Kris Erickson work email
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Kris Erickson personal email
With broad and extensive applied research experience in the fields of chemistry, physics, materials science, and reliability engineering, I have consistently developed business relevant breakthrough technology solutions in the domains of 2D print (printed electronics), 3D print (metal, electronics & polymer printing), flexible/stretchable electronics, bioelectronic sensors and microfluidics. These solutions have been developed within a broadening leadership framework as I've begun manage larger teams and create an expanding network of internal and external collaborators, partnering broadly to find efficient and creative ways to undertake complex technology solution spaces.My leadership philosophy centers around empowering all individuals I engage with to embrace their personal drive for their work, creating larger picture frameworks & a compelling vision forward, partnering broadly for alignment & creative solutions potential, and leaning into the complexity of detailed planning for focused and rewarding plan execution.
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Sr. Technical Program ManagerAmazon Aug 2024 - PresentSeattle, Wa, UsLast Mile Tech - Sr. TPM, SW Development -
Hw Engineering Manager & Research Program ManagerMeta Oct 2021 - Jun 2024Menlo Park, Ca, UsReality Labs - Research: Interactions Lab- Led HW R&D team focused on materials, electronics fabrication, device prototyping, printing (2D/3D), reliability, and failure analysis to transform electronics possibilities for a new wearable compute paradigm- Full life-cycle research program leadership from inception & New-to-World (0→1) to TRL 5 and robust integration into research products and product prototypes- Defining & leading Research Program strategy (vision, direction, sponsorship, planning, resourcing, collaboration, timely execution), simultaneously running multiple projects within program- Solved key needs within: neural interface electrodes, flexible & stretchable electronics, high-density microfluidic haptics (silicones), electronics packaging (RDL, flip-chip, AiP, thermal, etc.)- Integrated into sub-systems & systems: neural wristbands, haptic gloves, flexible electronic backplanes- Broad cross-functional collaboration (PM, TPM, ID, ProtoEng, MechE, ToolEng, EE, Bioelectronics, Simulation/Modeling, BioC, RF, Rel/FA, SysEng, FW, ML) for creation of functional prototype consumer electronic devices- Materials spanning: polymer & metal systems, composites, thermal materials, nanomaterials, dispersions, interfacial adhesion- Manufacturing processes spanning: micro-molding, compression/transfer molding, 2D/3D print, wafer/panel-level processes- World-class lab build-out (materials, molding, electronics fabrication, reliability, failure analysis, 2D/3D print) & drove lab safety initiatives- World-wide engagement & collaboration with supply-chain (materials, CMs), tool & fabrication vendors, research organizations- Led Heterogenous Integration Roadmap chapter on Additively Manufactured Electronics -
Research ManagerHp Jun 2019 - Sep 2021Palo Alto, Ca, UsLed multiple research projects with foci in metal 3D printing and 3D printed electronics, as we look to transform the future of manufacturing and allow for new designs and possibilities which have been heretofore impossible. -
Principal Investigator For 3D Printed ElectronicsHp Jan 2018 - May 2019Palo Alto, Ca, UsAs PI for our 3D PE research efforts at HP Labs, I investigated the incorporation of various electronic components into 3D printed parts, brought team members onto the project, developed a range of collaborations including a highly fruitful international research collaboration, and garnered interest in and enthusiasm for our 3D PE efforts through both internal and external engagements. -
Senior Materials Science Research Associate - Hp LabsHp Sep 2016 - Dec 2017Palo Alto, Ca, UsI led research projects revolving around the voxel-level control of material properties (electronics and mechanical) within 3D printed parts as well as developed a new method for metal 3D printing. By leveraging my expansive previous research experience in nanomaterials, polymer science and metals systems, I consistently developed highly relevant technology solutions leading to adoption of these solutions by our internal business partners for further program development within HP's growing 3D Printing business. -
Material Science Research AssociateHp Aug 2014 - Aug 2016Palo Alto, Ca, UsMy HP Labs research investigations began with pushing the limits of the new HP MJF 3D print platform and developing the frameworks for metal 3D print and voxel-control of material properties research which I later expanded upon. -
Postodoctoral ResearcherSandia National Laboratories Jul 2012 - Aug 2014Albuquerque, Nm, UsMy postdoctoral position was in the Materials Physics Department within Sandia National Labs located within the satellite site in Livermore, CA. My research here continued my focus on nanomaterials synthesis, characterization, and device analysis for various application purposes, especially for advanced energy applications.I focused on the development of an analytical Transmission Electron Microscopy (TEM) technique for analyzing strain and crystalline disorder within nanomaterials, especially thermoelectric chalcogenides, as well as investigated the thermoelectric properties and optical response within carbon nanotube devices. -
Graduate Student ResearcherLawrence Berkeley National Laboratory Nov 2006 - Jul 2012Berkeley, Ca, UsMy graduate studies at University of California - Berkeley in the labs of Alex Zettl in the Physics Department and at Lawrence Berkeley National Laboratory focused on the synthesis, functionalization, characterization, and application of nanomaterials. I focused on carbon and boron nitride related nanomaterials with investigations into the atomic structure of graphene oxide using atomic resolution aberration corrected TEM techniques as well as developed the first scalable synthesis for boron nitride nanoribbons. -
Chemical Engineering InternZimmer Ag May 2006 - Aug 2006I was awarded this internship through the Steuben-Schurz-Gesellschaft German-American Organization program to work as a Chemical Engineering Intern at a polyethylene terephthalate (PET) industrial scale plant design company, Zimmer AG. Here I developed a study on incorporating nanomaterials within the PET plan design plan.
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Chemical Engineering InternThe Dow Chemical Company May 2005 - Aug 2005Midland, Michigan, UsMy internship at Dow Chemical focused on assisting in the run plant engineering operations at a poly-urethanes production plant. -
Undergraduate Research AssistantUniversity Of Minnesota Mar 2004 - May 2005Minneapolis And St. Paul, Minnesota, UsMy undergraudate research was within the T. Andrew Taton labs in the Chemistry Department. Here I worked on developing plasmon waveguides using gold nanoparticle block co-polymer micelle arrays.
Kris Erickson Skills
Kris Erickson Education Details
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University Of California, BerkeleyChemistry -
University Of MinnesotaChemistry -
University Of MinnesotaChemical Engineering
Frequently Asked Questions about Kris Erickson
What company does Kris Erickson work for?
Kris Erickson works for Amazon
What is Kris Erickson's role at the current company?
Kris Erickson's current role is Sr. Technical Program Manager.
What is Kris Erickson's email address?
Kris Erickson's email address is ke****@****ook.com
What schools did Kris Erickson attend?
Kris Erickson attended University Of California, Berkeley, University Of Minnesota, University Of Minnesota.
What skills is Kris Erickson known for?
Kris Erickson has skills like Nanomaterials, Nanotechnology, Materials Science, Chemistry, Nanoparticles, Characterization, Spectroscopy, Afm, Experimentation, Physics, Scanning Electron Microscopy, Xps.
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