Kurt Spears Email & Phone Number

Fort Collins, Colorado Area

Fort Collins, Colorado Area

Graduate student in CSU's one year Master of Finance Program. Completing a finance degree to augment my technical degrees and experience.

Chicago, Il

Worked with internal development teams and external vendors to develop next generation CMOS camera modules for mobile handsets. Investigated and worked with team to prototype image processing algorithms utilizing machine learning and convolutional neural networks.

Fort Collins, Colorado Area

Responsible for designing and implementing innovative solutions that make mobile technologies more usable and will change the way people can interact via their mobile devices.

United States

Responsible for working with internal development teams and external vendors to develop next generation CMOS camera modules for mobile handsets. Responsible for future imaging technology roadmap and tracking industry technology and cost trends. Participated in technology selection and development for multiple internal projects. Interfaced with Motorola Mobility’s Advanced Technologies and Projects (ATAP) group to support procurement of emerging imaging technology components including sensors, optics and image processing ASICs.

San Diego, Ca

Responsible for technology development and future roadmap for image sensors and camera modules. Hewlett Packard, IWS Innovations Lab 2011 - 2012 R&D Master Engineer for Imaging TechnologyResponsible for technology roadmaps and corresponding technology development for imaging and projection systems in the IWS Innovations Lab. Responsible for technology development to drive cost and performance of projection, imaging camera and depth sensing technologies. Worked internally and externally to define and implement first and second generation solutions. Investigated and prototyped key subsystems and documented critical system interactions of the projector, image sensors, and depth sensors. Worked internally and externally during product development to integrate components and to resolve system and component issues. Lead effort to define second generation imaging and projection architectures and the technologies required to enable a cost reduced and size optimized system.

Boise, Id

Responsible for imaging technology roadmap and technology development for imaging systems on all LaserJet All-in-One (AiO) products. Managed technology development to drive cost and performance of imaging and paper handling technology. Worked internally and externally to define and implement next generation solutions. Developed component specifications and test methods for key components of imaging system including sensors, analog-to-digital converters, optics and illumination. Worked internally and externally during product development to integrate components and resolve system and component issues. Optimized component design and product integration to meet performance and image quality requirements.

San Diego, Ca

Developed new imaging technologies for high speed document capture for A3/A4 formats at up to 80 ppm. Developed and produced A6 and A7 size scanning modules for check and card scan products. Invented and demonstrated a new scanning technology that provides low-cost high performance transparent media scanning for Contact Image Sensor(CIS) and Reduction Optics(RO) products. CIS design enabled transparent scanning capability for platforms which previously could not offer the solution. The new technology enables greater than 2X speed performance and high IQ while achieving a 50% reduction in material cost.

San Diego, Ca

Worked externally and internally to co-develop two new CIS sensor technologies which were used across the high volume (>30M annual) AiO CIS Inkjet product lines. The CIS sensor solution enabled higher performance and higher specification (ppi, ppm) at significantly lower component cost. Worked with vendors to establish technology pricing and exclusivity.Developed a novel CCD technology that enabled a 2X increase in ppi while utilizing existing optical carriage on an extremely compressed development schedule. Worked with vendors to establish technology pricing and exclusivity.Coordinated development and qualification of multiple technologies and a cross-linked supply chain to allow optimized costing for high volume CIS modules. This effort allowed lowest cost components to be used by all module suppliers and increased flexibility while reducing cost.Worked across multiple HP divisions to drive efforts for increased color accuracy via optimized illumination systems. Led an internal effort to prototype and verify new technologies for increased color accuracy for CIS scanners.

Greeley And Fort Collins, Co

Developed a dual resolution CCD technology that enabled high resolution scanning while also allowing high throughput low resolution scanning. Worked with CCD vendors to establish technology, costing and exclusivity. This technology has been used in four generations of HP scanners and MFPs across multiple product lines.Developed high performance three channel Analog to Digital (A/D) converters to support increases in resolution and scan speed and provide appropriate DC offsets and analog gain to support CMOS and CCD sensor technologies. Worked with multiple OEM suppliers to integrate advanced technology and optimize image quality for products. Combined multiple new technologies to create HP4600 see-through scanner. The HP4600 utilized new sensor, scan module, AFE, ASIC and carriage/transport designs to achieve unprecedented industrial design and usability. Consulted with HP Camera Team for sensor development and integration into HP digital cameras. Work with internal and external teams to track and resolve image quality or performance issues.Created and presented in-depth technology seminars for European, US and Japanese press. Presented seminars and product hands-on demonstrations at the HP Labs European press event four years covering scanner and AiO technology.

Doctor Of Philosophy (Ph.D.), Computer Engineering

Activities and Societies: Letterwinner on Iowa State Track and Cross Country Teams

Master'S Degree, Electrical And Electronics Engineering