Jun Chou Email & Phone Number

A. Maintenance the deep development of key accounts of IC package substrates（30%） .1.In charge of the maintenance and the deep development of the old clients like Knowles,Wolfson,Spreadtrum,electronic and Fabless&IDM customer .）via regular biz visit ,organizing promotion activities and other methods. 2.Pursue the new project of Key account ,and Popularize our new products and new solution ,assure the sales is stable and increase. 3.Selected and Make the information of our competitors ,and make measures about it .Support market research including customer survey, data collection and some sales data analysis. B.Develop the new market and new customers (70%) 1.In charge of making and planning the development program ,the report of the target industry,the analysis of the market,and the achivement ,forecast of the sales target ,for the new products （IC substrate,embedded PCB )for the company. 2.Also Responsible for the development and sales of both domestic and international new customers (by b2b web ,exportation,otners'introduction and direct sales)，which mainly in the field of RF Sensor chip （RF-SIM Cards RFID and other Internet of Things,MEMS sensor ，EMBEDDED Sensor， MEMS Gyroscope MEMS accelerometer chip ,Wireless chip ，Smartphone Chip ,Midea Audio Chip,IC power Chip ,IC driver Chips,CMOS Chips and so on . 3.Having a successful maintenance and development successfully 20 related customers, among them, about RF Electronic ,such as Altera,,RFMD, in the field of LTEchips ,such as altair-semi,in the field of RF-SIM,\common ones in the field of MEMS ,such as Sitime,Invensense ,BSE etc. in the field of IC design ,such as IDT,SiTime. 2 customers(Spreadtrum and RDA) in the field of Smartphone. C.Channel sales Responsible for the maintenance and the development of Agent and Distributors.D.Coordinate the inside of the company Confirm the assurance of the delivery of products and payment collect ,deal with the complaints of customers ,improve the satisfaction.

Listed skills include Semiconductor Process, Ic Packaging Substrate Fabrication, Pcb Fabrication, Sip Ic Substrate, and 7 others.