Ken Burns

Ken Burns Email and Phone Number

President at TinyCircuits @ TinyCircuits
Ken Burns's Location
Akron, Ohio, United States, United States
Ken Burns's Contact Details
About Ken Burns

Founder and President of TinyCircuits, an open source electronics design and manufacturing company located in Akron, Ohio.

Ken Burns's Current Company Details
TinyCircuits

Tinycircuits

View
President at TinyCircuits
Ken Burns Work Experience Details
  • Tinycircuits
    President
    Tinycircuits Oct 2011 - Present
    Akron, Oh, Us
    Founder and President of TinyCircuits, an open source electronics design and manufacturing company located in Akron, Ohio. Launched successful Kickstarter campaign for the TinyDuino in Sept 2012, raising over 1000% of our desired goal amount.
  • Avid Technologies, Inc.
    Senior Project Manager
    Avid Technologies, Inc. Apr 2010 - May 2013
    Twinsburg, Oh, Us
    Senior Project Manager for a full service product development firm, specializing in electrical product design.Principal Software Engineer for MACTek Corp's industrial communication products using the HART protocol. Currently heavily involved in the development of a 4-20mA Loop powered WirelessHART Adapter, which serves as a bridge between wired-HART networks and a WirelessHART network. Served as MACTek's technical representative in the WirelessHART working group since 2005.
  • Avid Technologies, Inc.
    Senior Project Engineer
    Avid Technologies, Inc. Jun 2003 - Apr 2010
    Twinsburg, Oh, Us
    Senior Project Engineer for a full service product development firm, specializing in electrical product design.Significant Past Projects:Hardware and Firmware development for consumer based Air Treatment systems and Water Treatment systems, currently shipping in 100K+ qtys annually. 8-bit micro, RFID, real-time control.ATM Terminal software development. Main processor is a 32-bit softcore processor in an FPGA, and two secondary 8-bit processors (one for security and encryption, the second for mag card reading). Developed main user interface, LCD interfacing, printer and cash dispenser interfaces. Helped to develop all security mechanisms, 3DES encryption algorithms, conformance to PCI standards, and supported third part security testing and compliance effrot. Mixed C++ / C development. Distributed Temperature control system - consisted of a main terminal with QVGA display and user input and connected to up to 40 remote temperature control modules over a custom Modbus link. Developed firmware for both the main control terminal, and the temperature control modules. Temperature control consisted of a PID control loop & PID autotuning algorithm.
  • Accelent Systems
    Electrical Engineer
    Accelent Systems Mar 2001 - Apr 2003
    Hardware Design Engineer for a leading hardware / software firm, specializing in Microsoft Windows CE, PocketPC and embedded Linux designs using ARM processors. Designs completed on a very aggressive schedule with great success. Lead hardware design engineer on multiple cutting edge consumer products including design work on Microsoft PocketPC 2002/2003 PDAs, cellphones, web tablets, and multiple ARM processor development platforms. Most designs include PCMCIA / Compact Flash slots, USB 1.1 (host or client), SD/MMC slots, STN or TFT LCD displays, 802.11, Bluetooth, and very aggressive battery requirements (Lithium-Ion / NiCd). Sophisticated PCB designs using advanced techniques such as fine pitched BGAs (0.5 mm ball pitch), blind and buried vias, logic voltages down to 0.8 Volts, processor speeds up to 400 MHz, and bus speeds up to 133 MHz. Extensive experience with designs utilizing Intel StrongARM, Intel XScale, ARM9 and ARM7 processors. Most designs also utilize FPGAs, CPLDs, and microcontrollers (PIC, 8051). Participated in several Windows CE platform porting efforts, using Microsoft Platform Builder.
  • Central Intelligence Agency
    Electrical Engineer
    Central Intelligence Agency Aug 2000 - Dec 2000
    Us
    Served as a design engineer in support of U.S. intelligence operations abroad. Helped design and develop several projects using audio, video, specialized antenna design, RF design, low power circuit design, and embedded microcontrollers. Participated in several technical training courses involving practical antenna design and printed circuit board design and assembly.Security Clearance: Top Secret / SCI
  • Rockwell Automation
    Engineering Intern
    Rockwell Automation Jan 2000 - Aug 2000
    Milwaukee, Wi, Us
    Graduate internship. Helped develop a digital I/O ASIC for use in the Allen-Bradley family of I/O devices. This ASIC incorporated an 8051 core along with customized modules written in VHDL to interface with specialized Allen-Bradley backplanes and devices. The ASIC also included JTAG boundary scan and multiple discrete I/O ports, as well as incorporating standard I/O interfaces such as I2C, SPI, and RS-232. Served as the primary firmware engineer on the digital I/O ASIC project, developing bootloader ROM code in C and 8051 assembly language. Developed a library of I/O functions to provide a high-level software interface to the I/O components of the ASIC.Developed a Windows 9x and NT application using Visual C++ 6.0 to remotely access and update firmware of I/O products over RS-232, ControlNet, DeviceNet and Ethernet. This application also incorporated a feature to issue JTAG commands when connected via RS-232 and utilized RSA encryption (using Microsoft’s Crypto API) to securely store propriety firmware code.
  • Akron Public Schools
    Network Engineer / It Support
    Akron Public Schools May 1995 - Jan 2000
    Part-Time Network Engineer. Helped support the design and configuration of the Akron Public Schools computer networks across the entire district.Assisted in the migration of the system from an IBM 360 mainframe to a HP-UX Unix platform.Installation and support for the network infrastructure for 60+ schools and adminstrative buildings.
  • Telxon
    Electrical Engineer Co-Op
    Telxon Jan 1996 - Nov 1996
    Us
    Cooperation Education assignment. Worked with Electrical, Computer and Mechanical Engineers. Learned advanced soldering techniques, board level debugging skills, and hardware/software design skills. Worked with x86 processors, National Semiconductor COP8 microcontrollers, and Motorola HC microcontrollers.

Ken Burns Skills

Embedded Systems Firmware Electronics Microcontrollers Embedded Software Fpga Product Development Pcb Design Debugging Electrical Engineering Hardware Vhdl Manufacturing Engineering Arm Hardware Architecture C++ C Engineering Management Bluetooth Arduino Zigbee Embedded Linux Product Incubation

Ken Burns Education Details

  • The University Of Akron
    The University Of Akron
    Electrical Engineering
  • The University Of Akron
    The University Of Akron
    Electrical Engineering

Frequently Asked Questions about Ken Burns

What company does Ken Burns work for?

Ken Burns works for Tinycircuits

What is Ken Burns's role at the current company?

Ken Burns's current role is President at TinyCircuits.

What is Ken Burns's email address?

Ken Burns's email address is bu****@****hoo.com

What is Ken Burns's direct phone number?

Ken Burns's direct phone number is +133032*****

What schools did Ken Burns attend?

Ken Burns attended The University Of Akron, The University Of Akron.

What skills is Ken Burns known for?

Ken Burns has skills like Embedded Systems, Firmware, Electronics, Microcontrollers, Embedded Software, Fpga, Product Development, Pcb Design, Debugging, Electrical Engineering, Hardware, Vhdl.

Free Chrome Extension

Find emails, phones & company data instantly

Find verified emails from LinkedIn profiles
Get direct phone numbers & mobile contacts
Access company data & employee information
Works directly on LinkedIn - no copy/paste needed
Get Chrome Extension - Free

Aero Online

Your AI prospecting assistant

Download 750 million emails and 100 million phone numbers

Access emails and phone numbers of over 750 million business users. Instantly download verified profiles using 20+ filters, including location, job title, company, function, and industry.