Dr. Balachander Krishnan Email & Phone Number

Kavali, Ap, In

Hyderabad, Telangana, In

Indosol Solar Pvt Ltd (ISPL) is an SPV formed by Shirdi Sai Electricals Limited (SSEL) to execute one of the largest integrated solar PV module manufacturing project. ISPL has also received PLI (Production linked Incentive) from MNRE (Ministry of New & Renewables Energy), Government of India.Since 2021, ISPL is into Renewable energy with a long-term vision of manufacturing complete Integrated PV-manufacturing from Polysilicon to Module along with Key ancillary manufacturing BOM components like Glass, EVA, Aluminium Frame, etcAt ISPL, I am currently planning the entire downstream activities from Ingot to Wafering to Solar Cell to Solar Module, comprising of hiring new colleagues (complete team building exercise) for different departments, basic/detailed design engineering for utility, technology selection, process & technology roadmap, architechture/construction/Integrated Site Master Planning, procurement planning, equipment selection, equipment finalization, negotiations and contracts, vendor registration for local value addition, etcIndosol Solar Private Limited has proposed to setup fully integrated solar PV module manufacturing facility with 10 GW/Annum using state-of-the-art technology in Andhra Pradesh, India and planning to expand it upto 20GW/Annum in phases.The first phase of the project would involve manufacturing process at two levels namely:1) Upstream: Metallurgical silicon & Polysilicon plant with 10GW capacity.2) Downstream: Ingot, Wafer, Cell, Module of 10GW each and Glass 1000 tons per day.

Mumbai, Maharashtra, In

Operations Head For Setting up 4GW Solar Cell/Module Manufacturing, including cell/Module technology selection, cell/module line equipment finalization, utility packages, overall project planning & management, land acquisition, building design requirements, making RFQs, technical specifications, vendor selection, for cell line line equipments & individual utility packages (Gas, chemicals, water, CDA, power, exhaust, safety, etc).

Ahmedabad, Gujarat, In

Ahmedabad, Gujarat, In

Coordinate to acquire resources to achieve production targets.Index-driven, organizing indices reports to get focus.Raise demands & highlight defects in daily production meeting.Trace trouble-shooting result and feedback in time.Supervising team execution and giving feedback to encourage motivation.Set detailed job description & assignment for operators.Develop & execute a training program for new recruits.Arrange team members working assignment properly with minimum manpower.Summarize input/output for all equipment with accuracy.Minimize rework rate/broken rate to improve efficiency.Summarize material consumption to work out comparison for further improvement.Search to evaluate alternative suppliers for consumption materials to meet both quality & cost requirement.Support processing engineering & equipment engineering to improve quality & yield.Support company wide strategy to arrange production line.Train & certify operators to perform daily routine operation.Tracking local government policies and incentives; communicating the same to company management.Achieve cost effective through increasing throughput, improving yield, releasing second source, decreasing consumables and zero miss-operation.Establish documentation, such as W.I., SOP, Data Collection & Trace Records.Deliver weekly & quarterly report.Support to achieve quality certification.

Nano-imprint lithography for functional organic & inorganic devices – Solar Cells, Sensors, LEDs,& Printed ElectronicsPECVD based barrier encapsulation thin films for organic devices – Organic solar cells, OLEDs, etcInkjet & Screen printing for functional organic & inorganic devicesFlexible Thin film Solar Cells – CIGS, CZTSSe based devicesCrystalline Silicon Solar Cells – Nanoimprint lithography for nano-texturization and front sidemetallizationMoS2, MoSe2, Graphene based Solar CellsThin Film GaAs Solar Cells using Epitaxial Lift offThin film Thermoelectric DevicesNanostructured Anodes for Li-ion Batteries

Utica, Ny, Us

Flexible Nanostructured CIGS Solar CellsUltrasonic Spray Pyrolysis for ARC on Glass

Principal Coordinator & Team leader (Continuous Improvement Program - Process support group) to implement R&D upgrades (DEPx Platform – Industrial PVD & PECVD coating tool – SiO2, SiNx, DARC, a-Si, ZnO, CIGS, ITO, etc., for Solar cell Technology) with several customers in China & Taiwan. The duties associated with this position includes normal duties associated with the position of process manager, managing all kinds of process details in-depth for solar cell technology to achieve higher efficiency compared to competitor tools (Texturization, antireflection coatings, Firing optimizations, Printing technology), including technology transfer of research to production, organizing regular teleconference meeting with China & Taiwan office to coordinate various field activities & Continuous improvement program Projects: RI gradient layers, Pulsed Plasma PECVD, Line Source PECVD to improve color uniformity, Potential Induced Degradation- free Silicon Nitride, Double Anti-reflection Coatings (Si3N4 & SiO2), Carrier design changes to improve color uniformity, Technology evaluation of dry etching for texturization using ETP sources, RF plasma treatment prior to nitride deposition, a-Si coatings on Nanowire templates for battery application, ARC’s on glass, Edge isolation using ink-jet printing for Hetero-junction solar technology & several projects based on ink-jet printing technology for printed electronics (OLEDs, Organic Solar, etc)

Enschede, Overijssel, Nl

STW project : Optimisation & Fabrication of Sub-100nm nano-gratings with NanoimprintLithography utilizing modified Bosch type etching in an Inductively coupledPlasma etching (production type) tool.o Nanoimprint Lithography for optimization of OLED & Organic Solar cellso Optimization of sub-micron structures for surface acoustic deviceso Guiding several Ph.D. Students & Masters students for relevant projects

Eindhoven, Noord Brabant, Nl

Prototype fabrication of III-V materials (GaAs, InP & GaN) based LASERS, LEDS & OptoelectronicICs within the fabrication facility. In particular, I was involved to optimize the processfabrication (Optimization with respects to Photolithography, dry/wet etching – Semiconductor& dielectrics, Spin Coating, Metallization & Back-end process with a view of improving deviceperformance, manufacturability and device yield. Managing Process Engineers and Process Technicians for various projects :-o To contribute and to assist in the transfer of new process steps to external fabricationvendors. Travel outside the Netherlands to various fabless companies to discuss onvarious issues of projects and timeline constraints.Documenting Front-end and Back-end processing flow charts. Also as a Team leader, travelledoutside Netherlands to various fabless companies to discuss on various issues of projects andtimeline constraints and to feed back the results.Hands on Experience at Miplaza (Philips Clean Room), Eindhoven, NetherlandsASML PAS5500/100 Stepper Lithography, MA-8 Karl Suss Mask Optical lithography, Spincoating (Laktrack ACS200), STS Cluster tool (Reactive Ion Etching), Unaxis Shuttle lock (Reactive Ion Etching), STS PECVD 315 PC twin, SEM-XL40 FEG, Dektak V 200Si, Flexus F-5200 stress meter, Tencor 4500 surfscan, Nanospec 6100, four dimensions 280i (4 point probe), Dektak 6M, RTA Furnace, Alcatel DC/RF Sputtering, Pfeiffer Spider system 630 (Metal/oxide RF/DCsputtering), Alcatel Plasma CVD (SiO2/Si3N4), Oxford ICP – CVD, Oxford Flexal ALD, Alcatel Oxygen plasma oxidation/cleaning system, UV-Ozone Oxidation, Oxford plasma 100 – Reactive Ion Etcher (RIE), Oxford plasma – ICP etcher, Contact Mask Aligner (Karl Suss MA-6/MJB-3), Rapid thermal Annealing (RTA) furnace, Wet Benches, trained in Ultra clean processing room, Processing in different class (Gold contaminated, Copper contaminated, Pure silicon)

Leuven, Be

 Device Processing and Characterization of Atomic Layer Deposition (ALD) based High-K dielectrics (HfO2, Al2O3) For AlGaN/GaN MOS-HEMTs applications. Trench gates and Field plates on AlGaN/GaN HEMTs for high breakdown applications. Effects of different buffer thickness to minimize the current collapse effect on AlGaN/GaN HEMTs. Effects of different pressure condition on buffer interlayers to optimize the current collapse effect and breakdown voltage.  Passivation effects of dielectrics (SiO2, Si3N4, Ta2O5, and Al2O3) on AlGaN/GaN HEMTs. Different in-situ plasma cleaning (N2, H2, He, NH3) with different plasma powers to minimize the current collapse effect. Fabrication and characterization of Enhancement mode AlGaN/GaN HEMTs. Effect of TaN as a gate metal for AlGaN/GaN HEMTs Setting up Pilot Line (EpiGaN) of AlGaN/GaN HEMTs for large area wafer processing (6 Inchand 8 Inch AlGaN/GaN/Silicon wafers).Management: i) Provided research guidance to Doctorate, Masters, Bachelor and Intern students atIMEC ii) Key person in Gallium Nitride (GaN) device fabrication group for device processing andelectrical characterization through constant hands-on technical support. iii) Collaboration betweenIMEC and Oxford Plasma Technologies for Atomic Layer Deposition (ALD) of High-K’s on AlGaN/GaN HEMTs.

Chennai, Tamil Nadu, In

 Design, fabrication and reactor optimization of Liquid Phase Epitaxial (LPE) growth technique. LPE Growth and characterization of AlGaAs/GaAs for solar cell applications, withdifferent Al concentrations. Wafer bonding of GaAs/Si using SeS2 for solar cell applications: Sponsored research project byNuclear science Centre, India. Bulk growth (Czchoralski) and characterization of Ge crystal for solar cell applications:Sponsored research project by Indian Space research organization (ISRO) for the developmentof space quality solar cells.o Growth and characterization of InGaAs/GaAs & InGaSb/InSb, InGaAsSb/InSb for solar cellapplication, with different In & Sb concentrations.

 Design and fabrication of GaN MESFET, AlGaN/GaN HEMTs, MOS-HEMTs, MISHEMTs, MISFETs and MOSFET structures on Sapphire, SiC, Si substrates and AlN/Sapphire templates. Design and fabrication of low leakage current for AlGaN/GaN HEMTs, AlGaN/GaN MOSHEMTs/MIS HEMTs on sapphire substrates. Effects of passivation on the fabricated devices using various dielectric materials (eg. PECVD grown SiO2, Si3N4, SiON and etc). Device quality AlGaN/GaN epilayer growth optimization on 2-inch and 4-inch Sapphire and Siliconsubstrates. Schottky diodes were fabricated using various metals (Al, Ti, Au, Pd and Ni) on MOCVD grown GaN and AlxGa1-xN/GaN samples. MOS/MIS diodes were fabricated using different oxides and nitrides including SiO2, Si3N4, SiON, and ZrO2 for the successful fabrication of MOS-HEMTs/MIS-HEMTs. Studies of fabricated devices for high temperature, high power and high frequency applications.

Post Graduate Diploma In Business Management, Strategy, Innovation & Leadership

Six Sigma Black Belt Certification, R&D, Manufacturing, Process Development

Ph.D., Semiconductor Devices / Materials Science & Engineering

Master Of Science (M.Sc.), Materials Science

Bachelor'S Degree, Physics

Education record