A start up developer and manufacturer of a line of extremely low power, ultrasonic 3D-sensing solutions for consumer electronics, smart homes, industrial automation, and much more. Located in downtown Berkeley near the UC Berkeley campus. • Developed and executed product reliability plan to provide the engineering team product a look at their product’s reliability performance. • Sourced local reliability test vendors that can provide and execute reliability plan. Identified vendors who can provide timely execution, and cost effective for Chirp.• Designed and developed HTOL (high temperature operating life) and THB (Temperature Humidity Bias) circuits with local reliability vendors; worked with designers to develop product firmware that would set the product in the desired dynamic burn-in configuration.• Defined ESD-HBM and latch-up testing for Chirp’s product. Coordinated with local reliability vendor in executing tests.• Analyzed and reported reliability results for HTOL, Pre-Conditioning, Unbiased HAST (highly-accelerated temperature/humidity stress testing), HTSL (high temperature storage life).• Performed failure analysis to determine root cause of analysis of any reliability and functional anomalies. Recommended tests and tools, implemented and executed them, reported results and recommendations.• Characterized process and design variations of the product using bench tools; provided graphical reports, as well as statistical analysis using JMP and EXCEL.• Identified and sourced contractor test technician that could test customer samples, characterization and reliability units in house. Resulted in timely feedback in test performance and test results, and keeping milestones on track. Also provided a cost and logistical savings over distantly-located test houses.• Identified and sourced local assembly houses that can provide timely delivery and cost effective.

Seeking opportunities as a Product Engineering Manager or Program / Project Manager. I'm an experienced semiconductor professional with more than 10 years experience in New Product Introduction (NPI), Program Management, Product Sustaining, Yield Improvement, and Cost Reduction. Experienced in ATE and bench characterization, qualification and reliability, and yield/data analysis. I have a great track record of managing and successfully completing multiple projects, and known to be a mentor and coach to many engineers.

Directed staff of 11 engineers and technicians to develop and manage introduction of new products to market. Technical and logistical leadership in evaluation, characterization, and failure analysis activities. Led cross-functional teams in developing and managing project execution plans, including critical path milestones, project budget to meet time to market deadlines. Identified risks, implemented mitigation plans, chaired monthly project status reviews with senior management and key stakeholders.• Developed initial project cost estimates and key milestones for new projects.• Managed all project teams; ensured projects were on track, deliverables met, and drove closure to critical path items.• Established standardization of characterization methods, statistical analysis, problem solving, tools and resources.• Managed NPI activities of offshore manufacturing product and test engineers.• Increased new product development pipeline by expanding technical skill sets of offshore product and test engineers to independently lead new product development activities.• Advised engineers on AC and DC bench measurement methods.• Initiated and developed automated bench set up using LabView to evaluate silicon in a reduced time.• Drove and advised on FA activities in root cause determination on mature or new products. Communicated with customers on progress and any corrective actions.• Provided additional characterization support on internal mature, new, and competitors' products.• Initiated and implemented cost improvement initiatives in yield, test time, and inventory management.• Established annual capital and spending budget. Managed spending to within +/-5% of budget plan.• Established and qualified external vendors for PCB manufacturing and assembly, local package assembly, and physical analysis.

Managed the NPI development and release DAC products and met aggressive development milestones. Performed 1st silicon evaluation, characterization, data analysis, qualification, and production and sales ramp-up. Initiated and implemented yield enhancement and cost reduction projects.• Managed and introduced industry’s first digital potentiometers, widely used in programmable gain and tolerance matching applications.• Managed and introduced family of complete 12-bit DACs with built-in voltage references.• Managed and timely introduced multi-channel DACs for key monitor and display customer.• Characterized, qualified, and introduced company’s first precision DACs fabricated in external foundries.• Led characterization and qualification activities for process node development, fab transfers, and package assembly.• Reduced full factory cost and improved gross margins with probe removal, test time reductions, and inventory management.• Improved time to market with development of LabView-based bench evaluation system for data converters, reducing time to declare final silicon.• Expanded the technical expertise of offshore test and product engineers in the evaluation and characterization of digital-to-analog converters, brought offshore capability to independently characterize and analyze maverick lots and customer returns.• As interim applications engineer, generated datasheet graphs, fielded inquiries from sales and customers, maintained technical customer support for product line, to ensure future customer orders on upcoming customer applications.

Responsible for product maintenance, yield sustaining and yield improvement of newly released and mature products. Initiated and completed cost improvement projects in fab, assembly, and test.• Performed cost reduction activities in product redesign, test time reduction, and die inventory management and reduction.• Used data analysis, die-level and package level debugging tools to troubleshoot and determine root cause of low yield or product performance.• Performed die-level probing to determine problem areas of a circuit. Also implemented many other FA techniques to determine root cause.

Managed line yield for military and aerospace customers to meet committed delivery dates. Reviewed customer drawing requirements and determined feasibility to accept new business, performed a mini characterization if needed. Created custom manufacturing flows for military customers.

Designed and prototyped signal conditioning modules for military applications. Led and managed projects locally and across remote locations.