Lee Phillips Email and Phone Number
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Seasoned technical and business manager with many successes in creating and expanding revenues covering all major geos. Successful in dealing with all levels of management, working with internal/external technical and business teams, and creating the proper conditions for effective and productive engagements in very competitive markets with small, medium, and large partners. Opportunity viability, high value engagements, the right product definitions, strong development execution, and strong partner relationships are pillars of my past, present, and future successes.
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Principal EngineerIntel Corporation Jan 2024 - PresentSanta Clara, California, UsPrincipal Engineer and leading Intel's Client Ecosystem Platform Resilence Initiatives -
Director, Ecosystem StrategyIntel Corporation Feb 2022 - PresentSanta Clara, California, UsDrive partnerships with OEMs, ODMs, and Supply Chain to deliver supply assurance and supply resilience. -
Engineering ManagerIntel Corporation Oct 2020 - Feb 2022Santa Clara, California, UsManaging Power and Passives engineering team within Intel Global Supply Chain. Responsible to deliver supply chain solutions for Intel's power and wireless businesses with focus on IP creation, component creation and availability, supplier selection, and BU roadmap support. Power and Wireless are fundamental pillars to Intel and our ecosystem. -
Power Management And Wireless Supply Chain StrategistIntel Corporation Feb 2019 - Feb 2022Santa Clara, California, UsOverall Strategist for Intel's Global Supply Chain for the PMIC and Wireless Technologies. Created and managed Intel's Global Supply Chain Wireless Center of Excellence. -
Sr Cellular And Wireless StrategistIntel Corporation Jul 2013 - Oct 2020Santa Clara, California, UsLead Cellular and Wireless Strategist for Intel's Internet of Things business unit (IOTG)Focusing on alignment with the Internet of Things (IOT) vertical markets, product solutions with leading ODMs/OEMs, and next generation wireless/cellular technologies that will service IOT vertical markets now and in the future.Key tasks are defining use cases, go to market, ecosystem partners, certification strategies, customer support, and product definition for commercial, industrial, and automotive grade solutions.Key technologies are 5G eMBB, mMTC and URLLC (device, infrastructure, and networks), LTE (CAT6+, CAT1, CATM/NB1 for SoCs, slim and smart modems, and compute/modem solutions), LoRA (edge node and gateways), Wi-Fi/BT, 15.4, GNSS, and 2G/3G. -
Regional Account Manager - Greater China South Asia (Gcsa)Fujitsu Semiconductor Wireless Products 2007 - Jul 2013JpFujitsu team acquired by Intel Corporation in July 2013Managed >25 customer accounts in the GCSA Region.Created regional teams, created new accounts, launched new cellular modem solutions, and built an active solutions portfolio which led to first revenues in this region.Delivered 2G/3G (TD-SCDMA)/LTE (TDD/FDD) CAT4 and 2G/3G (WCDMA) modems that are in production and are carrier certified with multiple China Operators.Successfully displaced competitive solutions to win new accounts.3 areas of focus:Business Development ManagerCustomer Support and Engagement StrategiesInternal Program Management for new features and development supportAlso managed applications engineering support both in US and the China Region.Worked in close collaboration with Sales, Marketing, Engineering, and Management Teams (Corporate, Regional, and Local) -
Principal Engineer And Manager - Energy Metering And Analog ProductsMicrochip Technology 2004 - 2007Chandler, Az, UsPrimary technical interface for the Greater China Region for Energy Metering and ADC products. Managed direct and indirect reports to win accounts, service existing accounts, and for regional strategic planning.Successfully created new production revenues with multiple products and multiple companies• Lead principal development team to develop energy metering IC product portfolio which is qualified worldwide and is in high volume production• Optimized custom low noise validation/characterization bench and implemented Visual Basic automation and remote bench testing (including thermostream control) – Microchip Analog First• Developed validation/characterization automation and analysis tools that currently serve as benchmark (estimated to save over 1 year of development time and capital/resource expenses) – visual basic and pivot analysis – Microchip Analog First• Provided global application support for PCB schematic/layout to help design in ADC products, overcome EMC/EMI/RFI/EFT problems, and to improve system performance• Worked with technology development and package development teams to optimize/qualify fab process and to qualify package -
Principal Engineer And Program Manager (Rf And Broadband)On Semiconductor 2001 - 2004Scottsdale, Arizona, UsProgram Manager for 'first in kind' dual band, integrated, VCO. Aggressive schedule, kV, phase noise, IDrain, and new package technologies are items of focus. This project is the benchmark and platform that also drove RF platform development for process, design kit, and test/evaluation capabilities at ON Semiconductor.Corporate PMP Certification -
Rf Development EngineerBell Labs Lucent Technologies 1999 - 2001Murray Hill, Nj, UsRF/IF Development on Sirius Satellite Radio and 802.11b productsIC Bench characterization, worked with test engineering on development/optimization, and logistical management of customer and design/development deliverables.Lucent Automotive Products Group (APG) Leadership team in developing QS9000 qualifications. Helped develop methodologies for Advanced Product Quality Planning (APQP), Measurement Systems Analysis (MSA), and Failure Modes Effects Analysis (FMEA). -
Rf Product DevelopmentRaytheon 1997 - 1999Arlington, Va, UspHEMPT MMIC module development and validation for F-22 Raptor.Device characterization, statistical analysis, bench troubleshooting, manufacturing support, and limited design and test of TR mmics/modules. Worked with s-parameters, TOI/cross modulation/noise figure/VSWR measurements, Libra, and HP8510 VNA. Manual and autoprobing of transmit and receive mmics/modules. Test set software validations and assist on test plan development. -
Ground Radio Repair (Mos 2841)United States Marine Corps 1991 - 1997Washington, Dc, UsMan pack and ground vehicle radio maintenance. Military Communications, radio nets, and radio comm expert. Final Rank: Staff Sergeant (E-6)Final Attachment: 2nd Batt, 8th Marines, 4th FSSG, Radio and Maintenance Batt
Lee Phillips Skills
Lee Phillips Education Details
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The University Of Texas At DallasElectrical And Electronics Engineering -
North Carolina Agricultural And Technical State UniversityElectrical Engineering
Frequently Asked Questions about Lee Phillips
What company does Lee Phillips work for?
Lee Phillips works for Intel Corporation
What is Lee Phillips's role at the current company?
Lee Phillips's current role is Principal Engineer, Chief Technical Lead for Client Platform Hardware Resilience at Intel Corporation.
What is Lee Phillips's email address?
Lee Phillips's email address is le****@****hoo.com
What is Lee Phillips's direct phone number?
Lee Phillips's direct phone number is (408) 765*****
What schools did Lee Phillips attend?
Lee Phillips attended The University Of Texas At Dallas, North Carolina Agricultural And Technical State University.
What are some of Lee Phillips's interests?
Lee Phillips has interest in Regional Strategy Development, Dynamic Work Environment, Global Enterprise.
What skills is Lee Phillips known for?
Lee Phillips has skills like Testing, Rf, Semiconductors, Product Development, Ic, Analog, Program Management, Mobile Devices, Customer Relations, Problem Solving, Lte, Troubleshooting.
Who are Lee Phillips's colleagues?
Lee Phillips's colleagues are Muhd Syahidan, Pravina Natarajan, Jenny Hernandez, Eyal Gebel, Binfen Zhang, June C., Hector Vivanco.
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