Layout planning

Currently working as a Registered Nurse on PCCU Telemetry at Honor Health Hospital at the Shea Campus.

Responsible for developing assembly processes for next generation Intel products. Supported the development of Die Prepprocesses through on-shift factory support of development builds and Design On Experiment (DOE). Job activities also includeddevelopment and maintenance of tool recipes, process optimization, yield improvement, implementation and maintenance ofprocess control systems, stability/capability assessments, and process excursion management.* Resident NPI expert and key point of contact in Die Prep Area* Supported NPIs for multiple Platforms as well as the Ultra Small Form Factor for both Module Engineering and Pathfinding.* Main point of contact for Custom Laser and Saw Recipes* Drove continuous improvements in Die Prep such as flip tool conversion from single bladder to dual bladder

Test Technology Development (ATTD) within the IntegratedHeat Sync (IHS) group focused on the successful development and deployment of process and equipment technologies toenable platforms as they progress to certification and ramp. Designed and executed experiments, wrote technical documentationand white paper changes through Intel’s internal change boards, defining specifications and procedures for operation, accurateprocess control monitoring systems, data reviews, process development and meeting quarterly transfer milestones.* Successfully managed & implemented key XEON products (Dunnington, Nehalem...) for Server Platform from post pathfinding to Virtual Factory ramp-up* Awarded Divisional Recognition award for achieving ramp up from post path finding to Virtual Factory implementation inless than 6 quarters, setting a record for Large Die Server Products* Resident expert on high force clip designs, champion for this project from design, test, and implementation for ATTD andproliferation to the Costa Rica Virtual Factory site* Identified & implemented a new clip requirement as part of the Large Die Server Product development. This required aclip anti-mixing solution to be in place for Virtual Factory/High Volume Manufacturing proliferation during 2008* Successfully implemented and managed a workable anti-mixing strategy for Large Die Server Platform Products. Dueto the short development time, was forced to find an innovative solution in time for transfer that did not have significantoverhead, but met the anti-mixing requirements* Led, defined, managed, validated and implemented a solution that included new color coded trays and a 3rd fiducialmark on the new clip design to make it identifiable with the Clip Attach tool's vision system

FAB 11X, Albuquerque, NMNovellus (NVLS) Bath Metrology (BTM) Process Engineer in Cu Electroplate (EP) Responsible for safe operations, maintenance, and process and tool performance* Lead the job hazard analysis (JHA) for EP BTM (ElectroPlater Bath Metrology) tools* Developed and implemented the following procedural changes preventing future safety incidentso Implemented throughout the Novellus Copper Electro Plater Virtual Factory (VF) an alternative acid glove whichis equally protective, chemical resistance and increases safety by improving dexterity and productivity byreducing finger and hand fatigue and straino Reviewed all preventive maintenance (PM) on the BTMs and individualized each PM and task documenting\* Led and managed the VF (Virtual Factory) in identifying key Bath Metrology projects and developed the Virtual Factoryroadmap* Created and implemented new procedures that improved tool efficiency and analytical processes when adjusting thereference electrode offset, reducing adjustment time from 2.5 hours to 1.5 hours and created a new response flowchecklists (RFCs) to assist MTs to better troubleshoot the Bath Metrology* Mentored engineers in remote FAB’s on the Bath Metrology toolset* Participated with the Virtual Factory team to help develop an Intel specific Bath Metrology training class for new ProcessEngineering Tool Owners and Maintenance Technicians* Led the NVLS business unit field service engineers for all troubleshooting of Bath Metrology issues* Resident Virtual Factory Bath Metrology content and tool expert. Personally trained all Field Service Engineers fromNovellusCreated/implemented customized a curriculum to train new FSEs and employees. Training material for BTM includedbasic chemical theory, tool functionality, fundamentals on how each organic analysis emulates the plating process in theanalysis cell, and basic theory on cyclic voltametric stripping (CVS)

Engineering Team Lead for shift 6 which included leading and managing Technicians and Supplier Resources in multipleFunctional Areas on both day and night shift* Communicated Cu EP lessons learned on Fab 22 ramp to the virtual factory (costs, planning, resource issues, scheduledelays, etc)* Leading the Test Wafer inventory Reduction project in Thin Films group by managing, performing weekly audits, andchairing weekly meetings to communicate the TW inventory reduction goals to TF team members* Tool owner, driving tools from Install to final qualification, writing white papers, tool vendor/contractor management,participating in the install and qualification working group and managing the purchase order/requisitions for the followingtoolsets:o Cu EPo Novellus Sequelo VDF (Sl1-SL2)

Performed qualifications and sustained the MRC Eclipse tool for the C4 metalization process* Established training and preventative maintenance documents for Mfg Techs on the Eclipse* Performed time study on metrology which improved efficiency on measuring film thickness and assisted SeniorEngineers on developing a process for stress measurements* Responsible for sustaining Pb/Sn and Cu electroplating tool for the bump process

Duties and responsibilities included monitoring, inspecting, and measuring the quality of wafers produced to ensureproduct quality* Technical certifications included; wire bond, die bond, gross-leak tests, FET testing, flatness testing, in-line testing, andflatness set-up. Other training included manual/target die bonders