Owned the Strategic and Tactical Quality and Reliability Engineering teams across the Supplier and Customer base, implemented measures to prevent Quality Excursions from reaching customers, negotiated Customer Requirement achieving maximum satisfaction• Exceeded customer support FA metrics, Reports: Interim 5days, Root Cause Final <20    days• Recognized for on-time execution for early delivery of Quality and Reliability deliverables to    JEDEC Stds• Implemented 20% more industry Preventive measures and supplier audits to prevent    excursions from reaching customers; transitioned Supplier, Quality, Reliability, Manufacturing   and customer    requirements to Entropic after acquisition, 3 months ahead of target• Completed remote ISO Quality Auditing training two weeks early: US and Asia to audit a    Singapore Assembly/ test supplier (Production and Customer requirement)• Saved a $1.2M account order by completing FA on SiP failures with 50KPPM failure rate  proving silicon met electrical specifications• Negotiated 20% reduction for Test lab calibration• Recognized for consistent on-time delivery of NPI and Coreteam Q&R requirementsSkills:• Managed Semiconductor Wafer fab processes: TSMC, GF, SMCC, SMIC, UMC • Assembly Packaging for: FCBGA, TQFP, PCBAs. Suppliers: UTAC, StatsChipPac, Amkor, ASEProcesses: PCMs • SPC • FA • FMEA • NPI (New Product Introduction) • DOEs • Manufacturing contracts • Project Management • 8D Root Cause Analysis, Continuous Improvement • PCI 610 standards • QA • Customer Quality Engineering (CQE) • Supplier Quality (SQE) and Scorecards • Q&R (Quality and Reliability) Qualifications • Process Development and ImprovementQuality Tools: •FMEA • CpK • SPC • PPM • PCM • FIT • DfX • FA • 8D • CLCA (Closed Loop Corrective Action); Audits: • ISO 9000 • Reliability Stds • Manufacturing Quality Excursions (NCMR) • Process Modeling, • Project Management, • Strategic Planning • Cross functional Leadership • Semiconductors

Trident Microsystems and NXP Semiconductors – Managed Quality and Product Reliability internal and external customer requirements and transitioned to Trident and NXP Semiconductors. Led APAC manager and engineers in Supplier Engineering; prepared engineering sites to ISO 9001, 16949 certification; managed customer and product Quality and Reliability requirements Asia team; NPI coreteam Quality and Supplier Quality lead; managed Reliability test requirements and BI board build to meet JEDEC Std.Specialties:• IC ASIC and Mixed Signal Wafer Fab (60nm) manufacturing process and NPI (New Product    Introduction) • IC Packaging Assembly Process: FCBGA, PBGA, TQFP, QFN • Final Test process • Lean Manufacturing • 8D Root Cause and Process Improvement with    Corrective Action Validation • IC and package level Failure Analysis (FA) • ISO 9001, TS16949    Lead Auditor • Risk Management • NPI • FMEA    Processes: • PCMs • SPC • FA • FMEA • NPI (New Product Introduction) • DOEs • Manufacturing contracts • Project Management • 8D Root Cause Analysis, Continuous Improvement• PCI 610 standards • QA • Customer Quality Engineering (CQE) • Supplier Quality Engineering    (SQE) and Scorecards • Q&R (Quality and Reliability) Qualifications • Process Development   and ImprovementQuality Tools: • FMEA • CpK • SPC • PPM • PCM • FIT • DfX • FA • 8D • CLCA (Closed Loop   Corrective Action); Audits: • ISO 9000 • Reliability Stds • Manufacturing Quality Excursions   (NCMR) • Process Modeling, • Project Management, • Strategic Planning • Cross functional Leadership • Semiconductors

Director of SQE, FA and CQE – Supplier Management for Wafer Fab (90nm), Wafer Sort, IC Assembly (TQFPs, PBGAs), Test and Failure AnalysisManaged US and APAC managers and engineers in Supplier Chain Management, SQE, Customer Quality and Failure Analysis managing Foundry (90nm), Wafer Sort, Assembly (PBGA, TQFP) Final Test and Failure Analysis suppliers, Customer Quality and Supplier Quality Engineering. • Negotiated a 250% price liquidating Analytical FA and Test Capital Equipment; • Reduced 62% Quality Engineering overhead transitioning to Asia• Saved 40% on FA analysis cost negotiating contracts and cost with FA Lab suppliers in      Taiwan, China and SingaporeSpecialties: • Management SQE/CQE (Supplier Quality Engineering / Customer Quality Engineering) • FA    (Failure Analysis) • VLSI and Mixed Signal Quality and Reliability Qualification requirements  • SPC • Maverick Test Limits • Maverick Quality excursions • NCMR (Non Conformance     Material) • Wafer FAb Process • Wafer sort • Package assembly: TQFPs, QFNs PCBA • PCI     610 standards • Customer Quality Engineering (CQE) • Supplier Quality Engineering (SQE)    and Scorecard Ranking • Q&R (Quality and Reliability) Qualifications • Process Development   and ImprovementQuality Tools: • FMEA • CpK • SPC • PPM • PCM • FIT • DfX • FA • 8D • CLCA (Closed Loop     Corrective Action) Audits: • ISO 9000 • Reliability Stds • Manufacturing Quality Excursions     (NCMR); • Manufacturability: (• Process Modeling, • Project Management, • Strategic    Planning) • Cross functional group leadership

Managed Q&R (Quality and Reliability), audited requirements for $5M PC OEM business accounts that jumped to $15M due to improved performance in Q&R and execution• Most improved supplier – Virtual Quality for the PC OEM customers (HP, Compaq, Dell)    stationed in Austin and performing long term Asia Assignments as required.• Highly recognized for On-time execution while managing PC OEMs (Compaq, Dell, HP,    Gateway, Lenovo) Designs, Development, Manufacturing, Quality and Reliability strategies &    requirements for semiconductor products. • Improved quality performance of PC OEMs and PCBA subcontractors following a newly    developed "Cost of Ownership" model tracking system enhancing product quality and reliability    (Q&R) deliverables while meeting on-time scheduled customer demand and requirements.• Owned Strategic Partnership, Customer Intimacy, New Product qualification requirements and    Product Launch (NPI), including a proactive FMEA processSpecialties:• NPI Management • PCBA manufacturing • Quality Tools training in China • IC and PCBA 8D    Root Cause Analysis • Corrective Action Process Improvement • VLSI Quality and Reliability    Qualification • JEDEC IC Qualification Standards • Lean PCBA Manufacturing • Lean 6    Sigma Quality • Cost of Quality • Negotiation of Contract and Customer Qualification requirements •Wafer Fab Process • Wafer   Sort • Package assembly: TQFPs, QFNs PCBA • PCI 610 standards • Customer Quality   Engineering (CQE) • Supplier Quality Engineering (SQE) and Scorecard Ranking • Q&R (Quality   and Reliability) Qualifications • Process Development and ImprovementQuality Tools: • FMEA • CpK • SPC • PPM • PCM • FIT • DfX • FA • 8D • CLCA (Closed Loop   Corrective Action) Audits • ISO 9000 • Reliability Stds • Manufacturing Quality Excursions   (NCMR) • Manufacturability: • Process Modeling • Project Management • Strategic Planning• Cross Functional group leadership • Yield Improvement

(Consumer PC, Servers & Workstations).Managed Compaq device Semiconductor manufacturing and Reliability company requirements for Tier 1 Semiconductor suppliers (Intel, AMD, Motorola, Atmel, etc) under a structured Compaq 5 Step SDP ProcessEnsured WW business contracts and engineering met global material readiness and assessed manufacturing risk before product launch to ensure customer material demands were met.• Managed device manufacturing and reliability requirements for semiconductor suppliers (Intel,     Motorola, Atmel, other Tier 1) following a structured Compaq 5 Step SDP Process • Saved up to 35% when negotiated silicon and package component cost, price reductions to    support design and customer cost-reduction goals• Saved $$ thousands by managing a self-developed Quality Cost of Ownership to track  Supplier     Quality excursion costs and charging back such expenses.Specialties:• NPI management • IC Wafer Fab and Package Assembly Processes • PCBA manufacturing    Process • IC (Mixed Signal) and PCBA 8D Root Cause Analysis • Corrective Action Process    Improvement • VLSI Quality and Reliability Qualification • JEDEC IC Qualification Standards • Lean PCBA Manufacturing • Lean 6 Sigma Quality • Black Belt Quality • Cost of Quality • Continuous Improvement • Strategic Supplier Negotiation of silicon and packaging cost

Managed ASIC and Mixed Signal device Semiconductor manufacturing and Reliability company requirements for Tier 1 Semiconductor suppliers (Intel, AMD, Motorola, Atmel, TI, Silicon Systems) improving the company product and supplier Qualification ProcessEnsured WW business contracts and engineering met global material readiness and assessed manufacturing risk before product launch to ensure customer material demands were met.• Saved up to 15% when negotiated silicon and package component cost, price reductions to    support design and customer cost-reduction goals• Saved $$ thousands by managing a self-developed Quality Cost of Ownership to track supplier     Quality excursion costs and charging back such expenses to suppliers.• Assessed manufacturing and material availability risks for new developed ICs and system     designsSpecialties: • Wafer FAb Process • Wafer sort • Package assembly: TQFPs, QFNs, Flex Cables • PCBA PCI 610 standards • Customer Quality Engineering (CQE) • Supplier Quality Engineering (SQE) and ranking scorecards • Q&R (Quality and Reliability) Qualifications • Process Development and ImprovementQuality Tools: • FMEA • CpK • SPC • PPM • PCM • FIT • DfX • FA • 8D • CLCA (Closed Loop Corrective Action) Audits: • ISO 9000 • TS 16949 Lead Auditor; • Reliability Stds • Manufacturing Quality Excursions (NCMR); • Manufacturability: ( Process Modeling • Project Management • Strategic Planning) • Cross functional group leadership

(Telecommunications products)Added experience:Developed, built and managed personnel and company manufacturing Quality Processes including inspections, Component Qualifications, Supplier qualifications; Developed PCBA Supplier management procedures - Developed new Audit systems for SMT for mixed technology to IPC-610 B Class 2 - Developed newly tracking systems for Processes and Procedures and semiconductor Failure     Analysis for new and existing products.Specialties:• NPI • PCBA Process development • 8D Root Cause Analysis at PCBA and IC level • SOW (Statement of Work) and SOP (Standard Operating Procedures) for PCBA Assembly • Team Management (5 direct reports)

Added experience:Developed ESS (Environmental Stress Screening) Mission Critical tests and programs for higher MTBF (Mean Time Before Failure) and higher Reliability Winchester Hard Disk Drive products. Audited overseas IC semiconductor suppliers (wafer fab, assembly and test facilities). Single handed transferred Hard drive manufacturing and test to Singapore facility during local holidays, as a Senior Test Engineer.Specialties: • IPC610 • Hard Disk drive manufacturing assembly and functional test • PCBA assembly • SPC • IC Functional Characterization test, Reliability Tests, Hardware Test Lab budgets, ESS (Environmental Stress Screening), HTOL (High Temperature Operating Life)