Senior Component Engineer at CommScope, performing global material and process standardization.

Lead mechanical design engineer at a major telecommunications equipment manufacturer. Duties include performing mechanical design on telecommunications components from PCB level up to shelf and rack detailed design and assemblies. I have extensive experience with PCB design and layout, thermal analysis, sheet metal design, extrusions, die cast, and injection molded parts. Pro/E power user with over 15,000 hours. I have been using Pro/E continuously since 1995, current to Creo 2.0. Strong familiarity with Pro/E database tools including PDMLink, Intralink, ProPDM, etc. Very experienced engineer in the electronics/telecommunications industry with strong design background from the PCB component level to shelf and rack assemblies and OSP telecom enclosures.My daily duties also entail leading mechanical project designs, including budgeting, scheduling, interfacing with hardware and ECAD design disciplines on a constant basis, reporting to management, managing projects, proposing new projects, etc. Extensive history with equipment testing, very familiar with NEBS/Telecordia, UL, FCC regulations, etc.In my time at Fujitsu, I successfully drove numerous projects to completion, including (but not limited to) shelf level design projects, numerous cost-reduction efforts, the development of several new PCB assemblies incorporating cutting edge technology (40/100 G optics), and the identification, development, and introduction of a number of new polymer materials into Fujitsu products. In leading project development, I was involved as technical lead from inception to completion, including broad conceptualization, refinement of design, development of rough schedules and budgets, obtaining project approval, and then detailed design execution through prototype phase, testing, and ultimately release. Skills range across the spectrum of product development in a mechanical and electronics packaging environment.

Lead mechanical design engineer on a series of outdoor telecom enclosures designed and manufactured for Calix, Inc. Lead all design efforts including budget, schedule, architecture design, detail design, etc. Lead mechanical design effort to produce a low-cost rack-mounted supercomputer. Designed new chassis from ground up including rack- mount slide rails, numerous I/O front and rear, extensive internal cabling, and extremely tight packaging. Wrote proposals to bid on a system of beer/wine sales kiosks for use in the State of Pennsylvania.

Participated and at times led team activities to produce a new telecom equipment chassis (shelf), ONS15600. Design activities ran from high-level concepts to detail design and drawings. Performed thermal analysis at the PCB and system (shelf) level. Extensive Pro/E use with focus on sheet metal, die cast, complex system assemblies, and PCBs.