Principal Engineer
CurrentPrincipal Engineer and leading Intel's Client Ecosystem Platform Resilence Initiatives
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@intel.com
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1 phone found area 408
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Lee Phillips is listed as Principal Engineer at Intel Corporation, a company with 10 employees, based in Chandler, Arizona, United States. AeroLeads shows a work email signal at intel.com, phone signal with area code 408, and a matched LinkedIn profile for Lee Phillips.
Lee Phillips previously worked as Director, Ecosystem Strategy at Intel Corporation and Engineering Manager at Intel Corporation. Lee Phillips holds Master Of Science (Ms), Electrical And Electronics Engineering from The University Of Texas At Dallas.
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AeroLeads found 1 current-domain work email signal for Lee Phillips. Compare company email patterns before reaching out.
Seasoned technical and business manager with many successes in creating and expanding revenues covering all major geos. Successful in dealing with all levels of management, working with internal/external technical and business teams, and creating the proper conditions for effective and productive engagements in very competitive markets with small, medium, and large partners. Opportunity viability, high value engagements, the right product definitions, strong development execution, and strong partner relationships are pillars of my past, present, and future successes.
Listed skills include Testing, Rf, Semiconductors, Product Development, and 21 others.
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A career timeline built from the work history available for this profile.
Santa Clara, California, US
Principal Engineer and leading Intel's Client Ecosystem Platform Resilence Initiatives
Santa Clara, California, US
Drive partnerships with OEMs, ODMs, and Supply Chain to deliver supply assurance and supply resilience.
Santa Clara, California, US
Managing Power and Passives engineering team within Intel Global Supply Chain. Responsible to deliver supply chain solutions for Intel's power and wireless businesses with focus on IP creation, component creation and availability, supplier selection, and BU roadmap support. Power and Wireless are fundamental pillars to Intel and our ecosystem.
Santa Clara, California, US
Overall Strategist for Intel's Global Supply Chain for the PMIC and Wireless Technologies. Created and managed Intel's Global Supply Chain Wireless Center of Excellence.
Santa Clara, California, US
Lead Cellular and Wireless Strategist for Intel's Internet of Things business unit (IOTG)Focusing on alignment with the Internet of Things (IOT) vertical markets, product solutions with leading ODMs/OEMs, and next generation wireless/cellular technologies that will service IOT vertical markets now and in the future.Key tasks are defining use cases, go to.
JP
Fujitsu team acquired by Intel Corporation in July 2013Managed >25 customer accounts in the GCSA Region.Created regional teams, created new accounts, launched new cellular modem solutions, and built an active solutions portfolio which led to first revenues in this region.Delivered 2G/3G (TD-SCDMA)/LTE (TDD/FDD) CAT4 and 2G/3G (WCDMA) modems that are in.
Chandler, AZ, US
Scottsdale, Arizona, US
Program Manager for 'first in kind' dual band, integrated, VCO. Aggressive schedule, kV, phase noise, IDrain, and new package technologies are items of focus. This project is the benchmark and platform that also drove RF platform development for process, design kit, and test/evaluation capabilities at ON Semiconductor.Corporate PMP Certification
Murray Hill, NJ, US
RF/IF Development on Sirius Satellite Radio and 802.11b productsIC Bench characterization, worked with test engineering on development/optimization, and logistical management of customer and design/development deliverables.Lucent Automotive Products Group (APG) Leadership team in developing QS9000 qualifications. Helped develop methodologies for Advanced.
Arlington, VA, US
pHEMPT MMIC module development and validation for F-22 Raptor.Device characterization, statistical analysis, bench troubleshooting, manufacturing support, and limited design and test of TR mmics/modules. Worked with s-parameters, TOI/cross modulation/noise figure/VSWR measurements, Libra, and HP8510 VNA. Manual and autoprobing of transmit and receive.
Washington, DC, US
Man pack and ground vehicle radio maintenance. Military Communications, radio nets, and radio comm expert. Final Rank: Staff Sergeant (E-6)Final Attachment: 2nd Batt, 8th Marines, 4th FSSG, Radio and Maintenance Batt
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Fernando Lozada Tlelo
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Muhammad Shamasneh
Colleague at Intel CorporationPalestinian Authority, Palestine, State Of
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Nandita Lakshminarayanan
Colleague at Intel CorporationHillsboro, Oregon, United States, United States
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Youngmin Woo
Colleague at Intel CorporationSouth Korea, Korea, Republic Of
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Dr Emmanuel Massawe
Colleague at Intel CorporationMoshi, Kilimanjaro, Tanzania, Tanzania, United Republic Of
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Duc Nguyen
Colleague at Intel CorporationHillsboro, Oregon, United States, United States
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Pat Kenny
Colleague at Intel CorporationLeixlip, County Kildare, Ireland, Ireland
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Gary Palangian
Colleague at Intel CorporationTempe, Arizona, United States, United States
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Manni Huang
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Alfred Ortiz
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Quick answers generated from the profile data available on this page.
Lee Phillips works for Intel Corporation.
Lee Phillips is listed as Principal Engineer at Intel Corporation.
AeroLeads has found 1 work email signal at @intel.com for Lee Phillips at Intel Corporation.
AeroLeads has found 1 phone signal(s) with area code 408 for Lee Phillips at Intel Corporation.
Lee Phillips is based in Chandler, Arizona, United States while working with Intel Corporation.
Lee Phillips has worked for Intel Corporation, Fujitsu Semiconductor Wireless Products, Microchip Technology, On Semiconductor, and Bell Labs Lucent Technologies.
Lee Phillips's colleagues at Intel Corporation include Fernando Lozada Tlelo, Muhammad Shamasneh, Nandita Lakshminarayanan, Youngmin Woo, and Dr Emmanuel Massawe.
You can use AeroLeads to view verified contact signals for Lee Phillips at Intel Corporation, including work email, phone, and LinkedIn data when available.
Lee Phillips holds Master Of Science (Ms), Electrical And Electronics Engineering from The University Of Texas At Dallas.
Lee Phillips is listed with skills including Testing, Rf, Semiconductors, Product Development, Ic, Analog, Program Management, and Mobile Devices.
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