1- Perform failure analysis / debugging on the faulty products that failed functional test and identify the root cause of the failure.2- Pursue further analysis if the failure was due to component electrically defective.3- Trigger team and involve in process improvement if the failure was due to manufacturing issues.4- Working closely with Supplier Quality Engineer if the failure was due to supplier’s manufacturing issue to ensure CAPA take place.5- Manage a group of seven (7) technician to ensure WIP is always under control.6- Prepare daily, weekly, and monthly report for QA team and management review.

1- Perform failure analysis / debugging from board until component level on ultrasound system and printed circuit board assembly (PCBA) that failed functional test or return from customers (RMA).2- Troubleshooting tester failures (tester debugging).3- Control and maintain reject WIP at a minimum level.4- Day to day process yield monitoring. Ensure backend processes yield meet target.5- Improve any process whenever it is not meet the target. Apply SPC to improve and control the process.6- Investigate any quality or manufacturing issue, identify root cause (RC) of the failure and pursue for corrective action (CA).7- Review and update PFMEA to ensure all the failures can be eliminated by proper control.8- Control execution of ECN and new BOM updated.9- As a Soldering Trainer to certify skills and abilities of Soldering Operators.

Solid State Drive (SSD) Manufacturing1 - Troubleshooting failure units returned from customers (RMA).2 - Provide a comprehensive failure analysis report.3 - Pursue supplier failure analysis for the confirmed defective parts. 4 - Collaborate with CQE to advise customers on the root cause of the failure, corrective and preventive actions.