Larry Nye Email & Phone Number

Owner of Cowboy Leather Emporiumwww.cowboyleatheremporium.comRetired from Texas InstrumentsSenior Member Technical Staff, HVAL Manager - Materials and Process Development - Retired May, 2010; 27 years of hands on experience in all aspects of manufacturing operations related to semiconductor packaging and assembly.12 years of experience in managing development and support functions for assembly packaging & materials. 15 years of hands on experience in design and productization of IC packages (leadframe based, BGAs, WCSP)Responsible for leading and managing die attach, gold wire, molding compound, leadframe, and packingmaterial development programs for High Volume Analog and Logic at Texas Instruments. Also responsible for leading the Standard Llinear and Logic Package Development programs including conventional through hole and SMT packages, BGA Packages and Wafer Level Chip Scale (WLCSP) development.Leader of the SLL Cost Leadership Team (CLT);Publications: "More Power in Less Space: A Thermal Enhancement Solutionfor Thin Packages," TI Technical Journal; "Wire Bonds Over Active Circuits," Electronic Componentsand Technology Conference, (referenced in the 2nd editionof Wire Bonding in Microelectronics book by George Harman-p. 274);" K-Factor Test-Board Design Impact on Thermal-ImpedanceMeasurements, "International Electronics PackagingConference; "Thermal Performance Analysis Using Orthogonal Arrays forDesigning Integrated Circuit Packages," InternationalElectronics Packaging Conference,; "Palladium Bond Process Development Using TaguchiMethods," Corporate Experimental Design User'sConference;“Environmentally Friendly Solutions for Your Semiconductor Packaging Needs”, “EDN.com – July, 2005”, “Whisker Evaluation of Pb-Free Component Leads”, “TI Applications Report - July, 2005”,“Pb-free Component Identification: Start to Finish”, “EDN.com – July, 2005” US Patent #5,346,858US Patent #5,444,92311 additional disclosures under fileSpecialties: Semiconductor assembly, manufacturing, materials development;IC Package Reliability / applications;Defining Package and Materials development strategies;TI representative for JEDEC JC14, JC14.1 and JC14.4 industry standards committees. Vice Chairman - JC14.1; Competencies: Gold wire / bonding wire alloys / wire bond process;Saw / wafer dicing; die attach process / material formulation;Leadframe plating;

Listed skills include Failure Analysis, Semiconductors, Analog, Manufacturing, and 10 others.