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Current1.MEMS Features Package size: 3*2mm upMin. Core Thickness: 85umMin. line &space: 50/50umEmbedded Capacitor ResistorApplications:Cell phone, Digital Camera, Notebook, Bluetooth Headset2.PBGA Features Package Size: 21*21mm - 35*35mmThickness: 0.36mm-0.58mmBall pitch: 0.8mm, 1.0mm, 1.27mmMin. line &space: 35/35umRoHs compliance materialsLayer count from 2 layers up to HDI 6 layersStructure; single die, multiple die, POP, Embedded Active DieApplications:The package of microprocessor, controllers, ASIC, gate arrays, memory, DSPs, PLSs, communications, networking, graphics and PC chipsetsBenefits:High interconnect capacity,Low packaging profile,High density,Electrical and thermal enhancement3.CSP Features Package Size: 3*3mm up to 19*19mmThickness: 0.10mm-0.36mmBall pitch: 0.8mm, 0.65mm, 0.5mm, 0.4mm, 0.3mmMin. line &space: 30/30umRoHs compliance materialsLayer count from 2 layers up to HDI 6 layersStructure; single die, multiple die, POP, Embedded Active DieApplications:Digital baseband, Power management,Graphic processor,Multimedia controllerBenefits：Small scale and light weight Low inductance, low capacitance and enhanced electrical performance4.SIP Features Package Size: 3*3mm up to 10*12mmCompatible with BGA&LGAThermal enhanced through holes for high efficient heat conductionWire bondable on micro viasImpedance control of critical linesVariety surface finishing for wire bonding, flip chip or mix type connectApplications：PA Module, Transceiver, Blue Tooth Front End Module, GPS, One chip solution with Baseband & RF features
