Ken Henderson Email and Phone Number
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With over 40 years of experience in electro-mechanical design, manufacturing, IT, and product lifecycle management, I am a Platform Mechanical Development Manager at Thermo Fisher Scientific, a global leader in serving science. I am passionate about applying digital twin technologies and simulation-driven design to reduce time-to-market and bring competitive products to the semiconductor fab customers.As a product owner and a process owner, I lead the development of a Wafer Common Platform for next generation, large dual-beam wafer metrology and TEM-Prep Electron Microscopy systems. I also manage engineering contractors across multiple Electron Microscopy R&D projects and drive the transition from a legacy NX/Teamcenter hybrid BOM to a multi-BOM product structure and business process. I leverage my skills in automation, computational fluid dynamics, finite element analysis, robust design, and optimization to deliver innovative solutions that meet safety, quality, cost, delivery, value, and customer satisfaction targets. I excel at building and maintaining strong relationships with vendors, partners, stakeholders, and communicating effectively across organizational and technical boundaries.
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Platform Mechanical Development ManagerThermo Fisher Scientific Jul 2023 - PresentWaltham, Ma, UsDriving the next generation Wafer Common Platform for fab-worthy, Large Dual-Beam wafer metrology and TEM-Prep Electron Microscopy product variants for semiconductor fab customers. Process Owner leading the transition from a legacy NX/Teamcenter hybrid BOM to a multi-BOM product structure and product lifecycle management business process.
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Wafer Common Platform Product Owner (Integrated Systems)Thermo Fisher Scientific Sep 2020 - Jun 2023Waltham, Ma, UsProduct Owner for the development of a Wafer Common Platform for next generation, fab-worthy, large dual-beam automated TEM prep Electron Microscopy systems.Engineering Contractor Management across multiple Electron Microscopy (EM) R&D Projects.
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Mechanical Engineering LeadThermo Fisher Scientific Aug 2017 - Aug 2020Waltham, Ma, UsMechanical Engineering Lead in developing next generation TEM Prep grid/sample handling and FIB column solutions for near line and fab-worthy wafer inspection systems. Led the Mechanical Engineering design & development of Ga-source near-line EFA/Circuit Edit systems and Inductively Coupled Plasma-source Focused Ion-Beam (FIB) columns for next generation Small/Large Dual Beam (SEM/FIB) EM systems.
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Mechanical Development Team LeadAsml Jul 2014 - Aug 2017Veldhoven, NlLed the Business Process Re-engineering of ASML's new CMII-aligned Product Structure Definition and Product Lifecycle Management solutions at the Wilton factory in support of ASML's business growth to €10 billion within this decade. (Q1-2/2017)Developed tooling to mitigate contamination and damage risks to the Orion wafer alignment optical module objective lens. (Q4/2016)Led a cross-functional team to qualify and release Cost of Goods improvements to the Extreme Ultra-Violet (EUV) Reticle Stage module for NXE 3350/3400 systems. (Q3/2016)Led a cross-functional team to develop, qualify, and deliver specialized upgrade machine tooling for legacy Twinscan lithography systems in the Deep Ultra-Violet (DUV) global customer installed baseline. The €1.4M tooling can swap Reticle Stage (RS) modules in systems where Fab service aisle widths are insufficient for standard upgrade tooling. The upgrade tooling achieved ROI within two field swaps and provides an upgrade path to an installed baseline of more than 400 systems, extending system overlay and focus performance improvements while maximizing existing capital equipment investment.. (2015-Q2/2016)Led a cross-functional team to extend the XT Extensions Reticle Stage module to NXT performance specs in overlay, focus, and throughput. (2014) -
Mechanical Development Team Lead DefectivityAsml Jul 2013 - Jul 2014Veldhoven, NlCross-functional Team Lead for the design, development, qualification, and delivery of the Reticle Mini-Environment (RME) submodule for Extreme Ultraviolet (EUV) Twinscan lithography machines. The RME suppresses submicron particles around the Customer's reticle, resulting in a Reticle Stage module with substantially reduced submicron particles per reticle pass.
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Mechanical Design EngineerAsml Jan 2013 - Jun 2013Veldhoven, NlLed the development of Extreme UltraViolet (EUV) Reticle Stage (RS) design and development with Tribology and Defectivity tooling design for SiC particle generation characterization and its effect on Top Module defectivity. Designed and developed tooling to support RCCM investigation and RS project critical path knowledge on SiC “black rain” characterization. Supported EUV customer sustaining efforts with mechanical lab testing and FEA analysis of containments and solutions to issues encountered in the field.
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Technical WriterAsml Nov 2011 - Jan 2013Veldhoven, NlAuthored and developed several Systems Engineering Guidelines (SEG) documents for the ASML Extreme Ultraviolet (EUV) Reticle Stage (RS) module. Delivered compelling value for critical SEG documents, authoring content, releasing them to review and change control in Teamcenter with zero slip rate.
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Founder/OwnerAscent Telecommunications Mar 2002 - Dec 2011Direct marketing of a variety of telecommunications products and services, including residential and commercial local phone, wireless, domestic and international Globalinx VoIP videophones and services, broadband internet, satellite TV, home security and online shopping. Developed and deployed an e-commerce website to acquire wireless and VoIP customers through PPC advertising and SEO. Acquired over 300 personal customers and recognized monthly as a top customer producer for 2 consecutive years, maintaining an average ROI of over 50% and a steady monthly residual income. -
Financial AdvisorMerrill Lynch Jul 2007 - Jul 2009New York, Ny, UsRegistered representative delivering asset management to a wide variety of clients including working professionals, retirees, business owners, and high net worth Individuals while focusing on preserving capital in the worst recession since the Great Depression. Delivered annual and quarterly financial physicals, utilizing high-quality corporate and municipal fixed income, variable annuities and alternative investments to hedge against the downside and consistently outperform the capital markets by more than 30%. Investment policy yielded consistent reduction of overall risk/volatility through low-correlation asset classes that preserved capital with strong participation on the market upside and very low downside capture. Employed financial physicals for clients using stochastics and a modeling & simulation tool that forecasts overall potential wealth given investor risk profile, cash flows, investable assets, market conditions, and a combination of historical and projected returns. -
Sr. Mechanical Engineer / Program ManagerXerox Feb 1984 - Dec 2006Norwalk, Connecticut, UsOver 22 years of electro-mechanical product development engineering with achievements in simulation-driven mechanical design for electrical and optical systems, manufacturing (robotics & automation), IT, software development, training and mechanical CAD/CAE modeling & simulation.Delivered advanced Mechanical Computer-Aided Engineering system-level modeling & simulation consulting services and technical guidance to members of multinational product development teams.
Ken Henderson Skills
Ken Henderson Education Details
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Syracuse UniversityMechanical Engineering -
University Of RochesterElectrical Engineering
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Eastman School Of MusicPiano
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Hochstein School Of MusicPiano
Frequently Asked Questions about Ken Henderson
What company does Ken Henderson work for?
Ken Henderson works for Thermo Fisher Scientific
What is Ken Henderson's role at the current company?
Ken Henderson's current role is Platform Mechanical Development Manager at Thermo Fisher Scientific.
What is Ken Henderson's email address?
Ken Henderson's email address is kc****@****ons.com
What is Ken Henderson's direct phone number?
Ken Henderson's direct phone number is (866) 356*****
What schools did Ken Henderson attend?
Ken Henderson attended Syracuse University, University Of Rochester, Eastman School Of Music, Hochstein School Of Music.
What are some of Ken Henderson's interests?
Ken Henderson has interest in Information Technology, Spiritual Development, See 22, Reading, Chick Corea, Charlier Parker, Eddie Henderson, Classical Piano, Arts And Culture, Michel Camilo.
What skills is Ken Henderson known for?
Ken Henderson has skills like Product Development, Program Management, Engineering, Integration, Strategy, Leadership, Cross Functional Team Leadership, Mechanical Engineering, Simulations, Management, Project Management, Analysis.
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