+ R&D, Materials Science, Innovation, Strategy, Power Electronics Packaging and Reliability, Joining technologies; Diffusion bonding/Brazing, Thin Films, Intermetallic, Alloy design+ PhD in Science with extensive experience in R&D in the field of solid state physics, joining technologies and packaging of power electronics. + Experienced as R&D project leader.+ Dynamic, spontaneous and energetic individual with a forward oriented drive. + Versatile team player with solid soft skills and management capabilities.+ Distinguished communication and interpersonal skills, adept at dealing with a wide range of stakeholders, conveying business needs to technical teams and presenting analysis and recommendations to management.+ Analytical strength with ability to structure and articulate complex matters in easily understandable terms.+ Ability to get into new engineering topics in very short amount of time.+ 30+ publications in different areas: materials science, thin films, joining technologies, phase diagrams and packaging and reliability of power electronics.
Listed skills include Materials Science, Nanotechnology, Characterization, R&D, and 14 others.