I am reliability, ESD and CPI (Chip-Package Interaction) Technical Director for Smart Power Technologies and fellow of the Technical Staff at STMicroelectronics. I received my M.Sc. degree in telecommunication engineering at the "Politecnico di Milano" Technical University in 1998, discussing a thesis on a CdZnTe cross-connect for optical networks. Since 2000, I have worked in STMicroelectronics in the ESD protections development team for Smart power technologies. I have lead the group responsible for ESD protections development, Latch-up immunity and bipolar parasitic analysis in BCD processes for about 15 years and represented STMicroelectronics in the ESDA standardization committees. Starting from 2016 I have served as member of the ESDA Technical and Advisory Support Committee (TAS), ESDA Board of Directors and acted as co-chair of the Standards BU.I served multiple times as a member of the ESREF, ICICDT, IRPS, IEW, and EOS/ESD Symposium Technical Program Committees and authored several papers on ESD and EDA topics. I was General Chair at the 2020 EOS/ESD symposium.Since 2022 I have been leading the team responsible for the qualification of BCD technologies in STMicroelectronics.