Keith Graham Email & Phone Number

Seattle, Wa, Us

Seattle, Wa, Us

Zurich, Ch

I am excited to Chair the RISCV Academia and Training SIG in 2024. RISCV is an exciting new computer architecture that enables innovation by breaking down the barriers of past closed architectures. We have outreach activities to educate people of What is RISCV?, Why RISCV?, and explaining it to non-technical people through Video Contests and other activities. This SIG is also responsible for developing materials to aid the integration of RISCV computer architecture into course curriculums.

Munich, De

The University Program augment university undergraduate and graduate computer engineering curriculums by providing assignments, materials, and tools to prepare the next generation of processor engineers. Through the development of research partnerships and support of researchers, the program will advance solutions in computer security, functional safety, artificial intelligence, advanced system memories, and domain specific applications. The support of both the students and researchers will be through its High-Level Synthesis Language, CodAL, and Codasip Labs’ technologies. Through support of students and researchers, the University Program aims to prepare the people and advance technology to solve tomorrow’s technological challenges.

Munich, De

The University Program augments university undergraduate and graduate computer engineering curriculums by providing assignments, materials, and tools to prepare the next generation of processor engineers. Through the development of research partnerships and support of researchers, the program will advance solutions in computer security, functional safety, artificial intelligence, advanced system memories, and domain specific applications. The support of both the students and researchers will be through its High-Level Synthesis Language, CodAL, and Codasip Labs’ technologies. Through support of students and researchers, the University Program aims to prepare the people and advance technology to solve tomorrow’s technological challenges.

Boulder, Colorado, Us

As the Director of Electrical Engineering Internship program, I will be developing partnerships between industry and the University of Colorado at Boulder to provide Engineering Cooperative Education (Co-op) Programs that provide undergraduates an opportunity to augment their education with work experience. This role includes matching perspective students with appropriate companies and jobs. Students who participate in co-op opportunities are better prepared to enter the work force and often continue their employment with their co-op employer after graduation.

Boulder, Colorado, Us

ECEN 5013-003: ASIPs and IP Core Processor DesignEmbedded processor developments have traditionally been selected from a fixed set of IP cores available. What happens if the application that specifies the performance or features of the core does not easily fit any any core, but between two cores? You must select the larger core because the application must be successful for a successful product. The larger core may bring the performance required, but at a higher cost, area, and power than what is required. The real solution is to design a custom processor core that meets the performance of the application without the additional gates, power, and cost of the larger core. What happens if there is no core available that meets your performance? You still need to develop the product. Design a custom processor core with the additional resources such as vector processor elements to achieve your application. The advancement of custom processor development environments and open source Instruction Set Architectures such as RISC-V are enabling the advancement of custom embedded processors and micro-controllers.This course will explore ASIP, Application Specific Instruction Set Processor, processor development where students will take a semester journey of exploring an application and adding the functionality to the core to meet their end application goals. Throughout the course, they will integrate their processor into an FPGA to measure actual performance of their implementation, not just simulations. The students will optimize their design by adding instructions to their processor instruction set, adding a dynamic branch predictor, and a MAC / vector co-processor. Performance in today's processors in not just the hardware, but the tightly coupled interface between the processor and the compiler. Through their development environment, the students will instruct their generated compiler to optimize the code to their hardware architecture.

Boulder, Colorado, Us

ECEN 4593: Computer OrganizationThis computer architecture course is focusing on both the architecture of the processor and the system. In today's market, processors are being customized to provide optimal performance to the overall system. The optimization could be targeting performance, energy, cost, or any application specific requirement. By providing an understanding of past computer architectures and how they have evolved in today's processors will provide the knowledge of how to design the next generation. The class will be exploring next generation tools and architectures such as RISC-V.- Profiling to maximize the CPU Instruction Set Architecture- Maximizing the efficiency of caching subsystems- Making the engineering tradeoffs between power, performance, and cost- Designing the control path of a CPU or embedded system- Developing the data path of a processor or embedded system- Implementing a system memory hierarchy- Understanding the values and disadvantages of different memory technologieshttps://sites.google.com/colorado.edu/ecen4593/home

Boulder, Colorado, Us

ECEN 5023-002: Low Power Hardware Design TechniquesThis course will cover the design requirements and considerations for developing low power RF devices such as Internet of Things and wireless sensor nodes. The project will also include Energy Harvesting to enable the "off grid" wireless sensor design. To complete the project, power supply simulation, board layout, and project management techniques will be taught. At the end of the course, each student will have completed a complete battery powered RF device from design concept to completed board.- Timeline management- Microcontroller selection- RF radio selection- Battery selection- Power supply design and simulation- Proper passive selection to match reliability of end application- Maximizing power out of low current battery technologies- Load power management- Printed circuit board layout- Printed circuit board assembly- Board bring up- Test and verification- Introduction to application developmenthttps://sites.google.com/colorado.edu/ecen5023-002

Boulder, Colorado, Us

ECEN 5823: Internet of Things Embedded FirmwareThis course covers how wireless infrastructure shapes the architecture of embedded applications and wireless RF designs of WiFi, BlueTooth, ZigBee, and Thread. It will also cover low-power design considerations and techniques for mobile applications and enabling 10+ year product life cycles for mission critical and industrial equipment. Security attack surfaces will be discussed and what is required to prevent or make known security attacks. Economic models for Internet of Things solutions and services will be presented as these economic model affect product design.- Maximize the battery life of Internet of Things Applications- Analyze Internet of Things memory requirements- Overcome technical weaknesses of flash memory technology- Match the correct low power RF networking technology to the end application- Obtain skills to develop a Bluetooth Smart peripheral/device product- Obtain skills to develop a Bluetooth Smart client product- How energy harvesting powers the Wireless Sensor Networks- Maximizing the value of embedded systems using Near Field Communications (NFC)- Determine hacking security attack surfaces of embedded systems- How to make an embedded product temper resistant and provide tamper responseshttps://sites.google.com/colorado.edu/ecen5823/home

Boulder, Co, Us

As the Associate Chair of Undergraduate Education, I will be participating in the development of the undergraduate curriculum and the development of new courses addressing the needs of our students. These course will combine theory and experiential learning in embedded systems, domain specific optimized computing, as well as other disciplines in advanced optics, materials, photonics, power, and RF. Industry will be a key partner in providing input and direction into the curriculum and courses. In addition to technical knowledge and skills, new curriculum will be introduced to provide the students with workplace skills in time management, cross functional team work, leadership, networking, and project management.

Highlands Ranch, Co, Us

- Penetrated and grew the key markets of SSDs, IoT, and Solar EPCs to multi-million dollars- Delivered $10M of new business in 2015- Established $15M of new account portfolio sales- Continued in the role of managing partner to establish key supplier and customer partnerships- Managed Silicon Labs' supplier relationship to grow 3x the semiconductor industry growth rate- Developed Amphenol Solar business that will grow 400% in 2015

Highlands Ranch, Co, Us

- Built Thorson into a top electronic Manufacturer Representative in the Rockies by setting corporate strategy, acquiring suppliers, hiring the sales team, managing the sales organization, and selling to customers- Surpassed the semiconductor average growth rate by 3x for Thorson's suppliers' Texas Instruments, HiFn, and Vitesse- Increased combined channel sales to become a significant supplier through distribution by coordinating channel activities and training- Developed long term customer partnerships by orchestrating factory Vice Presidents, FAEs, and Marketing visits as well as factory engineering resources to secure key business opportunities- Gained sales expertise across a wide platform of products which includes SSDs, DSPs, micro controllers, ASICs, digital, analog, mixed signal, timing, power, interconnect, and board/system level products- Exceeded sales expectations of Atmel, FCI, HiFn, IDT, International Rectifier, Linear Technology, Littelfuse, Micron, Panasonic, Pulse Engineering, Silicon Laboratories, Texas Instruments, and Vitesse that resulted in long term partnerships- Skills include Miller Heiman, Power Based Selling, Customer Oriented Sales, Proactive Sales, Virtual Basic, 401k Management, Microsoft Exchange- Ran Thorson's 401k retirement program, NBO system, computers, and VOIP/internet services.

Highlands Ranch, Co, Us

- Took a Rest Of World sales position and transformed it into a key account position managing various accounts including Hewlett Packard, StorageTek, Avaya, Woodward Governor, DEC, SpectraLink, and Advanced Energy- Became a senior account manager by growing revenue through selling solutions into applications spanning workstations, industrial controls, wireless radios, mass storage, and telecommunications- Refined key relationships to become a line manager

- Developed the first Windows based notebook with integrated cellular modem- Prepared the notebook for manufacturing by coordinating the engineering team in the development of the system architecture, mechanical design, and system layout- Gained experience in raising capital be participating in trips to potential Quest funding partners

- Completed the first Sun compatible workstation by leading the technical development which included system architecture and system validation that included 4 ASICs and a custom CPU- Led the way into multi-processor systems based on virtual caches by co-developing the first multi-processor Sun compatible server- Gained experience in the transfer of products into production by taking both the Sun compatible server and workstation from development into production

Houston, Texas, Us

- Won support for the first HP workstation Floating Point Accelerator by winning support within the workstation marketing and engineering management teams- Completed the development of the Floating Point Accelerator by taking it through the complete cycle of Marketing definition, board architecture design/development, software integration, and transfer to production- Learned the basic skills of electrical engineering design, development, and debug by participating in HP training programs and learning from senior engineers