Koby Duckworth Email & Phone Number

Waltham, Massachusetts, Us

Overseeing contract manufacturing, product characterization and test resources for client-based operations in high-tech market sectors.

Tualatin, Or, Us

Tualatin, Or, Us

Tualatin, Or, Us

Tualatin, Or, Us

Austin, Tx, Us

Develop Test HW solutions to support the Cirrus Logic WLCSP technical roadmap. Characterization of alternative spring probe suppliers to support pitch and contact metallurgy evolution. Mature supply chain to meet aggressive lead time requirements for 1st article validation for OSAT applications. MEMS Microphone Test HW development. Spearheaded redefinition of MEMS microphone test solution to align with demanding mobile handheld market segment requirements. Developed socket technology for robust handling and probe to pad alignment for light-weight and ultra-small MEMS devices.

Beaverton, Oregon, Us

Roles within the Cascade Microtech changed as the company evolved product and business unit positioning with new CEO and Executive Leadership team.Sr. Product Support Specialist (Center of Expertise): Senior technical advisor to hardware and software architectural design and development for 300 mm probe stations and application layer hardware modules that support functional test and transistor characterization. Provided expert-level application guidance for software architecture, feature set and algorithm optimization. Identified markets/applications and defined product requirements. Developed product training plans for Apps/Sales/Eng/Svc. Created marketing collateral for advertising the value proposition to Sales teams. Provided technical interface for escalated support issues and special application development with strategic Tier1 customers and for emerging markets. Heavy product ideation / innovation responsibilities. Sr. Program Manager (Stations Division): Managed Cascade Microtech’s flagship prober development project; a fully automatic analytical probe station capable of 200mm/300mm wafer handling, best in class noise isolation, direct test head docking capability with integrated manipulator for Parametric and Engineering Lab wafer test. Director of Probe Card Development Engineering: Managed a team of engineers through ideation and development of new probe card architectures supporting Process and Device Characterization and RF functional testing. Company shifted primary revenue focus to Probe Station development and restructured support away from probe card development. Sr. Program Manager (Probes Division): Coordinated the development of production probe card architectures for wafer level test applications. Specific focus - to develop a membrane-based architecture supporting 150µm pitch, <5gm per tip and self-cleaning compliant springs for Microprocessor test. The product was successfully demonstrated to the customer and approved.

Livermore, Ca, Us

Sr. Manager over Probe Card Assembly and Test for the World's largest Probe Card supplier. Developed the Engineering Team and the processes for managing explosive growth in FFI's post-IPO product portfolio from Small Array through Full Wafer Testing over the course of 3 years. Later moved to support New Product Integration for FFI's 2nd generation full wafer test architectures as well as provided technical oversight on Assembly and Test Engineering and Operations.

Santa Clara, California, Us

Redesigned Probe Card mechanical interface to resolve non-uniform probe wear – extended probe head life 20%, enabled 4 mil Cobra to be used beyond previously determined 8K spring threshold. Established comprehensive mechanical modeling and electrical design reviews and prototype evaluation gates to ensure design accuracy and achievement of project goals prior to Production release. Saved $2M in planned spending on ineffective designs in progress upon hire.Re-established overall objectives for test interface development to be better aligned with downstream customer needs.Established forum for collecting direct feedback from customers on product requirements, both current and future.Ensured customer requirements were incorporated into product design.Developed and published roadmaps outlining product capability alignment to internal and external customer needs.Represented AMD on Sematech Probe Council.

Livermore, Ca, Us

Recruited into FFI to ramp Assembly and Test processes from pilot line to HVM Established process SPC control, equipment GR&R, Cpk assessments and data analysis systemsRecruited and assembled highly skilled engineering teamBeta site testing of advanced PC Metrology testers (ITC PB6500 and Rudolph PWX 300)

Santa Clara, California, Us

Having worked for AMD since graduating in 1988 - my responsibilities spanned Fab Process Engineering - Lithography and Reticle generation, Fab Process Integration and Scribe Line Monitor Development, Product Engineering, Sr. Test Engineering, Test Operations Shift Manager, Test Engineering Manager and Sr. Probe Hardware Development Manager.My accomplishments include Logic Test Process and Equipment transfer to AMD Dresden (now Global Foundries), Test Floor conversion/expansion project from Logic to Flash, Key Probe Card Development activities extending the life of Cobra through 150 um pitch and > 12,000 pins, Capital Equipment procurement/installation/qualification and proliferation, Test Process control metrics definition and SPC implementation, Probe Card Analyzer qualification and development of internal Probe Card Repair processes and personnel.

Bachelor Of Science (B.S.), Electrical Engineering - Semiconductor Process

Master Of Science (M.S.), Electrical And Electronics Engineering