IC project management for Baseband chipset IC of Intel, XG110, XG213, XG223, AG610, and Power Management chip of Maxim, MAX8939B.• Drive T-milestone (Key IC component project management) reviews.• Align Intel IC development schedule with Nokia engine/program development schedule.• Drive IC related quality issue in component development phase, support QDM (Quality and Development Manager) for quality planning, review and other activities.• Co-work with sourcing to ensure sample delivery on schedule.• Make sure all required deliveries from suppliers are delivered on time and fulfill Nokia's requirement.• Act as IC contact person between Nokia and suppliers (Intel, Maxim).• Align with suppliers and Nokia to solve chipset related issues.

LTU2 155 projectControl FPGA design of LTU2 155 board in Ericsson MiniLink products, including Implementation Proposal, Design Specification, FPGA development, Verification and Test. Cooperate with Tieto Sweden, Ericsson ETO, Ericsson ETH, and familiar with the development process of Ericsson.

1. Chip Solution Group. FPGA design and implementation of LTE MODEM Rx Symbol Level Process module in Xilinx Virtex-5 devices, integration test and on-board test.2. Chip Solution Group. FPGA and ASIC design and implementation of WCDMA Home Node-B E-DCH processing module in ALTERA Stratix II devices.3. IP Group. Got the SARFT Certificate of Network Access for SMT-1600C, supported the STB project team of Korea HQ, and developed the SIP software module for VoIP USB phone of SMT-1600C.4. IP Group. Wrote the China EPON investigation report. Surveyed the telecom operators and manufacturers of EPON devices. Made our suggestions for SAMSUNG Korea HQ.