Juan Dominguez Email and Phone Number
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Juan Dominguez is a Advanced Packaging Development Manager - Si Photonics at Intel Corporation. He possess expertise in materials science, semiconductors, technology development, product development, data analysis and 11 more skills.
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Advanced Packaging Development Manager - Si PhotonicsIntel CorporationPhoenix, Az, Us -
Advanced Package Development - Si PhotonicsIntel Corporation Jan 2024 - PresentSanta Clara, California, UsDevelop package process, yield and reliability improvements for 2.5D and 3D technology, advanced solutions. Lead task force teams to understand and improve yields and reliability, using failure analysis and simulation resources.Develop and source packaging architecture, process flow, risk assessment, integration for next generation optical chip interconnects, owning all steps of Si backend integration, test and assembly.
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Senior Principal Packaging EngineerMedtronic Aug 2021 - Feb 2024Minneapolis, Mn, UsDeveloping next generation packaging assembly of medical devices. 1-Equipment and process development owner for assembly module for advanced singulation.2-Integration and Development of backend line flow, automation and layout.3-Pathfinding on new material and processes for future generation devices. -
Package R&D Engineer And Technical Program ManagerIntel Corporation Sep 2015 - Aug 2021Santa Clara, California, Us-Lead NPI of OSAT manufactured packages, from technical sourcing selection, technical cost assessment, project milestones and planning. Interdisciplinary (planning, test, quality) team formation and lead to execute new package introductions qualification and integration to supply chain on time.-Packaging technologies under NPI: flip chip CSP, eWLB, WLCSP, SiP, bumping/wafer manufacturing.-Managed projects for client, data center and automotive applications. Experienced on TS16949, APQP and AEC-100 requirements for automotive packages and manufacturing. -Platform manager for system in package solutions: assess supplier capability and roadmaps, align capabilities to Intel requirements, run technology feasibility or envelope assessments.
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Package Quality And Reliability EngineerIntel Corporation Jul 2011 - Sep 2015Santa Clara, California, Us- Package quality reliability engineer for outsourced manufactured packages (OSAT) and third party IC components. Completed the successful certification of 8+ components.- Technical project manager for the development and assembly of system in package (SiP) solutions. Create SOWs and drove supplier selection. Managed a team of OSAT engineers, collaborated with Intel designers and reliability experts to assess best package options.- Conducted supplier selection and supplier quality assessments for new package technologies, existing IC parts or new materials. Also contributed to SOW, RFQs, RFIs sent to suppliers. - Cross organization expert in Package to Silicon interaction issues for wirebonded, flip chip, QFN and other package technologies for external IC components. Consulted in new projects for part selection and risk assessment, and departmental issues when expertise was required. This resulted in a Department Recognition Award and several monetary and spontaneous recognition awards. - Led reliability and quality taskforces of Intel and supplier employees (10-15 engineer group) to assess risk, find root cause and hypothesis, prove hypothesis and certify final solution.
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Factory Quality And Reliability EngineerIntel Corporation Jul 2008 - Jul 2011Santa Clara, California, Us- Worked on quality and reliability assessments for Cu bumping and far back end processes encompassing three different Intel nodes. - Performed technical risk assessments to disposition discrepant material from Intel Si Fab. Tracked and reported quality metrics to management. Resulted in no material recalls from customer and 100% improvement in documentation of preventative quality event forms in Intel Fab. - Executed thermo-mechanical stress and electrical tests on packaged units to certify 32nm technology C4 process and tools. - Managed excursion resolution of material escaped to customers, with technical risk assessment and proposed reliability or failure analysis.
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Materials EngineerIntel Corporation Jan 2003 - Jul 2008Santa Clara, California, Us- Problem solving and quality system support: leader for the resolution of Fab material (gases, chemicals and metal targets) quality excursions and taskforces for all technologies and Intel sites using data analysis, failure analysis, statistical process control data reviews, FMEA and structured problem solving. - Managed continuous quality improvement projects, supplier material change control, material data statistical review and general supplier business. Performed 20+ plant audits to review quality systems, manufacturing problem issues and technical development. - Initiated and supported $25M+/year in design for cost savings to the Fab through quality control and excursion resolution projects, initiated integration of cost effective alternative suppliers.- Defensive intellectual property creation with 17 patents granted and 10+ pending and consultant for internal/external research direction with Universities under SRC or Intel related projects.
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Research AssistantUniversity Of Michigan, Ann Arbor Jan 1998 - Dec 2002Ann Arbor, Michigan, UsPhD Thesis: Structure property relationship in SnO2 thin films for gas sensors.M.S. Thesis: Microstructure characterization of Cu damascene lines using ESBD and X-ray.
Juan Dominguez Skills
Juan Dominguez Education Details
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University Of MichiganMaterials Science -
Babson F.W. Olin Graduate School Of BusinessBusiness Administration
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University Of California, BerkeleyChemical Engineering
Frequently Asked Questions about Juan Dominguez
What company does Juan Dominguez work for?
Juan Dominguez works for Intel Corporation
What is Juan Dominguez's role at the current company?
Juan Dominguez's current role is Advanced Packaging Development Manager - Si Photonics.
What is Juan Dominguez's email address?
Juan Dominguez's email address is ju****@****tel.com
What schools did Juan Dominguez attend?
Juan Dominguez attended University Of Michigan, Babson F.w. Olin Graduate School Of Business, University Of California, Berkeley.
What skills is Juan Dominguez known for?
Juan Dominguez has skills like Materials Science, Semiconductors, Technology Development, Product Development, Data Analysis, Program Management, Spc, Problem Solving, Engineering, Process Improvement, Fmea, Failure Analysis.
Who are Juan Dominguez's colleagues?
Juan Dominguez's colleagues are Valeria Mesén Barrantes, Eyal Kigel, Blake Harlan, David Henry, Didar Islam, Vikas Thakur, Steven Wu.
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