Junaid Ansari Email & Phone Number

Cupertino, California, Us

San Jose, Ca, Us

*Design high density multilayer printed circuit board using Analog/Digital/mixed signal/RF & high speed signals with leading edge technologies such as blind/buried & micro via, high pin count fine pitch BGA, PCIe Gen1 & 2, HDI, DDR2 & 3, USB, Blue Tooth, Flex PCBs etc.*Customer dealing to understand design specs and project's requirements. *Maintained a strong professional teamwork and communication skills with team members located here in US office and overseas.*Perform schematic capture (Orcad CIS, Power logic and Altium) and PCB Layout (Allegro, PADS and Altium) from start to finish, including layer stack up construction, design constraints setting, component library management & their arrangement on the board. *Perform design review to ensure the design requirements along with best layout practices and DFM/DFA/DFT compliancy. *Create manufacturing input package data including board mechanicals, layer stackups, gerbers, ODB++, BOM, XY data etc for fabrication & assembly departments. *Collaborated with engineers on designs and implemented ECO. Coordination with different departments to ensure on time projects progress.*Have designed boards for the major companies such as Intel, IBM, AMD, Motorola, Arkados, Jetalon, IDT, Texas Instruments, Compaq, Cirrus Logic, LSI Logic, Infenion Technologies, Theranos, SRI International, Abbott Hematology, Spansion LLC (Agilent V3300, V4000/5000) and many more.

San Jose, Ca, Us

*Designing of PCBs originate from engineers schematics or netlist input with design rules built in to the circuits and placing components on the boards using placement routines to follow the electrical & mechanical restrictions. *Incorporate the design rules in the CAD tools. *Standardized design to streamline design process and improve manufacturing yields. *Create manufacturing input package data including board mechanicals, layer stackups, gerbers, BOM, XY data etc for fabrication & assembly departments. *Perform manual and auto routing of interconnections.*Perform CAM350 for DRC and compare IPC file with gerbers.*Length Matching and Check high frequency signals, differential pairs, high-speed clocks, PCI bus, AGP bus, AGTL bus, memory bus and other very relevant buses.*Check for solid return path of high speed signals, no plane splits crossing.*Check for proper grounding and even power distribution (Power checking). *Study new chipsets and prepare presentations during weekly meeting

*Design new and modify existing layouts by using Cadence Allegro and Mentors PADs, Altium PCB design platforms.*Schematic Capturing using OrCAD CIS, Netlist insertion, components library creation and management.*Defining board constraints in accordance with the requirements by overseas client, placement of components, routing and release of art work files.*Socket designing which includes (BGA, mBGA, PGA, QFP, PLCC, etc.) *Component designing (SMT and Through Hole) *Thorough design checking and verification before release of design.*Creating manufacturing files for fabrication and assembly.*Have designed complex PCBs for microchip manufacturing giants in the silicon valley mainly, Intel, IBM, AMD, Motorola, Arkados, Jetalon, IDT, Texas Instruments, Compaq, Cirrus Logic, LSI Logic, Infenion Technologies, Spansion and many more.*Assembly data preparation, importing Gerbers, ASCII and IPC-356 from different design packages and their manipulation by using tool Aegis’s Circuit CAM.