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Experienced leader of ASIC/FPGA, Firmware and System Design teams with job roles spanning from R&D and Applications to Marketing and Planning.Built and managed engineering teams across disciplines and locations.Proven track record of bringing products from conception to production.Specialties: ★ Engineering Team Building and Management ★ High performance FPGAs, eFPGA/ASICs and Systems
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Sr. Manager, Hbm DdtlMicron TechnologyUnited States -
Sr. Director Of Applications EngineeringAchronix Semiconductor Corporation Mar 2020 - PresentSanta Clara, California, UsAccelerating customer success with High Performance FPGA ICs and eFPGA IPs.• Building ASR, LLM and other AI and HPC Applications with High Performance FPGA and eFPGA IPs• Responsible for all customer-facing technical engagement• Collaborating with Marketing and Planning teams to define product roadmap• Collaborating with internal R&D teams to improve quality of products• Responsible for productization of new generation of high-end FPGAs• Hiring and developing team members -
Director Of Asic DesignGoke Us Labs Apr 2018 - Mar 2020Leading multi-site teams of IC designers to develop advanced SSD controller IC’s and FPGAaccelerators● Driving multiple SSD controller ASIC and FPGA accelerator card projects in parallel● Put in place SoC design flow and methodology (hands-on)● Evaluate and deploy 3rd party IPs and interface with service providers
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Design Center ManagerMicrochip Technology Jan 2010 - Mar 2018Chandler, Az, UsManaging a wireless design center that specializes in developing ASIC, software/firmware and hardware modules for the "Internet of Things" (IoT) embedded market (WiFi, Bluetooth, ZigBee, etc.)★ Engineering Management: Directly managing a 15-engineer Mixed Signal ASIC design team located in US and Hungary Directly managing a 7-engineer Software design team Directly managing a 2-engineer hardware design team and 1~2 hardware design contractors Managing through a "Matrix" system a 4-engineer Applications team★ Engineering Team Building: Grew the design center from 6 engineers to its current size Directly responsible for new products that grew revenue from ~$3M to over $18M in 4 years★ Internet of Things: 7 years experience developing ASIC, software and hardware specifically for the IoT market Solid understanding of the current IoT market trends and customer needs★ Wireless Communication: 9 years experience developing ASIC, software and hardware for WiFi, Bluetooth, ZigBee, Sub-GHz ★ Embedded Systems and Applications: 5 years experience managing embedded systems and applications development Coordinating design teams and application teams to develop demo applications and systems Interfacing with embedded customers to understand their needs and help architect solutions Providing direct support for high profile customers ★ Mixed Signal ASIC Design/Verification Flow: Fully responsible for developing and maintaining a mature mixed signal ASIC design flow All ASIC projects delivered by the team went to full production with the FIRST full mask tapeout★ Representing the engineering team in product line marketing and cross-functional teams -
Digital Design ManagerZerog Wireless (Acquired By Microchip 01/2010) Dec 2007 - Jan 2010
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Soc Design ManagerAmicus Wireless Sep 2005 - Nov 2007Us• Led the development of 802.16e Mobile WiMAX SoC. Produced working silicon with first tape-out• Defined chip architecture (ARM/AHB/APB based SoC) and verification strategy• Architected and brought up a complex FPGA platform to emulate the ASIC -
Senior Design EngineerGenesis Microchip Sep 2001 - Sep 2005• Developed several video processing ASIC’s for front-end (MPEG decoding) and back-end (panel control and video quality enhancement) applications• Job duty includes:Design, verification and synthesis of various functional modules, chip-level integrationTiming analysis, scan-chain insertion, post layout verification, ATE vector generation -
Senior Staff EngineerConexant May 2000 - Sep 2001Irvine, Ca, Us -
Asic Design EngineerSierra Imaging Sep 1997 - May 2000• Took a major part in developing several generations of ASIC’s used in high performance digital still cameras• Fully responsible for the tape-out of the then latest generation fully programmable Image Processor for digital still cameras
Kai He Skills
Kai He Education Details
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University Of IowaElectrical Engineering -
Tsinghua UniversityElectronic Engineering -
The High School Attached To Hunan Normal University
Frequently Asked Questions about Kai He
What company does Kai He work for?
Kai He works for Micron Technology
What is Kai He's role at the current company?
Kai He's current role is Sr. Manager, HBM DDTL.
What is Kai He's email address?
Kai He's email address is ka****@****ail.com
What is Kai He's direct phone number?
Kai He's direct phone number is (480) 792*****
What schools did Kai He attend?
Kai He attended University Of Iowa, Tsinghua University, The High School Attached To Hunan Normal University.
What are some of Kai He's interests?
Kai He has interest in Science And Technology, Children, Arts And Culture, Education.
What skills is Kai He known for?
Kai He has skills like Engineering Management, Leadership, Team Building, Embedded Systems, Soc, Global Management, Cross Functional Team Leadership, Project Management, Iot, Wireless, Wifi, Microcontrollers.
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