Larry Zu, Ph.D. Email & Phone Number

• One-stop turnkey service: wafer-in, chip-out.• Our customer includes world’s top 10 semiconductor company, world’s top 10 software IT company, large system company, ASIC design service company, medical equipment company, and high-flying startup in Silicon Valley and across the US.• High performance, high pin count, and high power semiconductor package design.• Low cost RF package design.• SiP, MCM, and 2.5D Si interposer package design.• Power/signal integrity channel sim with chip, package, & PCB for >56G SerDes and >3G DDR4.• We have successfully taped out many packages, all first time success.• Probe card design, simulation and fabrication for RFIC and ASIC SoC.• Final test loadboard, socket, and change kit design, simulation and fabrication for RFIC, ASIC SoC, SiP, MCM and 2.5D Si interposer.• Translate WGL, STIL, and EVCD test vectors to ATE test programs for multiple test platforms.• Engineering debugging of test hardware and software from prototyping to production.• Production wafer probing, assembly and final test service.• Product qualification. • Logistic handling, supply chain management and RMA in production.

Hsinchu Science Park, Tw

Semiconductor product engineering for world's No.1 networking company.• Managed products’ revenue is about US$0.5B over their lifetime • Doubled or tripled wafer yield in <18 months for all chipsets• Q&R and supply chain management from prototyping to production• Semiconductor packaging. Built a packaging team from scratch• Package design,• Electrical co-simulation for core, SerDes, DDRx, and RF• Thermal co-simulation• DFM, DRC, and LVS for package layout• Successfully taped out ~500 packages with >99% first time successful rate.• Business development worldwide

Hsinchu, Taiwan, Tw

Xbox 360 GPU MCM package design. Reduced substrate layer count from 8 to 6 by routing 1100 I/Os on a single layer. Significant cost reduction.

Santa Clara, California, Us

Microprocessor package design, layout, and electrical simulation for Itanium 2, Pentium 4, and Xeon.10G transponder and transceiver design and product engineering.RF front-end module design and testing for 802.1 a/b/g using MCM-D & MCM-L (Laminate) technology. - EM simulation, design, layout, wafer probing, testing, analysis - Balan, filter, LNA, PA, diplexer, switch

Microprocessor package design and PI/SI simulation for 21264 (EV6).Performance improvement from a wirebond 21164 (EV5) package to a flip-chip package.

New Brunswick, Nj, Us

Majored in Electrical and Computer Engineering

Holmdel, New Jersey, Us

MCM-D flying probe test equipment automation.Integrating high Q-factor RF inductor on MCM-D. - Design, EM simulation, wafer processing, testing, & analysisIntegrated Passive Device (IPD) on MCM-D

Doctor Of Philosophy (Ph.D.), Electrical And Computer Engineering

Bs, Physics