Patrick Lavery Email & Phone Number

Andover, Ma, Us

Developed materials and procedures utilizing new chemistries to advance 2D and 3D electronic packaging technologies. Latest development involved materials and methods to enhance adhesion of epoxy molding compounds to system in package (SIP) electronic assemblies used in lead-free solder assemblies. Improved MSL rating from MSL6 to MSL3. These packaged devices, SIP in type, contain not only both organic and inorganic materials but also solder which complicated the adhesion solution. Other activities, to name just a few, involved epoxy system integration, electroplating on epoxy molding compounds, PVD materials and methods, wet and dry etching, lithography, flip chips, and solder alloy development and processing. As a Senior Principal Engineer I support Design Engineering through the NPI process and I am always available for consultation with senior management and customers for product related issues. Co-author of several new product and process patents associated with the Vicor SM-ChiP, surface mount, and radiation tolerant systems.

MEMS Development. Solid Oxide Fuel Cell (SOFC) built on silicon MEMS structure. Developed platinum electroplating processes for silicon blind via fill, developed 3D, 40 micron thick polyimide /PBO structures with HDMS and Asahi Glass PBO, developed and released 800C operational thin film platinum electrodes and resistive heater networks, developed spray photolithography methods and spray resist with UV and Deep UV chemistries, and produced thin film Pt-YSZ structures with high temperature stability. Skilled in MEMs process equipment such at resist coaters, aligners, developer tools, wet sinks, plasma etchers (RIE and DRIE), EB-EVAP, Ion Beam Etcher, heat treat furnaces, and metrology equipment. Specialized ability in MEMS process integration as applied in Intel FAB17.

Andover, Ma, Us

Was company specialist in materials science technologies. Was Vicor lead in the qualification of ROHS compliant materials and MSL Testing in a lead-free solder environment. Was Vicor company expert in acoustic microscopy with over 2000 hour logged hours in the evaluation of MLPs.

Thin film substrates and electronic networks built using thin film and plating techniques. Specialist in AlN substrate processing, hermetic filled Au vias, positive and negative resist processing, and high temperature stable films such as Ti/Pt/Au for 500C processing window that is wire bondable and adherent.

Developed high temperature coatings, including a co-deposition aluminum/chromium ATP coating for low Cr content Ni superalloys and pack and ATP platinum group metal enhanced aluminides. Patented new superalloy coatings. Supported multitple General Electric, Pratt and Whitney, Siemens, Westinghouse, and Solar Turbines programs. Represented Walbar when interfacing with customers such a GE and PWC on coating qualifications and new coating production methods.

Waltham, Ma, Us

Thermolectric materials, SP-100 Space Power System, responsible for solid state and braze alloy bonding with graphite, CVD-W, Nb-1Zr, Ti, V, PdSi, and others. Worked on SiGe thermoelectric and TAGS (TeAgGeSe). Obtained FOM >2.0 with GSAT alloy material. Worked with GE-Astro Space Division, JPL (Jet Propopulsion Lab), and KAPL (Knowles Atomic Power Lab). Evaluated lifetime models for bonds of thermoelectric system used in Galileo probe that was sent to Jupiter. Held DOD Secret Clearance.

Master Of Engineering - Meng, Materials Sciences

Bachelor Of Engineering - Be, Metallurgical Engineering

Ab, Engineering Sciences

Education record