I am President and Chief Scientist at LILOTREE. I lead efforts of advanced engineered materials development and product improvement solutions at LILOTREE for numerous customers in various industries including aviation-aerospace, medical electronics, semiconductors, etc. Have been the key member in development of award-winning, commercially successful, proprietary, innovative ENIG-Premium, Ni-less ENIG-Premium and other surface finish solutions for PCB & semiconductor industries. Previously, worked as a Sr. Research Scientist at Intel Corporation and Pacific Northwest National Lab (PNNL). At Intel, I developed polymer interlayer, dielectric and passivation material that led to the design, adoption and integration of polymer passivation materials in Intel IC products in 2008. Recipient of several industry awards and authored several scientific papers and issued/pending patents for over two decades.