- AI School from Likelion (2022-09 to 2023-01): I learned more about data analysis (EDA), machine learning, and deep learning. - Korea Institute of Industrial Technology (2021-03 to 2021-08): I conducted various research related to semiconductor packaging, including a study on the manufacture of solder flux and solder paste for packaging, analysis of solder paste printing using deep learning, and surface treatment technology using laser and flip chip.- Chung-Ang University (2018-03 to 2020-02): I obtained my Master of Mechanical Systems Engineering. My thesis was on the effect of ion on the stability of nanobubbles.- Seoul National University Semiconductor Joint Research Institute (2017-07): I attended a two-week course theoretical and hands-on training on semiconductor processes.- Chung-Ang University (2010-03 to 2018-02): I obtained my Bachelor in Mechanical Engineering.