Process Engineer, 2010-2014 (Kalispell, MT) I developed and performed experiments to improve the BKM (Best Known Method) creating a robust and extendable process for the edge bead removal process. I also qualified the Bevel Etch Inspection metrology. Besides process development, I worked closely with customers to provide solutions to current process problems. Technical Project Leader (Hsinchu, Taiwan 2008-2010)I provided onsite customer support to develop a leading edge Cu post etch cleans process for the 28 nm technology node, and providing training on the Raider tool.Process Engineer, 2004-2008 (Kalispell, MT)I worked with different customers to provide cost effective solutions for single wafer Aluminum post etch cleans using single wafer chemistries. I developed good communication skills allowing me to communicate the process results to a global customer base.