APT (atom probe tomography) characterization on semiconductor materials.

Irradiation Damage in Ni-based Alloys for Long-Term Light Water Reactor Applications• Investigate the microstructural changes and precipitation behavior in Ni-based alloys after thermal aging and irradiation to understand materials degradation in light water reactors.• Study the effects of irradiation dose, dose rate, and temperature on irradiation responses of Ni-based alloys to facilitate and verify the long-term prediction for neutron irradiation responses.• Experienced in… Show more Irradiation Damage in Ni-based Alloys for Long-Term Light Water Reactor Applications• Investigate the microstructural changes and precipitation behavior in Ni-based alloys after thermal aging and irradiation to understand materials degradation in light water reactors.• Study the effects of irradiation dose, dose rate, and temperature on irradiation responses of Ni-based alloys to facilitate and verify the long-term prediction for neutron irradiation responses.• Experienced in materials characterization techniques including atom probe tomography (APT), transmission electron microscopy (TEM)/scanning transmission electron microscopy (STEM), focused ion beam (FIB), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD). Show less

Mechanical Behavior of Ni3Sn4 in 3D IC Micro Joints• Analyzed the mechanical behavior of Ni3Sn4 by in-situ micropillar compression testing to understand the potential failure mechanism of 3D IC micro joints.• Examined the effects of different grain orientations on the deformation mechanism of Ni3Sn4 to improve the mechanical reliability of micro joints.

Overlay Analysis of Wafer Level Hybrid Bonding• Developed quantification methods for overlay analysis to improve the alignment accuracy of 12-inch wafer-level bonding.• Aided and participated in the process line of 12-inch wafer-level hybrid bonding in semiconductor fabrication plant (fab) to ensure the whole process functioned well.• Awarded merit award out of 200+ interns in the TSMC summer intern final competition.

Effect of Ti Addition on Sn-Ag Solder Microstructure and Interfacial Reaction with Ni/Au Plating• Assisted in development of Sn-Ag solders with fine grain structure using minor element alloying to improve their electromigration resistance.• Investigated the effect of Ti addition on solder microstructures and interfacial reaction with Ni/Au plating to understand the bonding behavior of ball grid array in electronic devices.