Sr. Principal Engineer
InterDigital Communication (April 001 – Dec 012): Sr. Principal Engineer.– Leading R&D Systems Engineering group responsible for developing and prototyping future wireless concepts and solutions (technology and products roadmapping)- Lead Delegate to 3GPP SA2 Standards and other wireless standards forums– Developed and Inserted into 3GPP standards solutions for M2M (SMS based T4 and T5 based solutions), 4G-WLAN Interworking solutions, Broad Band-4G Interworking, Network Sharing, EPC Policy Control, ANDSF support, LTE, D2D PROSe, SaMOG, SIPTO, VoIP, IMS. – 70+ Standards Based issued patents and 100+ pending patents application– Over 20 accepted essential contributions to 3GPP SA1 and SA2.– Sole inventor of Essential Patents on OFDM support in E-UTRAN, SMSIP and IUT solutions.– Support of M&A project via the evaluation of Companies and IPR portfolios– Providing market intelligence on wireless companies in 3GPP and IEEE, – Providing background presentation and updates on UMTS, EPC, IMS and SIP. – Evaluation of CTO office work on Video Coding, Privacy and Security.– UMTS-WLAN Interworking and Middleware, Shimware Roadmap support,– A contributing member, technical driver, Evaluator of “Beyond Transport” projects and Core Evolution Program (CEP) and LTE Program. – 802.21 MIH support (Modification to reference model and operations to fit 3GPP(2) model)– 802.11n MAC project (Driver and Contributor of the InterDigital MAC proposal)– QoS and VoIP Investigations,– UMTS and WLAN Security threats Evaluations and External Papers.