Product Development Engineer- Product Engineer of TI Automotive new products. Responsible for new product AT RTP(release to production) and RTM(release to market).. Define and initiate projects, and assign resources to manage cost, schedule and performance of component projects. . Test board design for qualification(HTOL/HAST/PTC/ESD/Latchup...)Product Test Engineer- Test yield and productivity improvement. Develop and optimize test board(BIB) and improve test repeatibility, reproducibility and yield.. Develop and optimize test and diagnostic programs, test fixtures and equipment for chips.. Capable for VLCT, IFLEX programming.. Coordinate Fab, Assembly, Test, Designer, Planner and Sales team for process, AT productivity/ quality improvement- Data Analysis Tool Development. Lead new tool development team and design TI internal data analysis tool.. Base on VBA and SQL database to develope 1. Failure Analysis Tool(Test Yield, Top Failure, S2S, T2T, Wafer2Wafer analysis). 2. Rescreen Rate Analysis Tool. 3. Yield Outlier Analysis Tool. 4. Cost Saving Calaulation Tool.- Trainer for Data analysis course in TI. Responsible for TIBCO Spotfire training program.. Develop training plan and material for TI internal training.. Trained more than hundred engineers in TI.- Research and Publish Technical Paper. Published “CC110x Family Device SSR Improvement by DIB Re-design ” choosen for TI engineer symposium conference 2012.~ Oct 2012. Published “GainBackRate Analysis Tool ” Win TI engineer symposium conference 2011Best Paper Award.~ Oct 2011. Published “TTR and Capacity Improvement for LPRF CC253X by LT elimination” and submitted TI technical paper.~ Jul 2010. Published “Device Dash Board Analysis Tool” and submitted TI technical paper.~ Feb 2009. Published “Thermal Kit verification solution for LH4 handler” and submitted TI technical paper.~ Jul 2009
Listed skills include Mixed Signal, Project Management, Product Development, Debugging, and 23 others.