Lejun Wang Email & Phone Number

Manchester, Nh, Us

Wilmington, Ma, Us

Led packaging NPI activities for Analog Devices’ MEMS Gyroscope and Accelerometer and RF SiP products.

San Diego, Ca, Us

Led packaging NPI activities for Qualcomm’s industry-leading cellular modem products to ensure new products meet assembly yield (> 99.5%) and reliability targets.Driven package technology development that enables modem product roadmap going thinner/smaller generation after generation, with package thickness reduced by 46% and size by 36%.Led or participated in cross functional teams to resolve a number of yield or reliability issues encountered during package NPI.

Minneapolis, Mn, Us

Led a cross-functional team to successfully resolve assembly issues of an asymmetric surface mountable transformer in SMT process under tight schedule - Utilized tools that include Surface Evolver, finite element analysis, and digital image correlation to quickly identify root cause and determine solution paths. - Improved assembly yield of the transformer from 85% to 99.6% in six months, which prevented major schedule delay to the qualification of the new defibrillator product, and led to ~$10M in saving annually for scrap reduction.Recognized as a subject matter expert in polymer materials and molding technologies at Medtronic Tempe Campus; consulted on these subjects by multiple projects

Minneapolis, Mn, Us

Led development activities to replace legacy chip and wire assembly line with new high power lean line to achieve size reduction, cost reduction, and reliability improvement. - Developed new processes that include transfer molding and ion free plasma, down-selected new material sets that include epoxy molding compounds, conductive and non-conductive die attach adhesives for better MSL performance (from 5 to 2A) and lower cost. - Led multi-functional working groups to identify root cause and implement fix for major yield and reliability issues that include die attach delamination, die cracking, component leakage instability, and incomplete fill in molding.Led development activities to establish transfer molding process and select epoxy molding compounds for stack-die CSP and HV SiP electronic modules. - Established transfer molding process, selected low stress low alpha epoxy molding compound for internal stack-die CSP prototyping to demonstrate functionality and robustness of first silicon and new package designs. - Established transfer molding process, selected high performance epoxy molding compound, and established substrate design rules for development of HV SiP electronic modules. Led development activities to reduce hybrid encapsulant height to enable volume and thickness reduction on next generation electronic module for defibrillators - Achieved 20% encapsulant height reduction on dam & fill process which led to 10% longevity improvement. - Achieved 10% yield improvement and 33% UPH improvement on dam & fill process by replacing LCP dam with Integral Dam Stiffener and Auger pump with Multi-piston pump.

Santa Clara, California, Us

Led underfill process development for packaging Intel’s next generation CPU, chip set, and network processor products.- Developed a high yield underfill process that is High Volume Manufacturing friendly and with 40% of UPH improvement over previous generation process.- Managed smooth technology transfer to multiple Virtual Factory sites by ensuring Copy Exactly.- Qualified underfill for Intel’s next generation products that meets manufacturability, reliability (lead and lead-free), and cost requirements.Led working group activities to achieve balance between underfill processability and electrical performance.- Validated package epoxy exclusion zone across all form factors of Intel’s next generation products.- Forced re-design of two high volume products by intercepting at early design stage to avoid assembly yield caused by Design for Manufacturability issue.- Identified design and process solutions to reduce epoxy exclusion zone; Adopted design solutions into substrate Design Rule

Ph.D., Materials Science & Engineering

Ms, Polymer Engineering

Ms, Polymer Chemistry

Bs, Chemistry