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Li Michael Email & Phone Number

Hardware Engineer at 莫仕公司
Location: San Francisco Bay Area, United States 5 work roles 1 school
1 work email found @tyco.com LinkedIn matched
✓ Verified August 2026 4 data sources Profile completeness 86%

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Work email l****@tyco.com
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Current company
Role
Hardware Engineer
Location
San Francisco Bay Area, United States
Company size

Who is Li Michael? Overview

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Quick answer

Li Michael is listed as Hardware Engineer at 莫仕公司, a with 10 employees, based in San Francisco Bay Area, United States. AeroLeads shows a work email signal at tyco.com and a matched LinkedIn profile for Li Michael.

Li Michael previously worked as SE/Sr hardware engineer at 泰科国际 and SE/Sr hardware enginner at 富士康. Li Michael holds Bachelor Of Science (B.S.), Computing&Automation from Dalian Maritime University.

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{first_initial}{last}@tyco.com
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Profile bio

About Li Michael

Dedicated and motivated professional with a strong background in network/consumer product design and Product Line Development. Years of successful R&D experience on designing telecom-datacom and consumer products, working with international cross-functional teams. Consistently recognized for outstanding contributions and solid reputation for resolving complex technical issues. Commended for efficient skills.AREAS OF EXPERTISE analog/digital/passive RF/simulation Power/Signal integrity Huawei/Foxconn/TE(Tyco)product  Home Security sys/sensor Intel Server/tablet Android tablet Switch/router Optical Amplifier/GPON  RFQ & Quotation Process Training & Team Building Trouble-shooting Document ODM/OEM

Current workplace

Li Michael's current company

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莫仕公司
莫仕公司
Hardware Engineer
2222 Wellington Court, Lisle, IL 60532, us
Website
Employees
10
AeroLeads page
5 roles · 31 years

Li Michael work experience

A career timeline built from the work history available for this profile.

Hardware Engineer

Current

Lisle, Il, Us

1) Analog design, uV level noise remove, filter design, complex impedance match. 2) ADS simulation, Spice simulation.3) Spec/Architecture design, Schematic review and layout review of products, tough issue fix.4) Analog: ROADM/EDFA/OTDR/COPM product line (line card/pizza box/Module). optical-electrical products.5) Meet special EMC/Surge compliance requirement, and tele GR-1089 GR-63.6) Customer support/sales support7) Good mechanical sense to improve product8) ODM for Cisco/Juniper/Google/BaBa/Ciena etc.

Apr 2015 - Present

Se/Sr Hardware Engineer

Cork, Ie

1) Designed and developed successful rugged design Tablets and AIO Touch Products. From concept to mass production including spec/schematic capture/layout guide/test/production/doc2) Designed high speed and RF (NFC Zwave WiFi BT 2g/3g/4g) circuits/antenna/EMI. 3) Implemented Signal/power integrity.4) Implemented RF simulation using ADS.5) Built sample wireless battery charger. >5W.6) Collaborated with cross functional teams and consistently meet specified deadlines7) Engaged closely with customers in all different verticals and segments, including Enterprise, Service Providers, identified business opportunities, provided customized solutions.8) Documents of Design Spec, test plan, function/reliability/environment/package requirements. Drove ODM procedure.

2012 - 2015 ~3 yrs

Se/Sr Hardware Enginner

Us

1) Designed home security Android tablet and DW/motion sensors. From concept to mass production. This home security system has features of Zwave/Zigbee green power, GSM module, Wifi.2) Implemented RF circuit, PCB design criteria, shielding.3) RF/Antenna design for home security ISM band, Zwave, Wifi, etc.4) Implemented Signal/power integrity.5) Implemented RF simulation using ADS.6) Involved in design of Broadcom switch and HP server.7) Researched home security sensors and built product lines.8) Trained engineers to develop and support product.9) Collaborated with customers and technical teams to develop customized solutions 10) Assisted with product field trials, and gathered customer feedback

2010 - 2012 ~2 yrs

Sr Hardware Engineer

Memphis, Tennessee, Us

1) Designed x86 platform embedded products for Agilent test instruments, from schematic to manufacturing, fixed bugs like power leakage, power sequence, timing, interrupt collision. etc.2) Designed Carrier boards products: ETX and com-express motherboards, with feature of 20+ layers PCB. -40~80C working condition.3) Implemented Signal integrity/ Power integrity: SATA/PCIe/DDR/CLOCK high speed signals, differential signals, PCB stack-up, power/signal EMI.

2010 - 2010

Se/Sr Hardware Engineer

Shenzhen, Guangdong, Cn

Served as a key player or team leader for telecom-datacom network, switch/router, 2g/3g, EDFA/GPON/EPON.1) Implemented Hong Kong and Pakistan 3G wireless network transmission projects, used GPON to optimize synchronous clock system design. 3G wireless network application research. Initiator of 3G monitoring network in China.2) Designed line cards (1channel/4channel) for BPOP/GPON OLTs of three versions, used technology of 10GEth Switch and 1000Mbase-t/10g backplane (Seders/CDR). It is the No.1 product on optical network market. Have key patents in GPON/EPON.4) Designed high-density high speed backplane (14layers+/8mm+), including the first Giga-tech Backplane in China (96*2*2Gbps), 1G/10G Ethernet technology, 16*4*10Gbps totally. Simulation and test work involved. The backplane is used in multiple switch/router products. 5) Designed line cards (E1/T1E3/T3 SDH/SONET) for Router (GSR)/ATM switch (Radium 8750/8350)6) Designed Access sever structure line card, revised radius server using c in UNIX, The product can connect 12000 users, occupied 90% market in Asia, deployed >10,1000,1000 ports.7) Researched High speed transmission technology (Geth and fibre channel) in research group: up to 3.125Gbps-10.3Gbps, min 17Ps rise time. Including research of transmission line/PCB material/signal integrity/TDR/simulation, designed high-speed signal generator (BERT) for transmission line test and loop back test to get eye patterns and error rates for ATM switch. Maintained strong experiences in Signal integrity based on actual experiments for high speed.8) Key designer for Multi-wave Laser Source, MWLS handles 40Gbps optical data transmission, Low noise compact design, includes daughter cards of integrated EDFA, high power EDFA, DFB driver, Display, LD/PD/TEC controller. Designed EDFA and RAMAN laser drivers. Including analog version (using analog circuit for mathematic calculation) and digital version.

1996 - 2009 ~13 yrs
Team & coworkers

Colleagues at 莫仕公司

Other employees you can reach at molex.com. View company contacts for 10 employees →

1 education record

Li Michael education

  • Dalian Maritime University
    Dalian Maritime University
    Computing&Automation
FAQ

Frequently asked questions about Li Michael

Quick answers generated from the profile data available on this page.

What company does Li Michael work for?

Li Michael works for 莫仕公司.

What is Li Michael's role at 莫仕公司?

Li Michael is listed as Hardware Engineer at 莫仕公司.

What is Li Michael's email address?

AeroLeads has found 1 work email signal at @tyco.com for Li Michael at 莫仕公司.

Where is Li Michael based?

Li Michael is based in San Francisco Bay Area, United States while working with 莫仕公司.

What companies has Li Michael worked for?

Li Michael has worked for 莫仕公司, 泰科国际, 富士康, Ampro Industries, Incorporated, and 华为.

Who are Li Michael's colleagues at 莫仕公司?

Li Michael's colleagues at 莫仕公司 include Peter Oida, Derrick Felkins, Jennifer Cline, Susan Armitage, and Dio Ronnie.

How can I contact Li Michael?

You can use AeroLeads to view verified contact signals for Li Michael at 莫仕公司, including work email, phone, and LinkedIn data when available.

What schools did Li Michael attend?

Li Michael holds Bachelor Of Science (B.S.), Computing&Automation from Dalian Maritime University.

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