan and USA.