Sr. Manager, Nand Hardware Engineering
Current
Oct 2019 - Present
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Jun Jin Email & Phone Number
NAND Hardware Engineering at Apple
at
Apple
3 work emails found
@apple.com
LinkedIn matched
✓ Verified May 2026
4 data sources
Profile completeness 100%
Current company
Role
NAND Hardware Engineering at Apple
Location
San Jose, California, United States
Who is Jun Jin? Overview
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Quick answer
Jun Jin is listed as NAND Hardware Engineering at Apple at Apple, based in San Jose, California, United States. AeroLeads shows a work email signal at apple.com and a matched LinkedIn profile for Jun Jin.
Jun Jin previously worked as Sr. Manager, NAND Hardware Engineering at Apple and NAND Hardware Engineering at Apple. Jun Jin holds Engineering Management from Santa Clara University.
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Email format at Apple
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{first}.{last}@apple.com
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AeroLeads found 3 current-domain work email signals for Jun Jin. Compare company email patterns before reaching out.
Profile bio
About Jun Jin
A detail-oriented Product and Operation engineer/manager with strong record of managing New Product Introduction process. Proven ability in leading cross-functional team from concept through product launch with close attention to operational efficiency. Strong product knowledge on developing NOR/NAND flash memory, solid knowledge of NAND flash memory based storage system (eMMC, UFS, SSD), HF and UHF RFID, flexible display driver, NFC and sensor, Micro-Controller Unit. Highly experienced on interfacing with oversea contract manufactures to develop high quality and low cost process. Expert on defining product testing plans to ensure the product shipping quality and reliability.
Listed skills include Semiconductors, Debugging, Product Development, Testing, and 17 others.
Current workplace
Jun Jin's current company
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9 roles
Jun Jin work experience
A career timeline built from the work history available for this profile.
Nand Hardware Engineering
Jun 2015 - Oct 2019
Npi, Watch Product Operations
Oct 2013 - Jun 2015
Sr. Manager / Director, Product And Solutions Engineering
- Product engineering manager, responsible for qualifying new product to extreme high volume production (Capable of shipping billion of units per year).
- Managing cross-functional teams to develop multiple RF products, EAS and HF RFID fabricated on innovative printed technology.
- Responsible for achieving disruptive cost solution for RFID backend process including bumping, dicing and attach to enable item-level intelligent tagging.
- Develop new product applications for NFC plus sensor and flexible display driver.
- Bring up new backend process line at the oversea sub-con manufacture. Manage process qualification, quality control, capacity planning, logistic and operation efficiency optimization, etc.
- Eco-system development targeting NFC application including NFC forum standardization, customer application, UID management, mobile Apps, retail solution development, etc.
Aug 2011 - Oct 2013
Manager, Product Engineering
Managing 90 and 65nm flash memory new product line from product development to high volume production. Direct responsibilities highlights:* Product manager for SPI product line and low power NOR flash memory for wireless application.* Product definition and specification* New product line ROI and market analysis* Design test mode definition for lowest.
Oct 2008 - Aug 2011
Manager, Product Development Engineering
- Spansion latest MirrorBit flash memory product development of multiple product families, such as OR-NAND, NOR (MUX and DeMUX families) with 90nm and 65nm process technology producing billion-dollar annual revenue.
- Solid knowledge of NAND/NOR flash memory system architecture, including wireless application with NAND+DDR and NOR+pSRAM, mobile mass storage application with eMMC, SATA and SSD. NAND firmware algorithm to ensure the.
- In charge of wafer sort testing activities including test program generation, wafer level silicon debug and characterization. Interface with Fab to evaluate process split lot analysis, Ea calculation to predict product.
- Lead the engineering efforts to optimize the product performance with statistical DOE using JMP, reference cell trimming, intrinsic parameter uniformity, program/erase performance uniformity, sensing amplifier.
Apr 2004 - Oct 2008
Field Application Consultant
- Provide application and product direct customer support for Agilent’s Versatest tester platform, V1000/V3000/V4400/V5000 series.
- Provide the customer with semiconductor automatic test equipment system solution including both software and hardware fixture developments
- Perform new product benchmark to target new customer design-win. Provide Pre/Post sales technical support and training.
- Generate customized CIM environment in C/C++ language for automating the testing process, manufacturing data collection and mining.
Apr 2000 - Apr 2004
Product Engineer
Jun 1997 - Apr 1999
Circuit Design Engineer
Sino Wealth Electronics
Jul 1995 - Jun 1997
2 education records
Jun Jin education
Engineering Management
Santa Clara University
Bs, Electrical Engineering
Shanghai University
FAQ
Frequently asked questions about Jun Jin
Quick answers generated from the profile data available on this page.
What company does Jun Jin work for?
Jun Jin works for Apple.
What is Jun Jin's role at Apple?
Jun Jin is listed as NAND Hardware Engineering at Apple at Apple.
What is Jun Jin's email address?
AeroLeads has found 3 work email signals at @apple.com for Jun Jin at Apple.
Where is Jun Jin based?
Jun Jin is based in San Jose, California, United States while working with Apple.
What companies has Jun Jin worked for?
Jun Jin has worked for Apple, Kovio, Chingis Technology Co., Spansion, and Agilent Technologies.
How can I contact Jun Jin?
You can use AeroLeads to view verified contact signals for Jun Jin at Apple, including work email, phone, and LinkedIn data when available.
What schools did Jun Jin attend?
Jun Jin holds Engineering Management from Santa Clara University.
What skills is Jun Jin known for?
Jun Jin is listed with skills including Semiconductors, Debugging, Product Development, Testing, Ic, Product Engineering, Characterization, and Manufacturing.
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