Materials scientist with the ability to develop processes and materials that enhance many different technologies from commercial to government/military to space. Present work supports packaged/molded electronic power supplies used to power AI chips, servers, and a variety of other applications including specialty military devices in both terrestrial and space applications. Specialist in adhesion promotion, RF and MW plasma process applications, silicon MEMs, photo methods and techniques, electrolytic and electroless plating (Pt, Pd, Cu, Ni, NiP, Au), wet etch and cleaning processes, thin film materials and PVD methods, solders and SMT methods, fabrication of ferrite composites, filled polymers, refractories, high temperature metallurgy, coatings, and heat treat, inspection systems, and failure analysis using analytical equipment. Recent development leading to commercialized products include Vicor's SM-ChiP Family of power supples. Outlined and demonstrated the methods to externally metallize epoxy molded power supplies that allowed elimination of external leads thus making chips surface mountable. Make materials play nicely with each other and if needed invent them. Find every challenge interesting.