Liew Choon Seng Email & Phone Number

Ipoh, Perak, Malaysia

• Packaging Engineering & NPI 1. Work with Packaging engineering and suppliers in establishing new technologies, products, processes & materials qualification.2. Successfully developed main key products for major mobile communication customers, with multi-million units / dollars produced, which are major revenue contributors.- 0.45mm / 0.43mm / 0.40mm / 0.33mm max QFN- 0.45mm / 0.33mm max MIS- MCMs (wire bond and flip chip version with SMT components)3. Managed smooth NPI builds, pre-production and ramp up production for diversified new products. Completed safe launch on new QFNs, MIS and MCMs into production mode, which contributed high revenues.4. Implementation of 0.8mils & 0.9mils Copper wire development and devices conversion with total cost saving of more than USD$500K.5. Managed product / process / materials improvement for improved performance and robustness.• Quality & Operation Engineering6. Drive and manage activities for assembly, quality & operation including quality excursions, engineering issues resolution and assembly yield.7. Drive quality and engineering improvements on product / process / material.8. Resolve customer / quality complaints, including root cause investigation, CAPA & fan-out lessons learnt. 9. Carry out suppliers’ audit & customers’ audits.10. Work with cross-functional teams and suppliers on disposition of lots with low yield / quality issues. 11. Managed PCNs (change management) & PPAP activities related to suppliers and CCB approval. 12. Work with Product/Test Engineering on improvement activities which are related to quality & engineering.• Suppliers Management13. Monitoring of suppliers’ performances, weekly/monthly Yield, KPIs, Cost Saving, Operation Review reports and Quarterly Business Review. Managing various OSATs across Asia region with good performances.

Penang, Malaysia

• An award recognition was received for new launched of QFN product for major customers, generated substantial revenue to Business Unit with millions of units produced - Resolved technical challenges in wire bonding process & package design. • Lead Delamination Improvement for Micropak product - Recommended solutions (package design, process and material improvement) achieved zero delamination.• Total cost saving approximated US$300K in the development of High Density QFN Package Program to utilize /enhance existing equipment sets to minimize huge capital investment.• MSL 1 no delamination up to QFN 5x5 with new Roughening Technology Program in QFN Package.

Ipoh, Perak, Malaysia

• Cost saving approximated 15% - 25% of wire cost depend on wire usage.in Copper Wire Bonding development, qualification and pre-production in QFN package. • Wafer Level Chip Scale Package (WLCSP) – established new product / processes / materials qualification; production capability and manufacturing systems consist of Build sheet system, Wafer map system & Lots movement systems. Qualification of new WLCSP and Flip Chip customers with new businesses contribution of multi-million dollars.• Set-up Unisem Chengdu QFN Package Process Module Line for qualification which brought in new businesses grow to Unisem.• Nickel-Palladium Pre-plated Package Technology for QFNs and Leaded packages. • Champion of plant-wide low-cost green mold compound qualification (cost saving program) and new mold compounds for Sumitomo to obsolete LSA (Low Stress Additive) compounds.• High thermal die-attach epoxy qualification for improved process yield and reliability in QFN package.

Ipoh, Perak, Malaysia

• Enhanced package reliability to meet MSL 1 at 260°C by using special lead-frame treatment technology.• Developed copper wire bond technology of 1.5mils & 2.0mils in TSSOP, SOIC (N) and TO-263 packages. Savings approximated 15% - 25% of wire cost depend on wire usage.• Development of 24L SSOP, 8L SOIC(N) Hi Density, 8L PDIP Hi Density, 16L PDIP Matrix/Hi Density from package design to mass production mode, including equipment set-up and material set qualification. This contributed to additional line capacity and business to the company.• Champion of plant-wide green material set qualification.• High reliability in large QFN Package with die-attach and mold compound improvement. • Champion of green mold-compound qualification with change of supplier's manufacturing site.• Designed over 50 lead frame and substrate designs for new package development, to meet various customers' product requirements and process improvement.• Qualification of FAIs on new open and closed tooling of lead frames and substrates.

Ipoh, Perak, Malaysia

• Established substrate design and qualification for Small Scale Ball Grid Array – Wire Bond and Flip Chip Packages.• Champion of substrate suppliers' qualification program, including setup of substrate inspection, buy-off & qualification criteria/specification.• Champion of thermal enhanced product development in SOIC (N) and SOP packages.• Champion of dam and fill liquid encapsulation process development for CSP-BGA.