Hardware / Embedded Electronics technologies development : components, PCB, packaging, connectors, materials, mechanical parts...Technical Project manager - Technologies maturity developmentDesign, manufacturing, characterization, qualificationEuropean & collaborative R&D projects

Packaging Development & Technology Roadmap.• Development leader of RF Power packaging solutions : From design to manufacturing, characterization, relability, qualification of high power / high frequency (GaAs, GaN, Si) packaged products.• Packaging technology roadmap definition, budgeting, execution and follow-up• Materials and Packaging assembly process: flip-chip, wire bond, hybrid...• Packaging technologies: QFN, metal-ceramic, BGA/LGA, WLCSP, Fan-In/Fan-Out...• Benchmark and partnership with OSATs and PCB vendors• Technical expertize on electromagnetic simulations, package & PCB design.• Characterization board & test socket design.• Project management. European & collaborative projects.

PRODUCT DESIGN & SIMULATION• Design support for semiconductor package and PCB• Signal & Power integrity analysis at system level chip-package-board (RF & High Speed digital: USB, DDR, SATA, PCI, HDMI, SERDES…)• Electromagnetic simulations, characterization & performance validation• Packaging assembly process & technology - BGA/LGA, leadframe, MCM, SiP, WLCSP, ...• Applications: TV box, digital and mobile processors, RF systems, data converters, optical sensors, automotive, networking, radar & antennas, MEMS, move sensors, power management…RESEARCH & DEVELOPMENT• Development of IC packaging technologies, topologies & interconnects• Development of integrated solutions for performance/cost/integration/quality• Prototyping, benchmarking, electrical measurements, reliability tests• Innovative approach for semiconductor packaging solutions – Patents granted• Development of design tools & methodologies – Co-design approach chip/package/board PROJECT MANAGEMENT• Guidelines, support and training to package and PCB design teams on Signal & Power integrity problematics• Design & simulation tools development program • Identification & coordination of user needs for CAD tools developments & enhancements• Benchmarking of new tools & new functionalities• Interface with EDA/CAD tool providers• Definition of development roadmaps & follow-up• Material characterization• Antenna integration

Compensation methods for temperature variations and technological dispersions of MMIC manufacturing processes.Bibliographic study, design & simulations, prototyping, measurements.

Design, prototyping and electrical characterization of active patch antenna networks.