Lead Qualcomm IEIOT (Industrial and Embedded IoT) business development work in global scope. Overseeing Edge Computing, Edge and on device AI for industrial and consuming. Robotics, smart camera, smart panel and smart building & appliances.

Leading Qualcomm Snapdragon IOT business in China. Covering industrial IOT, retail, robotics, home entertainment, and connected camera product lines.

Position Responsibility:• Technical Account Manager for Qualcomm IOE Business Unit. Lead Qualcomm China IOE engineering team to support China and global IOE/IOT projects including drones, VR devices, connected camera, media devices, and wearable devices;• Co-work with sales and marketing teams for Qualcomm IOT platform promotions. Manage customer projects from product definition, feature scoping and project schedule plan;Main Achievements:• Design in Qualcomm Snapdragon Flight platform to all key drone customers, and successfully launched products from ZeroTech. Other designs will launch in CY16;• Design in Qualcomm Snapdragon820 VR platform to key vendors for VR devices, including Tencent, iQiyi, Baofeng, LeTV, Pico and other customers;• Supported customer to launched Qualcomm Wear platform based smartwatch products in June. 10+ more projects are in pipeline;• Design win and working with Hikivision, Dahua, TP-link and other customers for connected camera and surveillance camera products.

Position Responsibility: • Responsible for QMC platforms and software products delivery to customer and customer devices launch;• Manage customer with technical support and project/program management with team work from CE/Dev engineering team and sales, product marketing and project management team globally;• Drive and develop product plans, indicators and tracking metrics for customer projects, develop the execution schedule comprehending staffing needs and interdependencies with other Qualcomm teams and 3rd parties;• Collect marketing information and customer requirements to product planning team for product definition, planning and management.Main achievements:• Supported key customers: Huawei, TCL, Xiaomi, LeTV and others• Assigned TAM for Huawei:o Helped Huawei team had smooth transition from feature phone to smartphone, in CY2010, brought Huawei Shanghai, Beijing, Xi’an and Wuhan teams;o Supported Huawei launched 20+ models feature phones and 40+ models smartphones globally from low end platform to Waverider and Badger platforms. MSM7x27A, MSM8960 were the world wide first wave launch;o Helped Huawei brought Windows Phone project team and successfully shipped WP project as 1of 4 selected customers by QMC and MSFT;o Also supported Huawei MBB business to world 1st position on QMC MDM platforms;o Total shipped volume for supported projects is close to 100 million.• Assigned TAM for TCL:o Brought TCL to QMC’s 2nd volume contributor in EA customers in CY2011;o Supported TCL launched several products on Unicorn, Strider and became QRD’s alpha customer;• Assigned TAM for MPQ business:o Engaged the new MPQ (smart TV) business and initialed world first batch customers Xiaomi and LeTV in China;o Support LeTV launch the world 1st MPQ8064 smartTV in May’13

Position Responsibility:• Analyze and define mobile terminal products architecture and feature requirements for both hardware and software;• Leading the product definition, business quotations and negotiations with customers;• Making and executing product management plans (including Project Plan, Quality Plan, R&D Plan, Product Build Plan, Product Certification Plan, and Risk Management Plan etc.)• Communicate with customer for project status synchronizes and relationship maintain.Main achievements:• Nokia ODM projects PDM:o Responsible for Nokia CDMA ODM projects;o Successfully launched CDMA feature phone products on VIA CBP platform and Qualcomm QSC6085, QSC11x0 platform;o Launched 4 models on worldwide 20+ carriers, familiar with the Nokia program processes and carrier certification processes.• Domestic ODM projects PDM:o Responsible for domestic customer ODM projects target to carrier and open market;o Launched products on QSC6085 and QSC11x0 platforms. And launched the China market 1st Qchat phone

Position Responsibility:• TD-SCDMA Physical Layer ASIC verification;• Develop integrated TD-SCDMA device solution based one TI’s OMAP platform. Worked for analog and digital baseband, power management and BSP code integration.Main achievements:• Delivered China’s first dedicated TD-SCDMA physical layer ASIC;• Delivered COMMIT L1 ASIC with TI OMPA platform TD-SCDMA solution to domestic mobile phone and data card customers.