Sr. Principal Packaging Engineer
Current
Feb 2023 - Present
AeroLeads people directory · profile
Lejun Wang Email & Phone Number
Packaging Engineer at Allegro MicroSystems
at
Allegro MicroSystems
1 work email found
@analog.com
LinkedIn matched
✓ Verified May 2026
4 data sources
Profile completeness 100%
Current company
Role
Packaging Engineer at Allegro MicroSystems
Location
Wilmington, Massachusetts, United States
Who is Lejun Wang? Overview
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Quick answer
Lejun Wang is listed as Packaging Engineer at Allegro MicroSystems at Allegro MicroSystems, based in Wilmington, Massachusetts, United States. AeroLeads shows a work email signal at analog.com and a matched LinkedIn profile for Lejun Wang.
Lejun Wang previously worked as Sr. Principal Packaging Engineer at Allegro Microsystems and Semiconductor Packaging Engineer at Analog Devices. Lejun Wang holds Ph.D., Materials Science & Engineering from Georgia Institute Of Technology.
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Email format at Allegro MicroSystems
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{first}.{last}@analog.com
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Profile bio
About Lejun Wang
- 20+ years of experience in electronic packaging industry in NPI, Design for Manufacturability and Reliability (DFX), technology development, process characterization/qualification, statistical data analysis, structured problem solving, FMEA, PFA, CPI, DOE, SPC, and lean sigma manufacturing for mobile products and high reliability electronic modules in medical devices and CPU products.- 3 years of experience leading packaging NPI activities for Analog Devices’ MEMS and RF SiP products.- 7 years of experience leading packaging NPI activities for Qualcomm’s industry-leading cellular modem products, and continuously driving these products to thinner/smaller packages, by closely managing top assembly houses in planning and execution of Package Characterization and Qualification activities.- Extensive knowledge in electronic packaging processes including wafer bumping, die prep, flip chip attach, plasma, wire bond, molding, ball attach, SMT, and packaging materials including molding compound, underfill, flux and solder paste, conductive/non-conductive die attach material, and dam & fill encapsulant.
Listed skills include Electronics Packaging, Design For Six Sigma Black Belt, Lean Sigma Green Belt, Doe, and 19 others.
Current workplace
Lejun Wang's current company
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6 roles
Lejun Wang work experience
A career timeline built from the work history available for this profile.
Semiconductor Packaging Engineer
Led packaging NPI activities for Analog Devices’ MEMS Gyroscope and Accelerometer and RF SiP products.
Aug 2019 - Feb 2023
Sr. Staff Engineer
Led packaging NPI activities for Qualcomm’s industry-leading cellular modem products to ensure new products meet assembly yield (> 99.5%) and reliability targets.Driven package technology development that enables modem product roadmap going thinner/smaller generation after generation, with package thickness reduced by 46% and size by 36%.Led or.
May 2012 - Aug 2019
Sr. Principal Packaging Engineer
Led a cross-functional team to successfully resolve assembly issues of an asymmetric surface mountable transformer in SMT process under tight schedule - Utilized tools that include Surface Evolver, finite element analysis, and digital image correlation to quickly identify root cause and determine solution paths. - Improved assembly yield of the transformer.
Feb 2011 - May 2012
Principal Process Engineer
Led development activities to replace legacy chip and wire assembly line with new high power lean line to achieve size reduction, cost reduction, and reliability improvement. - Developed new processes that include transfer molding and ion free plasma, down-selected new material sets that include epoxy molding compounds, conductive and non-conductive die.
Oct 2003 - Feb 2011
Senior Engineer
Led underfill process development for packaging Intel’s next generation CPU, chip set, and network processor products.- Developed a high yield underfill process that is High Volume Manufacturing friendly and with 40% of UPH improvement over previous generation process.- Managed smooth technology transfer to multiple Virtual Factory sites by ensuring Copy.
May 2001 - Oct 2003
4 education records
Lejun Wang education
Ph.D., Materials Science & Engineering
Georgia Institute Of Technology
Ms, Polymer Engineering
Georgia Institute Of Technology
Ms, Polymer Chemistry
Peking University
Bs, Chemistry
Peking University
FAQ
Frequently asked questions about Lejun Wang
Quick answers generated from the profile data available on this page.
What company does Lejun Wang work for?
Lejun Wang works for Allegro MicroSystems.
What is Lejun Wang's role at Allegro MicroSystems?
Lejun Wang is listed as Packaging Engineer at Allegro MicroSystems at Allegro MicroSystems.
What is Lejun Wang's email address?
AeroLeads has found 1 work email signal at @analog.com for Lejun Wang at Allegro MicroSystems.
Where is Lejun Wang based?
Lejun Wang is based in Wilmington, Massachusetts, United States while working with Allegro MicroSystems.
What companies has Lejun Wang worked for?
Lejun Wang has worked for Allegro Microsystems, Analog Devices, Qualcomm, Medtronic, and Intel Corporation.
How can I contact Lejun Wang?
You can use AeroLeads to view verified contact signals for Lejun Wang at Allegro MicroSystems, including work email, phone, and LinkedIn data when available.
What schools did Lejun Wang attend?
Lejun Wang holds Ph.D., Materials Science & Engineering from Georgia Institute Of Technology.
What skills is Lejun Wang known for?
Lejun Wang is listed with skills including Electronics Packaging, Design For Six Sigma Black Belt, Lean Sigma Green Belt, Doe, Spc, Fmea, Csp, and Characterization.
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