Lee Chee Meng
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Lee Chee Meng Email & Phone Number

Sr Wire Bond Process and Equipment Engineer at UTAC
Location: Dongguan, Guangdong, China 4 work roles 2 schools
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Current company
Role
Sr Wire Bond Process and Equipment Engineer
Location
Dongguan, Guangdong, China
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Who is Lee Chee Meng? Overview

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Lee Chee Meng is listed as Sr Wire Bond Process and Equipment Engineer at UTAC, a with 1912 employees, based in Dongguan, Guangdong, China. AeroLeads shows a matched LinkedIn profile for Lee Chee Meng.

Lee Chee Meng previously worked as Sr Wire Bond Process/Equipment Engineer at Utac and Sr Die Attach Process Engineer at Spansion Semiconductors (Suzhou, China). Lee Chee Meng holds Bachelor Degree In Electrical And Electronic Engineering from Bradford College.

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UTAC

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Profile bio

About Lee Chee Meng

I know what it takes to run a busy and successful in production, process ,manufacturing and project. I helped my manager all aspects of the operation, handling tasks such as process improvement, project management , claims processing, report preparation and ongoing communications with the district manager.This is an area in which I excel from my past working experience, I helped my manager build a solid and strong base by consistently providing excellent service. I will be your “right hand”—helping you manage the day-to-day operations, volunteering for special projects, and ensuring the company is positioned for growth and increased profitability.Please feel free to call me if you need additional information. Thank you for your time, and I look forward to hearing from you.

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Lee Chee Meng's current company

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UTAC
Utac
Sr Wire Bond Process and Equipment Engineer
Dongguan, CN
Website
Employees
1912
AeroLeads page
4 roles

Lee Chee Meng work experience

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Sr Wire Bond Process And Equipment Engineer

Dongguan, Cn

Sr Wire Bond Process/Equipment Engineer

 Trouble shooting and perform annual, halfyearly and quarterly PM on WB KNS and ASM wire bonder on Eagle 60 , Twin Eagle , 8028, Maxum, Ultra, Iconn and Pro-Cu. Familiar in OEE system on WB bonder machines. Work close with production team and other cross functional groups to support and maintain factory manufacturing systems and processes.  Ensure quality and efficiency standards are achieved at all time. Provide engineering support to manufacturing including redesign for parts chances , line down situations, design margin issue and cost reduction projects Troubleshoot technical problems in the manufacturing cell, support cell operators and technicians in maintaining product quality and cell productivity during daily operation. Work close with NPI manufacturing, Process engineer, Test engineers and factory support staff to properly test integrate test station for new product into manufacturing environment. Provide input to the NPI test process to improve future test station and Process for enhange process improvement. Troubleshoot high level quality issues and determine short- term and long term solutions.

Sr Die Attach Process Engineer

Spansion Semiconductors (Suzhou, China)

Suzhou, China

 Be responsible for process related issue, systematically approach to solve process problem, maintain and improve yield, quality, and process development. Generate process spec, SOP and training material as needed, support engineering to maintain quality system. Conduct new process development to support new package/process qualification. Take initiative to conduct process improvement, cost reduction project through TCPI approach. Communicate internally and externally, lead multi-functional team to achieve process goals. Provide guidance, coaching and training to junior engineer on problem analyzing, DOE and total process improvement. Able to come out professional technical report on related operation. Lead process engineers to achieve the process objectives.

Nov 2004 - Dec 2011

Die Attach Process Engineer

Fairchild Semiconductors (Penang, M’Sia)

Penang, Malaysia

 Responsible for line improvement, yield improvement. Cassette jig and fixture design. Analyze product using high and low power microscope, smart scope, projector ,SEM and EDX. Report findings and root cause analysis. Support production in defect trouble shooting by providing data on defect type, possible root cause. Provide in-time feedback to production on defect and determine defect type. Present weekly line findings for daily production reject.  Process control and improvement, troubleshooting for linedefect. Toconduct evaluation for line and process improvement. Handle all documentation concerning Process : control plan, process specification, FMEA, 8D report, machine buy-off procedure.  Involve in preparation for audit for QS9000, ISO14001, ISO9001 customer audit, internal audit. Experience in SPC control. Yield monitoring and improvement.

Jun 1992 - Oct 2004
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Colleagues at UTAC

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2 education records

Lee Chee Meng education

Higher National Diploma, Diploma In Electrical And Electronic Engineering

Matrix College
FAQ

Frequently asked questions about Lee Chee Meng

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What company does Lee Chee Meng work for?

Lee Chee Meng works for UTAC.

What is Lee Chee Meng's role at UTAC?

Lee Chee Meng is listed as Sr Wire Bond Process and Equipment Engineer at UTAC.

Where is Lee Chee Meng based?

Lee Chee Meng is based in Dongguan, Guangdong, China while working with UTAC.

What companies has Lee Chee Meng worked for?

Lee Chee Meng has worked for Utac, Spansion Semiconductors (Suzhou, China), and Fairchild Semiconductors (Penang, M’Sia).

Who are Lee Chee Meng's colleagues at UTAC?

Lee Chee Meng's colleagues at UTAC include Irwin Lim, Derek. Yuzhe Jiao, Nurul Firdaus, Khoo Siew Siew, and Jaturon Acchsuwan.

How can I contact Lee Chee Meng?

You can use AeroLeads to view verified contact signals for Lee Chee Meng at UTAC, including work email, phone, and LinkedIn data when available.

What schools did Lee Chee Meng attend?

Lee Chee Meng holds Bachelor Degree In Electrical And Electronic Engineering from Bradford College.

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