Principal Engineer
CurrentPrincipal Engineer and leading Intel's Client Ecosystem Platform Resilence Initiatives
Jan 2024 - Present
AeroLeads people directory · profile
Lee Phillips Email & Phone Number
Principal Engineer
at
Intel Corporation
1 work email found
@intel.com
1 phone found area 408
LinkedIn matched
✓ Verified Jun 2026
4 data sources
Profile completeness 100%
Current company
Role
Principal Engineer
Location
Chandler, Arizona, United States
Company size
Who is Lee Phillips? Overview
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Quick answer
Lee Phillips is listed as Principal Engineer at Intel Corporation, a company with 10 employees, based in Chandler, Arizona, United States. AeroLeads shows a work email signal at intel.com, phone signal with area code 408, and a matched LinkedIn profile for Lee Phillips.
Lee Phillips previously worked as Director, Ecosystem Strategy at Intel Corporation and Engineering Manager at Intel Corporation. Lee Phillips holds Master Of Science (Ms), Electrical And Electronics Engineering from The University Of Texas At Dallas.
Company email context
Email format at Intel Corporation
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{first}.{last}@intel.com
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AeroLeads found 1 current-domain work email signal for Lee Phillips. Compare company email patterns before reaching out.
Profile bio
About Lee Phillips
Seasoned technical and business manager with many successes in creating and expanding revenues covering all major geos. Successful in dealing with all levels of management, working with internal/external technical and business teams, and creating the proper conditions for effective and productive engagements in very competitive markets with small, medium, and large partners. Opportunity viability, high value engagements, the right product definitions, strong development execution, and strong partner relationships are pillars of my past, present, and future successes.
Listed skills include Testing, Rf, Semiconductors, Product Development, and 21 others.
Current workplace
Lee Phillips's current company
Company context helps verify the profile and gives searchers a useful next step.
Intel Corporation
11 roles · 35 years
Lee Phillips work experience
A career timeline built from the work history available for this profile.
Director, Ecosystem Strategy
Drive partnerships with OEMs, ODMs, and Supply Chain to deliver supply assurance and supply resilience.
Engineering Manager
Managing Power and Passives engineering team within Intel Global Supply Chain. Responsible to deliver supply chain solutions for Intel's power and wireless businesses with focus on IP creation, component creation and availability, supplier selection, and BU roadmap support. Power and Wireless are fundamental pillars to Intel and our ecosystem.
Oct 2020 - Feb 2022
Power Management And Wireless Supply Chain Strategist
Overall Strategist for Intel's Global Supply Chain for the PMIC and Wireless Technologies. Created and managed Intel's Global Supply Chain Wireless Center of Excellence.
Feb 2019 - Feb 2022
Sr Cellular And Wireless Strategist
Lead Cellular and Wireless Strategist for Intel's Internet of Things business unit (IOTG)Focusing on alignment with the Internet of Things (IOT) vertical markets, product solutions with leading ODMs/OEMs, and next generation wireless/cellular technologies that will service IOT vertical markets now and in the future.Key tasks are defining use cases, go to.
Jul 2013 - Oct 2020
Regional Account Manager - Greater China South Asia (Gcsa)
Fujitsu team acquired by Intel Corporation in July 2013Managed >25 customer accounts in the GCSA Region.Created regional teams, created new accounts, launched new cellular modem solutions, and built an active solutions portfolio which led to first revenues in this region.Delivered 2G/3G (TD-SCDMA)/LTE (TDD/FDD) CAT4 and 2G/3G (WCDMA) modems that are in.
2007 - Jul 2013
Principal Engineer And Manager - Energy Metering And Analog Products
- Primary technical interface for the Greater China Region for Energy Metering and ADC products. Managed direct and indirect reports to win accounts, service existing accounts, and for regional strategic.
- Lead principal development team to develop energy metering IC product portfolio which is qualified worldwide and is in high volume production
- Optimized custom low noise validation/characterization bench and implemented Visual Basic automation and remote bench testing (including thermostream control) – Microchip Analog First
- Developed validation/characterization automation and analysis tools that currently serve as benchmark (estimated to save over 1 year of development time and capital/resource expenses) – visual basic and pivot analysis.
- Provided global application support for PCB schematic/layout to help design in ADC products, overcome EMC/EMI/RFI/EFT problems, and to improve system performance
- Worked with technology development and package development teams to optimize/qualify fab process and to qualify package
2004 - 2007
~3 yrs
Principal Engineer And Program Manager (Rf And Broadband)
Program Manager for 'first in kind' dual band, integrated, VCO. Aggressive schedule, kV, phase noise, IDrain, and new package technologies are items of focus. This project is the benchmark and platform that also drove RF platform development for process, design kit, and test/evaluation capabilities at ON Semiconductor.Corporate PMP Certification
2001 - 2004
~3 yrs
Rf Development Engineer
RF/IF Development on Sirius Satellite Radio and 802.11b productsIC Bench characterization, worked with test engineering on development/optimization, and logistical management of customer and design/development deliverables.Lucent Automotive Products Group (APG) Leadership team in developing QS9000 qualifications. Helped develop methodologies for Advanced.
1999 - 2001
~2 yrs
Rf Product Development
pHEMPT MMIC module development and validation for F-22 Raptor.Device characterization, statistical analysis, bench troubleshooting, manufacturing support, and limited design and test of TR mmics/modules. Worked with s-parameters, TOI/cross modulation/noise figure/VSWR measurements, Libra, and HP8510 VNA. Manual and autoprobing of transmit and receive.
1997 - 1999
~2 yrs
Ground Radio Repair (Mos 2841)
Man pack and ground vehicle radio maintenance. Military Communications, radio nets, and radio comm expert. Final Rank: Staff Sergeant (E-6)Final Attachment: 2nd Batt, 8th Marines, 4th FSSG, Radio and Maintenance Batt
1991 - 1997
~6 yrs
Team & coworkers
Colleagues at Intel Corporation
Other employees you can reach at intel.com. View company contacts for 10 employees →
SP
Steve Pico
Colleague at Intel CorporationChandler, Arizona, United States, United States
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YT
Yusuke Tanaka
Colleague at Intel CorporationTokyo, Japan, Japan
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AB
Adam Birr
Colleague at Intel CorporationChandler, Arizona, United States, United States
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WK
Wei Kheng Lim
Colleague at Intel CorporationBayan Lepas, Penang, Malaysia, Malaysia
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MK
Murasoliselvan Karunanithi
Colleague at Intel CorporationFolsom, California, United States, United States
View →
OS
Ofri Seroussi
Colleague at Intel CorporationIsrael, Israel
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JM
Jennifer Mick
Colleague at Intel CorporationBeaverton, Oregon, United States, United States
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HT
Herve Twala
Colleague at Intel CorporationAlbuquerque, New Mexico, United States, United States
View →
CB
Craig Bolton
Colleague at Intel CorporationChandler, Arizona, United States, United States
View →
VJ
Vered Juhl
Colleague at Intel CorporationIsrael, Israel
View →
Steve Pico
Colleague at Intel CorporationChandler, Arizona, United States, United States
View →
YT
Yusuke Tanaka
Colleague at Intel CorporationTokyo, Japan, Japan
View →
AB
Adam Birr
Colleague at Intel CorporationChandler, Arizona, United States, United States
View →
WK
Wei Kheng Lim
Colleague at Intel CorporationBayan Lepas, Penang, Malaysia, Malaysia
View →
MK
Murasoliselvan Karunanithi
Colleague at Intel CorporationFolsom, California, United States, United States
View →
OS
Ofri Seroussi
Colleague at Intel CorporationIsrael, Israel
View →
JM
Jennifer Mick
Colleague at Intel CorporationBeaverton, Oregon, United States, United States
View →
HT
Herve Twala
Colleague at Intel CorporationAlbuquerque, New Mexico, United States, United States
View →
CB
Craig Bolton
Colleague at Intel CorporationChandler, Arizona, United States, United States
View →
VJ
Vered Juhl
Colleague at Intel CorporationIsrael, Israel
View →
2 education records
Lee Phillips education
Master Of Science (Ms), Electrical And Electronics Engineering
The University Of Texas At Dallas
Bs, Physics, Electrical Engineering
North Carolina Agricultural And Technical State University
FAQ
Frequently asked questions about Lee Phillips
Quick answers generated from the profile data available on this page.
What company does Lee Phillips work for?
Lee Phillips works for Intel Corporation.
What is Lee Phillips's role at Intel Corporation?
Lee Phillips is listed as Principal Engineer at Intel Corporation.
What is Lee Phillips's email address?
AeroLeads has found 1 work email signal at @intel.com for Lee Phillips at Intel Corporation.
What is Lee Phillips's phone number?
AeroLeads has found 1 phone signal(s) with area code 408 for Lee Phillips at Intel Corporation.
Where is Lee Phillips based?
Lee Phillips is based in Chandler, Arizona, United States while working with Intel Corporation.
What companies has Lee Phillips worked for?
Lee Phillips has worked for Intel Corporation, Fujitsu Semiconductor Wireless Products, Microchip Technology, On Semiconductor, and Bell Labs Lucent Technologies.
Who are Lee Phillips's colleagues at Intel Corporation?
Lee Phillips's colleagues at Intel Corporation include Steve Pico, Yusuke Tanaka, Adam Birr, Wei Kheng Lim, and Murasoliselvan Karunanithi.
How can I contact Lee Phillips?
You can use AeroLeads to view verified contact signals for Lee Phillips at Intel Corporation, including work email, phone, and LinkedIn data when available.
What schools did Lee Phillips attend?
Lee Phillips holds Master Of Science (Ms), Electrical And Electronics Engineering from The University Of Texas At Dallas.
What skills is Lee Phillips known for?
Lee Phillips is listed with skills including Testing, Rf, Semiconductors, Product Development, Ic, Analog, Program Management, and Mobile Devices.
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