My name is Long. More than 15 years of experience in the design and development of notebook mechanical chassis from design concept to mass production. Excellent communication skills and analytical skills to verify products and clarify issues. Successfully launched new products to meet the marketing team needs of every generation.
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Mechanical Program ManagerHp Jan 2014 - Mar 2022Taipei City, Taiwan Worked with ODM/Architect team to design next-generation products to meet marketing requirements and enhance competition. Lead ODM partners to improve clamshell/education x360 related design to reduce system dimension/weight and enhance product quality. Cooperated with the CAE team to simulate a 32-inch drop test to enhance the corner structure for additional educational testing requirements. Worked with EE/ID/Thermal/Component teams to determine notebook layout/placement.… Show more Worked with ODM/Architect team to design next-generation products to meet marketing requirements and enhance competition. Lead ODM partners to improve clamshell/education x360 related design to reduce system dimension/weight and enhance product quality. Cooperated with the CAE team to simulate a 32-inch drop test to enhance the corner structure for additional educational testing requirements. Worked with EE/ID/Thermal/Component teams to determine notebook layout/placement. Worked with GTK tooling team to review DFM reports to modify related structures and enhance tooling designs. Collaborated with the Quality team to improve the products for the next generation to enhance the market share. Successfully implemented solutions to resolve mechanical, cosmetic, tooling, test, validation, factory assembly during design and manufacturing stages. In charged of the following mass production projects from design concept / prototype / tooling / factory assembly / validation / mass production. ProBook 470G2 project in Jul 2014. ProBook 470G3 project in Sep 2015. ProBook 450G4 project in Sep 2016. ProBook 430G5 project in Sep 2017. ProBook x360 11 G3/G4 EE project in Dec 2018. ProBook 440G8/640G8 project in Sep 2020. ProBook 440G9/45G9 & 640G9/650G9 project in Sep 2022. Show less -
Mechanical EngineerWistron May 2007 - Jan 2014New Taipei City, Taiwan Worked with EE/ID/Thermal/Component teams to meet customer’s requirement for system dimension/weight. Lead ME members to improve clamshell related design to enhance product quality. Worked with EE/ID/Thermal/Component teams to determine notebook layout/placement. Prototype to validate new notebook concepts. Worked with tool vendor to review DFM reports to modify related structures and enhance tooling designs. Collaborated with the Quality team to improve the products… Show more Worked with EE/ID/Thermal/Component teams to meet customer’s requirement for system dimension/weight. Lead ME members to improve clamshell related design to enhance product quality. Worked with EE/ID/Thermal/Component teams to determine notebook layout/placement. Prototype to validate new notebook concepts. Worked with tool vendor to review DFM reports to modify related structures and enhance tooling designs. Collaborated with the Quality team to improve the products for the next generation Successfully implemented solutions to resolve mechanical, cosmetic, tooling, test, validation, factory assembly during design and manufacturing stages. In charged of the following are the mass production projects from design concept / prototype / tooling / factory assembly / validation / mass production. Participated in 15" NB project of HP Game. (2008-2009). Participated in 17" NB project of HP ProBook. (2009-2010). Participated in 13" NB project of HP ProBook. (2010-2011). Participated in 14" NB project of HP ProBook. (2011-2012). Participated in 14" NB project of HP ProBook. (2012-2013). Show less -
Mechanical EngineerLiteon Technology Apr 2005 - May 2007New Taipei City, Taiwan Worked with cross-functional teams to determine A3 size scanner layout/placement. Prototype to validate new A3 size scanner concepts. Worked with tool vendor to review DFM reports to modify related structures and enhance tooling designs. Successfully implemented solutions to resolve mechanical, cosmetic, tooling, test, validation, factory assembly during design and manufacturing stages. Lead the project from design concept / prototype / tooling / factory assembly /… Show more Worked with cross-functional teams to determine A3 size scanner layout/placement. Prototype to validate new A3 size scanner concepts. Worked with tool vendor to review DFM reports to modify related structures and enhance tooling designs. Successfully implemented solutions to resolve mechanical, cosmetic, tooling, test, validation, factory assembly during design and manufacturing stages. Lead the project from design concept / prototype / tooling / factory assembly / validation. Completed tool sample build for A3 size scanner during DVT phase. Show less -
Thermal Module EngineerAsia Vital Components Co.,Ltd. Dec 2002 - Apr 2005New Taipei City, Taiwan Worked with Quanta ME teams to determine thermal module placement. Prototype to validate new thermal module concepts. Worked with fan vendor to review fan P-Q curve performance to modify fan structures and enhance P-Q performance. In charged the following mass production projects from design concept / prototype / tooling / factory assembly / validation / mass production. Participated in Acer Aspire Notebook thermal module with Quanta ME team. Participated… Show more Worked with Quanta ME teams to determine thermal module placement. Prototype to validate new thermal module concepts. Worked with fan vendor to review fan P-Q curve performance to modify fan structures and enhance P-Q performance. In charged the following mass production projects from design concept / prototype / tooling / factory assembly / validation / mass production. Participated in Acer Aspire Notebook thermal module with Quanta ME team. Participated in NEC Notebook thermal module with Quanta ME team. Show less -
Thermal Module EngineerRobin Source International Co., Ltd Feb 2002 - Dec 2002New Taipei City, Taiwan Worked with Quanta ME teams to determine thermal module placement. Prototype to validate new thermal module concepts.
Frequently Asked Questions about Long Chen
What is Long Chen's role at the current company?
Long Chen's current role is Business Development.
What schools did Long Chen attend?
Long Chen attended 國立臺灣科技大學, 中華科技大學.
Not the Long Chen you were looking for?
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Xin Long Chen
German Language | Java | System Analysis | Cross-Disciplinary Learning | Aws PractitionerTaipei -
Long Chen
“Readiness To Adapt To Change, And Approaching Work As A Source Of Both Challenge And Fun”Taipei1live.com -
1yahoo.com
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1tmu.edu.tw
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