Conduct fundamental research of reliability issues in 3D IC and nano-interconnects.Generate, develop and demonstrate novel ideas in the fields of reliability.Report both internally as well as externally, to peers, to imec partners and at international conferences. Supervise PhD and master students.Publish scientific papers in peer-reviewed journals.

Acted as unit process responsible for 200mm BEOL CMP processes, including metal (tungsten and copper) CMP, 3D TSV (front and backside) CMP, MEMS (oxide and SiGe) CMP and novel CMP applications (e.g. CMP for carbon nanotube integration in CMOS).Served as the connection between the process integration team and the process development team and provided reliability expertise to the CMP team.Correlated the copper CMP process parameters and the BEOL dielectric reliability and failure mechanisms.Coordinated, as project leader, two demo projects with industry partners to explore the applicability of their state-of-the-art metrology tools for 300mm Cu CMP inline monitoring applications.Demonstrated new CMP hardware accessories and CMP consumables for improving CMP process and reducing defectivity.Worked on screening and evaluating of new 300mm copper CMP post clean chemicals for advanced interconnect integration.Conducted electrochemical analysis for new CMP slurry and clean solution screening.

Worked as the key player in the IMEC silicon technology program “advanced Cu/low-k interconnect” to explore the reliability challenges when scaling the interconnect pitch and the k value of low-k dielectrics.--- Studied the failure physical mechanisms and statistics of CMOS BEOL low-k dielectric reliability for advanced technology nodes.--- Investigated the influence of materials, process steps and device layout on semiconductor BEOL dielectric reliability.--- Developed novel test methodologies for semiconductor BEOL reliability evaluation.--- Cooperated with universities on scientific research of BEOL material properties.--- Presented research progress reports to the industrial partners at the IMEC's Industrial Affiliation Program (IIAP) workshops.

Designed, demonstrated and patented an analog sun sensor for micro satellite gesture positioning using a photo-voltaic cell.