Eric Kuo Email & Phone Number
@intel.com
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Who is Eric Kuo? Overview
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Eric Kuo is listed as IC Substrate Technical Program Management and Integration at Intel Corporation, a with 114813 employees, based in Chandler, Arizona, United States. AeroLeads shows a work email signal at intel.com and a matched LinkedIn profile for Eric Kuo.
Eric Kuo previously worked as Advanced Packaging Technical Project Program Manager at Intel Corporation and Staff Engineer, CFD, IC Packaging, IC Substrate, TCAD at Intel Corporation. Eric Kuo holds Ph.D, Mechanical Engineering from University Of Florida.
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About Eric Kuo
6+ years' experience on 2D/3D reactor-scale, electrochemical, two-phase, thermal-fluid, heat transfer, chemistry reaction, dynamic mesh, modeling support and project management for advanced electronic packaging, substrate processes in a world-lead semiconductor companyPhD in mechanical engineering and MS/BS in aeronautic engineering with 15+ years experiences in Thermal, Heat and Mass Transfer, Fluid Dynamics, and Electrochemistry fields, specializing in analytical analysis, numerical and modeling design of experiments, electrochemical and thermal-fluids systems. Great experiences on characterization, improvement, and optimization of HVM manufacturing tools. Specialties: Design of experiments, data acquisition and instrumentation communication, electrochemical and thermal-fluid system analysis, analytical and numerical modeling (Fluent, CFD, FEA), LabVIEW, MATLAB, FORTRAN, C, PYTHON, AutoCAD, Pro/E, SpaceClaim, Fluent in English, Mandarin, and Taiwanese
Eric Kuo's current company
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Eric Kuo work experience
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Advanced Packaging Technical Project Program Manager
Current-- Managed advanced packaging program/project from TO, NPI, to HVM-- Enabled multiple advanced packaging substrate suppliers from NPI to HVM
Ic Substrate Technical Program Management And Integration
-- Client Substrate Technology and Supplier program management from core material to assembly HVM Ramp-- Substrate technology development, transfer and qualification-- IFS program management-- Critical substrate modules enhancement-- Pathfinding building blocks development
Staff Engineer, Cfd, Ic Packaging, Ic Substrate, Tcad
-- Developed and applied Deep learning/Neural Network for unit electroplating prediction -- Developed scripts that applied Machine Learning algorithms to build a predictive model from millions of data pts to successfully predict the critical features that impact the final yields -- Drove and integrated unit-scale layout modeling capability into ATTD design working flow --> Significant impacts on layout design before tape-out to manufacture-- Developed a script to automate unit-scale layout electroplating prediction --> Huge turn-around-time and engineer resource savings -- Developed modeling support for HVM substrate supplier and identified critical knobs to improve within-reactor/-panel process uniformity, enabling CPK to meet Intel's process criteria. Helped leverage and negotiate huge savings on pricing --> ATTD's Divisional Recognition Award-- Worked with module engineers and external vendor to develop next generation process tool/reactor. Physics-based model recommendations on tool design and evaluation.-- Innovative xxx design and optimization to improve process uniformity. -- Managed modeling technical support of substrate frontend and backend HVM process pathfinding and tool development
Senior Software Engineer, Cfd, Ic Packaging, Ic Substrate, Tcad
-- Support and bring modeling support capability from TCAD OR to help customers identify and resolve critical electronic substrate manufacturing process issues-- Develop and create physics-based, dynamic, and fully-transient models from feature scale to HVM scale reactors, including Electroplating, Electroless Plating, Ultrasonic Cleaning, Micro-etching, De-smear, Drying, Microball processes-- Implement analytical and numerical models to optimize process operating conditions and tool designs, resulting in significant yield increases, engineer time, and cost savings -- Closely collaborate and coordinate with module engineers for design of experiments to collect data for model validations. -- Demonstrate modeling results and deliver recommendations to modules for both tool and process improvements on a regular basis-- Exercise Lean philosophy on a daily basis to facilitate model and code development to resolve process issues-- Manage, evaluate, and prioritize projects on a regular basis as the single on-site modeling support engineer with limited resources-- Expand support scope from one module to several areas with validated and concrete deliverables-- Continuously develop and modify pre-/post-processing code to facilitate demonstration of the transient, dynamic modeling result
Postdoctoral Researcher
&& Guided PhD students to understand and modify the system model I developed for a DMFC system in laptop application for optimization study&& Helped students set up experimental rigs and resolved technical issues
Fuel Cell Research Assistant
** Experienced in designing and conducting experiments&& Over 4 years experience in development of a DMFC system for laptop application.&& Performed qualitative electrochemical measurements, such as polarization curve, AC impedance spectroscopy, and cyclic voltammetry, to analyze the characteristics and performances of the electrodes of DMFCs and PEMFCs.&& Experienced in stack design, assembly, leak test, break-in, and performance measurements of PEMFCs and DMFCs.&& Designed, conducted, and analyzed the concentration of water vapor and CO2 at the cathode side to characterize the water balance of DMFCs.&& Evaluated, configured, and integrated concentration, pressure, temperature, and humidity sensors into the experimental system to expand the measurement capability.&& Experienced in error analysis of instruments to source out uncertainties of the experimental data.&& Developed LabVIEW programs to accurately control and acquire data from various instruments to facilitate and automate experiments, enabling long-term testing.&& Analyzed heat transfer of DMFC stacks and implemented PID controllers to adjust the mass flow rate of the cooling air to achieve thermal management of the stack. && Statistically reduced and analyzed experimental data to regularly generate technical reports for funding agencies**Ability to construct detailed engineering models&& Utilized MATLAB to design fuel cell models for laptop and vehicle applications. && Used MATLAB to develop a sophisticated design-oriented single model to accurately simulate the cell performance, methanol crossover, water balance, and multi-component mass-transport phenomena in novel MEAs with a hydrophobic liquid barrier layer.&& Utilized Pro/E Mechanica to perform 2D/3D finite element analysis (FEA) in heat transfer and stress of designs, resulting in full score.
Research Assistant
&& Established MEMS technology in the lab&& Applied MEMs technology to manufacture a micro-atomizer with impinging jet to study the water atomization&& Designed atomizers with internal-mixing chamber and impinging jet to physically generate solder powder with average size of 10~20 μm&& Out licensed the research results to a commercial company&& Worked and communicated with machinists in machine shop to manufacture designed atomizers&& Used Insitec system (particle size analyzer) and Coulter Multisizer to measure particle size distribution
Colleagues at Intel Corporation
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Julia Fedorova
Colleague at Intel CorporationMunich, Bavaria, Germany
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Steve Eisenhart
Colleague at Intel CorporationMaricopa County, Arizona, United States
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Tori Schultz
Colleague at Intel CorporationSt Louis, Missouri, United States
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Igor Misiak
Colleague at Intel CorporationGdynia, Pomorskie, Poland
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James Kim
Colleague at Intel CorporationSan Jose, California, United States
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Daisy Lee
Colleague at Intel CorporationTaiwan, Province Of China
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Anson Davis
Colleague at Intel CorporationPortland, Oregon, United States
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Trevor Harcrow
Colleague at Intel CorporationTempe, Arizona, United States
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Gong Jinlong
Colleague at Intel CorporationChengdu, Sichuan, China
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Samuel Hillebrand
Colleague at Intel CorporationPortland, Oregon, United States
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Eric Kuo education
Ph.D, Mechanical Engineering
Master Of Science, Aeronautics And Astronautics Engineering
Bachelor Of Science, Aeronautics And Astronautics Engineering
Frequently asked questions about Eric Kuo
Quick answers generated from the profile data available on this page.
What company does Eric Kuo work for?
Eric Kuo works for Intel Corporation.
What is Eric Kuo's role at Intel Corporation?
Eric Kuo is listed as IC Substrate Technical Program Management and Integration at Intel Corporation.
What is Eric Kuo's email address?
AeroLeads has found 1 work email signal at @intel.com for Eric Kuo at Intel Corporation.
Where is Eric Kuo based?
Eric Kuo is based in Chandler, Arizona, United States while working with Intel Corporation.
What companies has Eric Kuo worked for?
Eric Kuo has worked for Intel Corporation, University Of Florida, and National Cheng Kung University.
Who are Eric Kuo's colleagues at Intel Corporation?
Eric Kuo's colleagues at Intel Corporation include Julia Fedorova, Steve Eisenhart, Tori Schultz, Igor Misiak, and James Kim.
How can I contact Eric Kuo?
You can use AeroLeads to view verified contact signals for Eric Kuo at Intel Corporation, including work email, phone, and LinkedIn data when available.
What schools did Eric Kuo attend?
Eric Kuo holds Ph.D, Mechanical Engineering from University Of Florida.
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