Rama Koundinya Potharaju Email & Phone Number

Hyderabad Area, India

Redmond, Wa

• Design verification activities for camera image quality. • Activities include de executing and setup for image quality testing in the lab along with defining mechanical and electrical fixtures required for testing, and other types of testing to verify camera user experiences. • Identification of test tool requirements, and participation in specification and design reviews. • Finding complex bugs, root cause analysis and tracking them while recording or informing others of all appropriate and relevant info.

Rochester, New York Area

• Experience working on latest Rolling/Global shutter pixel technologies/architectures• Familiar with sampling and timing methods for sensor evaluation• Sensor bring up, debugging, supporting during the development phase and product support after release.• Measurement, calculation and analysis of sensor performance characteristics such as dark current, exposure sweep (Dark/Illumination, Low Light, High Light), QE, PRNU, DSNU, sensitivity, read noise floor.• Familiar with various pixel performance noises and their optimization for image tuning and quality improvement• Creating and implementation of algorithms for existing as well as new test cases using MATLAB.• Image acquisition, processing and analysis using MS excel, MATLAB, JMP.• Creating/ debugging PERL test scripts.• Correlation of automated test data generated using in-built software and perl scripts with manually collected data.• Experience in setting up/ debugging hardware according to latest ESD standards and their maintenance.• Experience in procurement, maintenance and calibration of lab equipment.

Semiconductors And Microsystems Fabrication Laboratory, Rit

Project: Research on cooling techniques for 3D ICs using a micro-channel based heat sink and microfluidic principles• Investigated the performance of ICs at varying temperatures using parameter analyzer (HP 4145A) and extracted SPICE characteristics using ICS• Fabrication of front side 12x12 diode array covering of a sensor area of 8x8 mm for temperature sensing. • Back side of the chip consists of 12 inter-cooler Micro-channels with fin arrays of varying density which line up directly beneath the diode base columns on the chip front-side which are fabricated using DRIE process.

Master'S Degree, Electrical Engineering, 3.02/4.00

Bachelor Of Engineering (Be), Electrical And Electronics Engineering