- Manages, revises, and maintains status of the detail project cost estimate/forcast to include all phases of of project execution from design/engineering, material/equipment procurement and deliveries construction contracts through start-up activities and closeout.- Tracks and analyzes the project costs including budgets, commitments, actuals, accruals, and forecasts. Analysis includes forecast to budget and estimate, forecast to actuals, and contingency analysis.- Participates in the development and improvement of project controls systems. Recommends improvements in systems, tools, and methods of project controls and project management.Establishes a project work breakdown structiure in line with industry best practices.- Assists in analyzing project control requirements as part of bid review process to insure all cost control requirements are incorporated into individual contracts and purchase orders.- Interacts with other project groups in relation to cost codes, purchase order commitments, change orders and sales tax issues as required. Interacts with Accounting Systems and Services, General Accounting, Regulatory Accounting, Audit.- Assists in creating detailed project budgets from estimates and in the development of cash flow projections.- Works with Scheduler to develop, manage, revise, and update integrated detailed project schedules including all phases of project execution.- Assists in early identification of long lead iteams, resource constraints, and required project start dates.- Manages key project indicators and project commercial reports.- Manages internal job costing in relation to the fee and services to be provided, resources required and all project reporting including Job number, PSR and other company reporting policies.

System : Novellus Concept (Altus / Sequel) DNS ( SS/3000, FS/3000, SCU 3800)Area : Thin Film / Wet EtchProduct : Computer Processor Technology : 45 / 32 nano Fabrication Technology Roles & Duties• Planned, coordinated, and delivered production infrastructure projects. Interfaced with engineering and business owners to determine project scope, deliverables, and budgets. Assigned team resources, managed risk, and controlled changes to plan during project execution.• To plan, schedule and manage a team of 12 Engineers on installation/de-installation from base build ready till supplier qualification• Ensure all teams meeting schedule as per dateline for SL1, SL2, SL3 / DSL1, DSL2, DSL3 and a line to the master scheduler. • Conduct design review packages and foresee problems and changes prior construction and coordinate design specification with Intel Specs.• Ensure quality, safety & protocol all time during installation.• Ensures contractors work practices comply w/Intel specs & procedures• Participate in and audits contractor pre-task planningTop 3 Achievements• Supervised teams completing US$ 54 million Intel Fab28 factory commissioning project that involved 45 individual manufacturing equipment start-ups over one year. All activities were completed 10% under budget and 20%on-time.• Directed 2 engineering sub teams to debug supporting facilities, ultra pure N2 and toxic waste performance issues, hence supporting facilities are ready 30days ahead of requirement.• Identified field error in major electrical supply units, hence saving US$ 3millon in rework cost and increase safety in working environmentsReason for leaving : Completed contract

Tool working with : Concept 2 Sequel (Plasma deposition)Speed HDP (High Density Plasma / High Vacuum tool) Concept 1 (Plasma deposition) Thin film layer : SiO, SiN, PSG. Roles & Duties• Process qualification / monitoring / startup / integration• Process responsibility for implementation / integration of new layers and processes• New materials implementation and sourcing / Procurement management• Update and improve tool / process documentation• System / Maintenance improvement• Automation design and modification (Working on Concept 1 Sequel to modify and re-design the handling of wafer in orientation, in-order to achieve high yield output and low defective product due to wafer flat top. Face out old generation of robotic arm, replacement with better efficient model)• Installation (Install and qualifies new tool set)• Troubleshooting (Trouble shoot machine problems)• System upgrade • Conduct Training ( operation / maintenance )• Drive projects which enhance productivity / yield / reduce downtime / process / stability• Technical coaching with related to tool and process technology with engineers and technicians. • Equipment and fab automation design (tool : wafer orientation, wafer alignment, wafer transfer in system.) (Fab : foup docking, foup transfer and foup handling, OHV)Top 3 Achievements• Review and upgrade maintenance procedure, result increase MTBF Mean Time Between Failure another 30%, Particle count decrease 20%, One time QC after tool maintenance is possible at 80%.• Introduce Precision Maintenance method, result product QC data become more stable and product data are 30% well under requirement control measurements. Increase tool production time another 30%• Within 30 days, manage to integrate 3 process layers and qualifies for production ready status. • Reduction 30% in maintenance cost due to introduction of new usage of cleaning kits and efficient use of new product.Reason for Leaving : Completed contract

System : ASM EPSILON 3200 Area : EPITechnology : 65 nano Fabrication TechnologyProduct : Computer Processor Roles & Duties• System installations ( install and qualifies new tools as per intel’s Copy Exactly policy)• Plan and schedule installation from base build ready till supplier qualification• Ensure meeting schedule as per dateline for SL1, SL2, SL3• Review design packages• Coordinate design specification with Intel Specs• Ensure quality, safety & protocol all time during installation• Ensures contractors work practices comply w/Intel specs & procedures• Participate in and audits contractor pre-task planning• Prepare & manage micro schedules Top 3 Achievements• Completion Fab 24 phase 1 and 2 installation in EPI area with a team of 18 individual on a massive US$18M equipments startup programme over 2 years. With exceptional Zero accident over 2yrs and was 3 months ahead of schedule. Plus, initial production yield achieve was atleast 80% for 65nano 300mm.• Ability to save US$3M in quotation due to re-route and shorten electrical installation cables.• 70% of equipment installation achieve one time qualification with no major error items highlighted

Tool working with : Concept 2 Sequel, Speed and Speed (STI process) Thin film layer : SiO, SiN with and without CU process Roles & Duties• System maintenance • Installation (Install and qualifies new machines)• Troubleshooting (Trouble shoot machine problems)• Managing recycling process kits• System upgrade (Nano fill process)Reason for Leaving : Completed contract

Department : Thin Film Chemical Vaporise Deposits (CVD) Specialise in : Metal CVD & Dielectric CVD Thin film layer : WSi, W, PSin, GPSin, TiN, GPSiO. Machine Knowledge : Novellus ( Sequel, Maxus, Speed) Tokyo Electron Ltd ( MB2, Unity) Technology : 0.13μ Fabrication Technology Product : SDRAM (64MB, 256MB) EDO (64MB) DDR (128MB, 256MB) AS DRAM Logic Embedded DRAM Flash (256, 512) Roles & Duties• System maintenance - (In charge of the daily operations of the various machines mentioned. Daily, Bi- Weekly, Monthly, Yearly Maintenance.)• Management - (Manage a group of technicians and coordinators to ensure smooth operation.)• Procurement Process – introduction / recommendation of new equipmentsand materials for manufacturing. - Identification of goods and serivces to procure.- Arrange goods and services qualification.- Completing PO and issue to suppliers ( coordinating with procurement dept.)- Arrangement on delivery timeframes and methods.- Received goods and services from suppliers.- Review and accept the items procured.- Approve supplier payments.• Installation - (Install and qualifies new machines)• Troubleshooting - (Trouble shoot machine problems)• Job scheduling• Participate in project group improvement on efficiency, cost saving, yield• improvement, improve machine up time.• ISO 14000 , ISO 9001 coordinator• Safety committee member• Safety and Risk assessment workgroupReason for Leaving : To have further enrichment in knowledge and experience in the semiconductor industry, I was offered a job as contract engineer in France. So I decided to take up this opportunity.

Department : Field Service & Cleaning/Recycling SvcsSpecialise in : OEM parts production & Cleaning / Recycling Process kit / Product : AMAT ( Optima, Centura, Producer) TEL ( MB2, Unity / EP Unity) Novellus ( Sequal, Maxus, Speed) Customers : LAM Research, Applied Materials Pte Ltd, TECH,Singapore Silicon Manufacturing Corporation, Chartered Silicon Partners, Silicon ManufacturingPartners, Chartered Semiconductor Manufacturing, and Hitachi Nippon Steel Semiconductor. Roles & Duties• Support both sales and technical aspects to our clients’ needs.• Provide technical advises in parts design and rework to increase tool efficiency (ie, change showerhead design to achieve better laminar flow to enable good distribution of deposition gases.• Support to OEM parts production to our customer (Applied Materials). • Procure and acquire materials for part assembly for Applied Materials.• Handles the recycling accounts that include undertaking of new quotes, new methodology in recycling/ refurbishing chamber parts ( PVD, CVD, IMP, DIFF, WET). • To startup an assembly department which involvement in clean room designing, budget planning, work flow design, parts sourcing and logistic planning for the whole operation. This department assemble and fabricate various modules that make up of the whole unit for wafer fabrication equipment. Reason for Leaving : A new job in semiconductor manufacturing was offered to me to enhance my knowledge in this area.