- Process owner of wirebonding, burn in and alignment which involves sustaining production, new product introduction, maintain process specifications for training production personnel- Data analysis and perform improvements of production results such as yields, cycle time, reworks and scraps- Project leader of cost reduction projects in the above mentioned processes: (1) Implementation of 1.0mil to 0.8mil Au wire conversion across all products that saves 28% in cost and improves cycle time by 40% by optimizing the processes; (2) Implementation of four-sided glue dispense in alignment process which eliminates backfill process. Cycle time of alignment and final test greatly improved; (3) Reworking process of defective parts in burn in.

- Sustain process and equipment of wafer back end manufacturing processes, such as die singulation, pick & place/die sorting, scribe and break/wafer saw and visual inspection to support existing and new product/process development (NPI) - Perform continuous improvement in yields, cycle time and cost of capital equipment- Collaborate with Product Engineering, RND and Manufacturing to establish processes for new products-Document and maintain process specifications and train production personnel.- Co-owner of automatic optical inspection process for 3DS products

- Implementation of TS 16949 for use of quality control and inspection for new, existing and pass-through automotive products- Responsible for completing customer’s Supplier Quality Assurance Manual (SQAM) to define the minimum requirement to assure quality of their products throughout the various stages of part vehicle development- Responsible for reliability testing of parts during Process Change Requests (PCR) and Engineering Change Instructions (ECI) during material/process revision- Participate in drawing review, PFMEA, control plan development and quality review stages- Manufacturing support by giving countermeasures to quality-related issues, understanding in-process problems and coordinate with other departments to do resolution- Interface with the customer relating PPAP, manufacturing quality issues and returned products- Evaluate data, set control levels and maintain SPC control charts

- Instructor for Wafer Fabrication Laboratory Class of CME Department- Demonstrates basic wafer fabrication processes and use of equipment such as wet benches, furnace, aligner (photolithography), PVD by evaporation, metrology tools (Nanospec) and four-point probe testers- Assigns process development experiments beyond the scope of the course program

- Assisted MPE laboratory course instructors in operating wafer fabrication equipment such as wet benches (Piranha, RCA sequential steps such as SC-1 and SC-2), furnace, metal deposition, metrology tools from bare Si wafer to functional device and device testing using four-point probe tester- Managed the stock of chemicals, chemical wastes and other laboratory supplies- Supervised open laboratory hours for CME undergraduate and graduate student’s projects; and outreach activities and hands-on workshops for high school students during seminars and training

- Assisted in manual manufacturing thin film solar cell from doped silicon:o Wet bench processing (SC-1, Anodic Etching, Texturing)o Wire tabbing and laminationo Solar cell testing using solar simulator- Maintained cleanroom cleanliness and organization.

- Conducted wirebond machine operation (K&S and ASM models), material characterization and process qualification using DOE, AutoCAD and SAS JMP Analysis- Manufacturing support for process or machine problems to ensure quality, reliability at low cost- Supervised and trained process engineers, wirebond machine operators and technicians & technical associates- Performed new wirebond machine/material qualification- Ensured proper implementation of established process in manufacturing lines