Member of the Boeing Technical Fellowship at the Associate level. Expertise in the areas of Nonlinear Stress & Multiphysics Analysis. Boeing Designated Expert in Pb-free Solder and Physics of Failure

Building on my previous stress/materials role, I decided to focus more directly on stress analysis of electronic parts. I invested in learning COMSOL Multiphysics as a tool to assess common packaging problems from a thermo-mechanical and sometimes electro-thermo-mechanical failures. In 2013, I moved out of the lab and starting performing stress analysis exclusively.I've increased my sphere of influence beyond electronics into RF devices (loads, circulators, waveguides), propulsion hardware, and some aspects of spacecraft structures. I regularly perform analyses involving a variety of nonlinear phenomena including creep, plasticity, viscoplasticity, viscoelasticity, contact, friction, and damage models via cohesive zone techniques. I also have some experience modeling elasto-hydrodynamic lubrication induced stresses, diffusion modeling, and gas dynamics induced stresses due to outgassing.I'm frequently tasked to develop highly nonlinear models of anomalous conditions and hardware on very schedule-critical timelines.

Adjunct Professor in the Mechanical Engineering department, teaching Advanced Mechanics of Materials

Consulting on life predictions and reliability for electronics and electronic materials.