Howard Lee Email & Phone Number

Pudong, Shanghai, China

In this role as a Reliability Lab Test Engineer at Apple's Shanghai facility, the focus is on ensuring the durability and reliability of key products such as the iPhone, iPad, and Apple Watch display modules. This position plays a critical part in the development of robust Apple products by identifying potential improvements through comprehensive environmental and aging tests.• Collaboration with Engineers for Reliability Tests: Work alongside engineering teams to conduct comprehensive reliability testing on Apple's iPhone, iPad, and Apple Watch display modules, ensuring these products meet the company's high standards for durability and functionality.• Calibration and Maintenance of Lab Testing Equipment: Regular calibration and maintenance of sophisticated lab equipment are crucial for accurate testing of environmental conditions and aging processes, affecting the longevity of display modules.• Reporting and Analyzing Test Results: Meticulously document test findings and conduct in-depth analyses to identify potential areas for improvement, ensuring display modules withstand various environmental challenges over time.• Supporting Failure Analysis Investigations: Actively participate in investigating and diagnosing failures in display modules, contributing to the development of more robust Apple products.• Managing Lab Logistics and Equipment Inventory: Oversee the logistics of the lab's operations, including the organization and tracking of equipment inventory, to maintain an efficient testing environment for environmental and aging tests on display modules.

Pudong, Shanghai, China

Engaged as a technical engineer in the Reliability Engineering Department at Hisilicon Semiconductor, working on Networking Processor IC projects.• Responsible for data processing and analysis of test data from post-stress ATE tests, including V93K and UltraFlex, to identify ATE testing / reliability issues.• Conducted failure analysis on IC samples that failed reliability tests, utilizing techniques such as electron microscopy and spectroscopy to ascertain root causes.• Performed destructive physical analysis (DPA) on post-stress test IC samples to assess quality and reliability, documenting findings for future improvements.• Enhanced design, fabrication, and testing processes of IC products through detailed examination and analysis, contributing to higher quality standards.

Shanghai, China

As a Production Engineer focused on Quality Management at Lowe's, my role involved overseeing the quality of a wide array of seasonal products. These included outdoor living essentials like patio furniture and garden decor, seasonal holiday decorations spanning from Christmas to Fourth of July, and heating solutions such as fire pits and patio heaters. This position required ensuring these diverse product categories met Lowe's high standards for quality, safety, and customer satisfaction.• Quality Oversight: Ensured Lowe's quality standards were met for a variety of seasonal products, through audits and checks.• Problem-Solving: Addressed and resolved quality and production issues swiftly to prevent delays and maintain customer satisfaction with seasonal products.• Compliance and Ethics: Upheld ethical manufacturing and environmental standards, ensuring all vendor operations complied with Lowe's policies.• Cross-Functional Teamwork: Collaborated with procurement, product development, and logistics teams to synchronize manufacturing with seasonal sales plans, ensuring product readiness.• Efficiency Improvements: Optimized production processes to enhance efficiency and reduce waste, adapting quickly to seasonal demand changes.• Vendor Collaboration: Worked with vendors to improve product quality.

Pudongxin District, Shanghai, China

As an NPI Engineer at Fujikura, specializing in iPhone Display Module FPCA products, I was integral to the coordination and execution of product manufacturing in collaboration with Apple's TPM and Operations Team. My role focused on ensuring products met Apple's stringent quality standards prior to shipment, summarized as follows:• Collaboration with Apple: Worked closely with Apple's TPM and Ops Team for OK2Ship execution, fixture design, test equipment, and automation equipment validation across various processes including SMT, punching, and functional testing.• Process Implementation and Optimization: Led the setup of new processes, and drove operational metrics such as Yield and UPH to ensure readiness for full-scale production.• Continuous Improvement Meetings: Participated in NPI Sync, FA & Wrap meetings for the timely implementation of corrective actions, ensuring mechanical fixtures' readiness, and line layout optimization in alignment with Apple's requirements.• Quality Control and Testing: Developed OQC testing procedures and worked on FA with Apple's TPM to guarantee all products adhered to the high-quality standards expected by Apple.

Minhang District, Shanghai, China

As a Senior Engineer in the Technology Development and Industrialization (TDI) department at AT&S, my work revolved around Embedded Component Packaging (ECP) technology, playing a pivotal role in the innovation, qualification, and enhancement of embedded component processes and technologies. My tenure was marked by significant contributions to process optimization, technological advancements, and project leadership, driving improvements in production efficiency and product quality.• Spearheaded the evaluation and qualification of ECP technology, including the development of testing methods and failure analysis equipment, showcasing a blend of technical expertise and innovative problem-solving skills.• Led the development of an e-mapping system for automatic laser marking and sorting, which was successfully implemented for a leading brand's phone motherboards, marking a significant advancement in PCB manufacturing efficiency and traceability.• Played a key role in the development and improvement of high die-to-package ratio embedding technology, focusing on warpage control, which paved the way for serial production and set new industry standards.• Successfully innovated a 2-step ion milling method, overcoming the limitations of traditional ion milling techniques and enhancing the precision and quality of embedded components.• Initiated and led the development of a test method for RDL adhesion analysis, aiming for industry standardization and improvement in the reliability of embedded components.• Contributed significantly to the process improvement, equipment installation, and resolution of quality/process issues across a variety of projects, including IC substrate interposers and Substrate-Like PCBs (SLP), achieving remarkable improvements in production yield and operational efficiency.

Minhang District, Shanghai, China